Making Sense of Effective Bits in Oscilloscope Measurements
... Tektronix DPO70000B and the Agilent DSO90000A. The bandwidth was limited to 13GHz on the Tektronix instrument to match the Agilent maximum bandwidth. This plot shows the baseline noise at many settings, so that it is possible to see how the baseline noise as a % of full-screen changes as a function ...
... Tektronix DPO70000B and the Agilent DSO90000A. The bandwidth was limited to 13GHz on the Tektronix instrument to match the Agilent maximum bandwidth. This plot shows the baseline noise at many settings, so that it is possible to see how the baseline noise as a % of full-screen changes as a function ...
Discussion on lightning impulse test procedure
... during impulse testing, we could possibly determine our required energy with a little more precision. I believe the manufacturers would have a case for arguing that they only need to guarantee a 40 us tail. Also, I believe that the "optimistic" results that would be obtained by using a 100 % voltage ...
... during impulse testing, we could possibly determine our required energy with a little more precision. I believe the manufacturers would have a case for arguing that they only need to guarantee a 40 us tail. Also, I believe that the "optimistic" results that would be obtained by using a 100 % voltage ...
Test Plan1
... When: This step needs to be completed before detailed design review in order to determine possible number of identifiable locations. 1.4 Read Range and Tags Each type of Tag should be tested for maximum read range. How: Use the RFID Reader system and test each tag type separately. Different orientat ...
... When: This step needs to be completed before detailed design review in order to determine possible number of identifiable locations. 1.4 Read Range and Tags Each type of Tag should be tested for maximum read range. How: Use the RFID Reader system and test each tag type separately. Different orientat ...
Dual Schmitt-Trigger Buffer (Rev. B)
... applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask ...
... applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask ...
Electrical and mechanical accessories
... Compact NS and Vigicompact NS devices with two, three or four poles may be installed in individual enclosures. All fixed, front connections are possible, except right-angle and edgewise terminal extensions. Spreaders may be installed in the enclosures intended for Interpact Compact and Vigicompact N ...
... Compact NS and Vigicompact NS devices with two, three or four poles may be installed in individual enclosures. All fixed, front connections are possible, except right-angle and edgewise terminal extensions. Spreaders may be installed in the enclosures intended for Interpact Compact and Vigicompact N ...
MAX3243-EP - Texas Instruments
... (HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. This combination of drivers and receivers matches that ne ...
... (HBM) protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. This combination of drivers and receivers matches that ne ...
bq20z40/45/60/65 Printed-Circuit Board Layout
... obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the speci ...
... obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the speci ...
STANDARDIZATION OF THE LEEB HARDNESS TESTING METHOD
... measured by rebound and Rockwell test. To carry out the measurement it is necessary to select the appropriate material group in order to ensure a correct conversion into the selected hardness scale. Conversion tables for the common hardness scales are given in the ASTM E 140 or DIN 50 150 standard. ...
... measured by rebound and Rockwell test. To carry out the measurement it is necessary to select the appropriate material group in order to ensure a correct conversion into the selected hardness scale. Conversion tables for the common hardness scales are given in the ASTM E 140 or DIN 50 150 standard. ...
Single-Chip HID USB to SMBus Master Bridge CP2112 Data Sheet
... oscillator, and a one-time programmable ROM in a compact 4 x 4 mm QFN-24 package (sometimes called “MLF” or “MLP”). The on-chip, one-time programmable ROM provides the option to customize the USB Vendor ID, Product ID, Manufacturer Product String, Product Description String, Power Descriptor, Device ...
... oscillator, and a one-time programmable ROM in a compact 4 x 4 mm QFN-24 package (sometimes called “MLF” or “MLP”). The on-chip, one-time programmable ROM provides the option to customize the USB Vendor ID, Product ID, Manufacturer Product String, Product Description String, Power Descriptor, Device ...
488 Method For Fabricating Thin Film Structures With Negative
... The intention of this invention is to realize negative inductance as one truly passive component that so far can only be synthesized or simulated using more complex electronic circuits. A method for fabricating negative micro inductor has been introduced, actual devices have been fabricated and test ...
... The intention of this invention is to realize negative inductance as one truly passive component that so far can only be synthesized or simulated using more complex electronic circuits. A method for fabricating negative micro inductor has been introduced, actual devices have been fabricated and test ...
