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DUAL DIODE MODULE Spec.No.SR2-SP-05007R4 P1 MDM1200E33D FEATURES Low noise due to soft and fast recovery diodes. High reliability, high durability diodes. Isolated heat sink(terminal to base). ABSOLUTE MAXIMUM RATINGS (TC=25 oC) Item Symbol Unit MDM1200E33D Repetitive Peak Reverse Voltage VRRM V 3,300 IF 1,200 Forward Current A IFM 2,400 o Junction Temperature Tj C -40 ~ +125 o Storage Temperature Tstg C -40 ~ +125 Terminals-base VISO 6,000(AC 1 minute) Isolation Test VRMS Voltage Terminal 1-Terminal 2 VISO T-T 6,000(AC 1 minute) Terminals (M8) 15 Screw Torque N·m Mounting (M6) 6 Notes: (1) Terminal temperature shall not exceed the specified temperature in any operation. +0 (2) Recommended Value 15 /-3N·m (3) Recommended Value 5.50.5N·m DC 1ms ELECTRICAL CHARECTERISTICS Item Repetitive Reverse Current Forward Voltage Drop Reverse Recovery Time Reverse Recovery Loss Symbol Unit Min. Typ. Max. IRRM VF trr Err(10%) mA V s J/P 2.3 - 3.0 2.8 0.6 1.2 30.0 3.3 1.1 1.9 Symbol Unit Min. Typ. Max. Test Conditions o VAK=3,300V, Tj=125 C o IF=1,200A, Tj=125 C VCC=1,650V, IF=1,200A, L=100nH o Tj=125 C,Rg=3.3Ω (4) PACKAGE CHARECTERISTICS Item Test Conditions Terminal Resistance RCE mΩ 0.3 Terminal Stray Inductance LsCE nH 35 Rth(j-c) K/W 0.017 Junction to case Thermal Impedance CTI 600 Comparative tracking index Contact Thermal Impedance Rth(c-f) K/W 0.008 Case to fin per module Base Plate material Al-SiC Insulation substrate material AlN Notes:(4) Counter arm; MBN1200E33D VGE=+/-15V RG value is the test condition’s value for evaluation of the switching times, not recommended value. Please, determine the suitable RG value after the measurement of switching waveforms (overshoot voltage, etc.) with appliance mounted. * Please contact our representatives at order. * For improvement, specifications are subject to change without notice. * For actual application, please confirm this spec sheet is the newest revision. (1) (2) (3) DUAL DIODE MODULE Spec.No.SR2-SP-05007R4 MDM1200E33D DEFINITION OF TEST CIRCUIT Ls DUT LLOAD Vcc Rg G/D MBN1200E33D Fig.1 Switching test circuit Ic Vce Ls= VL t 0 VL dIc dt t=tL ( ) tL Fig.2 Definition of stray inductance Vce 0.1Vce Irm 0.5Irm 0.1IF 0 t trr IF -Ic t3 t1 t2 t4 t2 Err(10%)= ∫ IF・Vce dt t1 t4 Err(Full)= ∫ IF・Vce dt t3 Fig.3 Definition of switching loss P2 DUAL DIODE MODULE Spec.No.SR2-SP-05007R4 P3 MDM1200E33D STATIC CHARACTERISTICS TYPICAL 2 0 0 0 2400 2200 2000 Tj=25℃ 1 5 0 0 Tj=125℃ Forward Current IF (A) 1800 1600 1 0 0 0 1400 1200 1000 5 0 0 800 600 0 400 0 2 1 3 4 6 5 10 7 9 8 200 0 0 1 2 3 4 5 6 Forward Voltage VF (V) DYNAMIC CHARACTERISTICS TYPICAL TYPICAL 2 02.5 0 0 1.0 Vcc=1650V L=100nH Tj=125℃ counter arm; MBN1200E33D Vcc=1650V VGE=+/-15V RG=3.3ohm Vcc=1650V L=100nH Tj=125℃ counter arm; MBN1200E33D Vcc=1650V VGE=+/-15V RG=3.3ohm 1 52.0 0 0 Reverse Recovery Loss Err (J) Reverse Recovery Time trr (us) 0.8 0.6 0.4 0.2 0.0 2 0 0 0 1 5 0 0 Err(full) 1 0 0 0 1 01.5 0 0 Err(10%) 51.0 0 0 5 0 0 0.5 0 0 2 1 3 4 6 5 10 7 9 8 0 0 2 1 0.0 0 200 400 600 800 1000 Forward Current IF (A) 1200 1400 0 200 400 600 800 1000 Forward Current IF (A) 1200 1400 DUAL DIODE MODULE Spec.No.SR2-SP-05007R4 MDM1200E33D PACKAGE OUTLINE DRAWING Weight: 900(g) C(K) C(K) E(A) E(A) Circuit diagram P4 DUAL DIODE MODULE Spec.No.SR2-SP-05007R4 MDM1200E33D TRANSIENT THERMAL IMPEDANCE Thermal Impedance Rth(j-c) (K/W) 0.1 0.01 0.001 0.0001 0.001 0.01 0.1 1 10 Time t(s) Transient Thermal Impedance Curve (Maximum Value) Material declaration Please note the following materials are contained in the product, in order to keep characteristic and reliability level. Material Contained part Lead (Pb) and its compounds Solder P5 DUAL DIODE MODULE Spec.No.SR2-SP-05007R4 MDM1200E33D HITACHI POWER SEMICONDUCTORS Notices 1. The information given herein, including the specifications and dimensions, is subject to change without prior notice to improve product characteristics. Before ordering, purchasers are advised to contact Hitachi sales department for the latest version of this data sheets. 2. Please be sure to read "Precautions for Safe Use and Notices" in the individual brochure before use. 3. In cases where extremely high reliability is required (such as use in nuclear power control, aerospace and aviation, traffic equipment, life-support-related medical equipment, fuel control equipment and various kinds of safety equipment), safety should be ensured by using semiconductor devices that feature assured safety or by means of users’ fail-safe precautions or other arrangement. Or consult Hitachi’s sales department staff. 4. In no event shall Hitachi be liable for any damages that may result from an accident or any other cause during operation of the user’s units according to this data sheets. Hitachi assumes no responsibility for any intellectual property claims or any other problems that may result from applications of information, products or circuits described in this data sheets. 5. In no event shall Hitachi be liable for any failure in a semiconductor device or any secondary damage resulting from use at a value exceeding the absolute maximum rating. 6. No license is granted by this data sheets under any patents or other rights of any third party or Hitachi Power Semiconductor Device, Ltd. 7. This data sheets may not be reproduced or duplicated, in any form, in whole or in part, without the expressed written permission of Hitachi Power Semiconductor Device, Ltd. 8. The products (technologies) described in this data sheets are not to be provided to any party whose purpose in their application will hinder maintenance of international peace and safety not are they to be applied to that purpose by their direct purchasers or any third party. When exporting these products (technologies), the necessary procedures are to be taken in accordance with related laws and regulations. For inquiries relating to the products, please contact nearest overseas representatives that is located “Inquiry” portion on the top page of a home page. Hitachi power semiconductor home page address http://www.hitachi-power-semiconductor-device.co.jp/en/ P6