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Transcript
1.2V Drive Nch + Nch MOSFET
UM6K33N
Structure
Silicon N-channel MOSFET
Dimensions (Unit : mm)
UMT6
(SC-88)
<SOT-363>
Features
1) High speed switing.
2) Small package(UMT6).
3) Ultra low voltage drive(1.2V drive).
(6)
(1)
(5)
(2)
(4)
(3)
Application
Switching
Abbreviated symbol : K33
Packaging specifications
Package
Type
Code
Basic ordering unit (pieces)
UM6K33N
Inner circuit
Taping
TN
3000

(6)
∗2
∗2

∗1
(1)
(2)
(3)
∗1 ESD PROTECTION DIODE
∗2 BODY DIODE
Absolute maximum ratings (Ta = 25C)
Parameter
Symbol
Drain-source voltage
Gate-source voltage
Source current
(Body Diode)
(4)
∗1








Drain current
(5)
Continuous
Pulsed
Continuous
Pulsed
Power dissipation
Channel temperature
Range of storage temperature
Limits
Unit
VDSS
VGSS
50
8
V
V
ID
IDP
Is
Isp
200
800
125
800
mA
mA
mA
mA
PD
*1
*1
*2
Tch
Tstg
(1) Tr1 SOURCE
(2) Tr1 GATE
(3) Tr2 DRAIN
(4) Tr2 SOURCE
(5) Tr2 GATE
(6) Tr1 DRAIN
150
mW / TOTAL
120
mW / ELEMENT
150
C
55 to +150
C
*1 Pw10s, Duty cycle1%

*2 Each terminal mounted on a recommended land.


Thermal resistance
Parameter
Channel to ambient
Symbol
*
Rth (ch-a)
Limits
Unit
833
1042
°C / W /TOTAL
°C / W /ELEMENT

* Each terminal mounted on a recommended land.
www.rohm.com
c 2010 ROHM Co., Ltd. All rights reserved.
○
1/5
2010.01 - Rev.A
UM6K33N
Data Sheet
Electrical characteristics (Ta = 25C)
<It is the same ratings for Tr1 and Tr2.>
Parameter
Gate-source leakage
Symbol
Gate threshold voltage
Static drain-source on-state
resistance
Typ.
Max.
Unit
Conditions
-
-
10
A
VGS=8V, VDS=0V
50
-
-
V
ID=1mA, VGS=0V
IDSS
-
-
1
A
VDS=50V, VGS=0V
VGS (th)
0.3
-
1.0
V
-
1.6
2.2
-
1.7
2.4
IGSS
Drain-source breakdown voltage V (BR)DSS
Zero gate voltage drain current
Min.
RDS (on)*
VDS=10V, ID=1mA
ID=200mA, VGS=4.5V
ID=200mA, VGS=2.5V