SN65HVD178x Fault-Protected RS-485
... half-duplex (two-wire bus) communication. This port features a wide commonmode voltage range, making the devices suitable for multipoint applications over long cable runs. These devices are characterized from –40°C to 125°C. These devices are pin-compatible with the industrystandard SN75176 transcei ...
... half-duplex (two-wire bus) communication. This port features a wide commonmode voltage range, making the devices suitable for multipoint applications over long cable runs. These devices are characterized from –40°C to 125°C. These devices are pin-compatible with the industrystandard SN75176 transcei ...
S270-21-1 (Discontinued)
... val of the backup device. For this reason, it must always be used in series with a fault-interrupting backup protective reclosing device. Also, it will reset counts that do not reach the counts-to-open setting within the selected reset time due to clearing of temporary faults. A minimum of 0.5 amps ...
... val of the backup device. For this reason, it must always be used in series with a fault-interrupting backup protective reclosing device. Also, it will reset counts that do not reach the counts-to-open setting within the selected reset time due to clearing of temporary faults. A minimum of 0.5 amps ...
MRF373ALR1, MRF373ALSR1 470-860 MHz, 75 W, 32 V Lateral N
... implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes witho ...
... implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes witho ...
Datasheet
... coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purp ...
... coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purp ...
3 Abbreviations, Acronyms, AND definitions
... 1. For Tip-to-Ring, connect the CPE as shown in Figure 3, measure DC current and voltage then calculate the resistance of the CPE. 2. For Tip with Ring grounded, Ring with Tip grounded , connect the CPE as shown in, Figure 4 3. Measure the DC current and voltage then calculate the resistance of the ...
... 1. For Tip-to-Ring, connect the CPE as shown in Figure 3, measure DC current and voltage then calculate the resistance of the CPE. 2. For Tip with Ring grounded, Ring with Tip grounded , connect the CPE as shown in, Figure 4 3. Measure the DC current and voltage then calculate the resistance of the ...
RunIIb_QA_v4.0 - Physik
... its corroboration of the vendor QA data. The subset tests are nearly all done in automatic probe stations under computer program control. 3. Diagnostic Tests: The silicon sensor diagnostic tests are routinely performed on a fraction of sensors selected at random from those passing the key tests, con ...
... its corroboration of the vendor QA data. The subset tests are nearly all done in automatic probe stations under computer program control. 3. Diagnostic Tests: The silicon sensor diagnostic tests are routinely performed on a fraction of sensors selected at random from those passing the key tests, con ...
TUSB2077A 数据资料 dataSheet 下载
... of the DP0 pullup resistor disable terminal, DP0PUR, makes it much easier to implement an onboard bus/self-power dynamic-switching circuitry. The three LED indicator control output terminals also enable the implementation of visualized status monitoring of the hub and its downstream ports. With thes ...
... of the DP0 pullup resistor disable terminal, DP0PUR, makes it much easier to implement an onboard bus/self-power dynamic-switching circuitry. The three LED indicator control output terminals also enable the implementation of visualized status monitoring of the hub and its downstream ports. With thes ...
LMH664x 2.7 V, 650 uA, 55 MHz, Rail-to
... than 50 μA. Both turn-on and turn-off characteristics are well behaved with minimal output fluctuations during transitions. This allows the part to be used in power saving mode, as well as multiplexing applications. Miniature packages (SOT-23, VSSOP-8, and SOIC-8) are further means to ease the adopt ...
... than 50 μA. Both turn-on and turn-off characteristics are well behaved with minimal output fluctuations during transitions. This allows the part to be used in power saving mode, as well as multiplexing applications. Miniature packages (SOT-23, VSSOP-8, and SOIC-8) are further means to ease the adopt ...
Automatic test equipment
Automatic or automated test equipment (ATE) is any apparatus that performs tests on a device, known as the Device Under Test (DUT), Equipment Under Test (EUT) or Unit Under Test (UUT), using automation to quickly perform measurements and evaluate the test results. An ATE can be a simple computer controlled digital multimeter, or a complicated system containing dozens of complex test instruments (real or simulated electronic test equipment) capable of automatically testing and diagnosing faults in sophisticated electronic packaged parts or on Wafer testing, including System-On-Chips and Integrated circuits.