-
1.9
2.7
-
2.0
4.0
ID=100mA, VGS=1.8V
ID=40mA, VGS=1.5V
-
2.4
7.2
ID=20mA, VGS=1.2V
l Yfs l*
0.4
-
-
S
ID=200mA, VDS=10V
Input capacitance
Ciss
-
25
-
pF
VDS=10V
Output capacitance
Coss
-
6
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
3
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
4
-
ns
ID=100mA, VDD 30V
tr *
-
6
-
ns
VGS=4.5V
td(off) *
-
15
-
ns
RL=300
tf *
-
55
-
ns
RG=10
Forward transfer admittance
Rise time
Turn-off delay time
Fall time
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
<It is the same ratings for Tr1 and Tr2.>
Parameter
Forward voltage
Symbol
VSD *
Min.
Typ.
Max.
-
-
1.2
Unit
V
Conditions
Is=200mA, VGS=0V
*Pulsed
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c 2010 ROHM Co., Ltd. All rights reserved.
○
2/5
2010.01 - Rev.A
UM6K33N
Data Sheet
Electrical characteristic curves
0.4
0.3
Ta=25°C
Pulsed
VGS= 1.2V
0.2
VGS= 1.0V
0.1
1
VGS= 4.5V
VGS= 2.5V
VGS=1.8V
VGS=1.5V
0.3
Ta=25°C
Pulsed
VGS=1.2V
0.2
VGS=1.0V
0.1
0
0.6
0.8
1
0
2
10
1
0.1
0.01
0.1
VGS= 4.5V
Pulsed
1
0.1
0.01
1
0.1
1
0.1
1
1
DRAIN-CURRENT : ID[A]
Fig.7 Static Drain-Source On-State
Resistance vs. Drain Current( IV )
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c 2010 ROHM Co., Ltd. All rights reserved.
○
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
1
0.1
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.8 Static Drain-Source On-State
Resistance vs. Drain Current( V )
3/5
2
VGS= 2.5V
Pulsed
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
10
1
0.1
0.01
0.1
1
DRAIN-CURRENT : ID[A]
100
VGS= 1.5V
Pulsed
1.5
100
Fig.5 Static Drain-Source On-State
Resistance vs. Drain Current( II )
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
1
Fig.3 Typical Transfer Characteristics
DRAIN-CURRENT : ID[A]
100
0.1
0.01
0.5
GATE-SOURCE VOLTAGE : VGS[V]
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
10
DRAIN-CURRENT : ID[A]
10
0
10
100
Fig.4 Static Drain-Source On-State
Resistance vs. Drain Current( I )
VGS= 1.8V
Pulsed
8
Fig.2 Typical Output Characteristics( II )
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
VGS=1.2V
VGS= 1.5V
VGS= 1.8V
VGS= 2.5V
VGS= 4.5V
6
DRAIN-SOURCE VOLTAGE : VDS[V]
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.1 Typical Output Characteristics( I )
Ta= 25°C
Pulsed
4
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
0.4
Ta= 125°C
Ta= 75°C
Ta= 25°C
Ta= - 25°C
0.01
Fig.6 Static Drain-Source On-State
Resistance vs. Drain Current( III )
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(on)[]
0.2
0.1
0.001
0
0
VDS= 10V
Pulsed
VGS=0.8V
VGS= 0.8V
100
DRAIN CURRENT : ID[A]
VGS= 4.5V
VGS= 2.5V
VGS=1.8V
VGS=1.5V
DRAIN CURRENT : ID[A]
DRAIN CURRENT : ID[A]
0.4
100
VGS= 1.2V
Pulsed
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta= -25°C
1
0.1
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.9 Static Drain-Source On-State
Resistance vs. Drain Current( VI )
2010.01 - Rev.A
Data Sheet
VDS= 10V
Pulsed
Ta= -25°C
Ta=25°C
Ta=75°C
Ta=125°C
VGS=0V
Pulsed
0.1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.01
0.1
0
1
0.5
1
1.5
SOURCE-DRAIN VOLTAGE : VSD [V]
Fig.10 Forward Transfer Admittance
vs. Drain Current
Fig.11 Reverse Drain Current
vs. Sourse-Drain Voltage
1000
10
Ta=25°C
Pulsed
9
8
ID= 20mA
7
6
ID=200mA
5
4
3
2
1
0
0.01
0.1
0.001
DRAIN-CURRENT : ID[A]
0
5
10
GATE-SOURCE VOLTAGE : VGS[V]
Fig.12 Static Drain-Source On-State
Resistance vs. Gate Source Voltage
1000
Ta=25°C
VDD=30V
VGS=4.5V
tf
100
CAPACITANCE : C [pF]
SWITCHING TIME : t [ns]
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE : RDS(ON)[]
1
1
SOURCE CURRENT : Is [A]
FORWARD TRANSFER ADMITTANCE : |Yfs| [S]
UM6K33N
RG=10
Pulsed
td(off)
tr
10
100
Ta=25°C
f=1MHz
VGS=0V
Ciss
10
Crss
1
Coss
td(on)
1
0.01
0.1
1
DRAIN-CURRENT : ID[A]
Fig.13 Switching Characteristics
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c 2010 ROHM Co., Ltd. All rights reserved.
○
0.1
0.01
0.1
1
10
100
DRAIN-SOURCE VOLTAGE : VDS[V]
Fig.14 Typical Capacitance
vs. Drain-Source Voltage
4/5
2010.01 - Rev.A
UM6K33N
Data Sheet
Measurement circuits
Pulse width
VGS
ID
VDS
50%
10%
D.U.T.
RG
90%
50%
10%
VGS
VDS
RL
VDD
10%
90%
td(on)
tr
ton
90%
td(off)
tf
toff
Fig.1-2 Switching waveforms
Fig.1-1 Switching time measurement circuit
Notice
This product might cause chip aging and breakdown under the large electrified environment.
Please consider to design ESD protection circuit.
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c 2010 ROHM Co., Ltd. All rights reserved.
○
5/5
2010.01 - Rev.A
Notice
Notes
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
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Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
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R1010A