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Transparent Current Mirrors Using a-GIZO TFTs: Simulation
Transparent Current Mirrors Using a-GIZO TFTs: Simulation

... models that are used for circuit simulations. Current mirrors are important functional blocks in analog circuit design, which are basically used to provide bias current for the circuits or serve as an active load. Current mirrors with a-Si:H TFTs [18] and ZTO TFTs [19] are reported, where the ZTO TF ...
PAM8320 Description Pin Assignments
PAM8320 Description Pin Assignments

... The half H-bridge output stages use NMOS transistors therefore requiring bootstrap capacitors for the high side of each output to turn on correctly. A ceramic capacitor 220nF or more rated for over 25V must be connected from each output to its corresponding bootstrap input. Specifically, one 220nF c ...
UEENEEI119A Set up industrial field control devices
UEENEEI119A Set up industrial field control devices

... The critical safety nature of working with electricity, electrical equipment, gas or any other hazardous substance/material carries risk in deeming a person competent. Sources of evidence need to be ‘rich’ in nature to minimise error in judgment. Activities associated with normal everyday work influ ...
AP1186 - Diodes Incorporated
AP1186 - Diodes Incorporated

Durham Research Online
Durham Research Online

SBB-2082S 数据资料DataSheet下载
SBB-2082S 数据资料DataSheet下载

... Package: Hermetic, 2-pin, 5.8mm x 2.8mm ...
FAN5026  Dual DDR / Dual-Output PWM Controller F
FAN5026 Dual DDR / Dual-Output PWM Controller F

... cease. Under-voltage protection latches the chip off when output drops below 75% of the set value after the soft-start sequence for this output is completed. An adjustable over-current function monitors the output current by sensing the voltage drop across the lower MOSFET. If precision current-sens ...
LM137/LM337 3-Terminal Adjustable Negative Regulators
LM137/LM337 3-Terminal Adjustable Negative Regulators

ELCO 1101 DC Circuits - Minnesota West Community and Technical
ELCO 1101 DC Circuits - Minnesota West Community and Technical

... their educational goals efficiently. Active duty and reserve/guard military members should advise their instructor of all regularly scheduled military appointments and duties that conflict with scheduled course requirements. Instructors will make every effort to work with the student to identify adj ...
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PDF

... grown crystals have larger bandgap than the pure LV single crystals. As a consequence of wide band gap, the grown crystal has large transmittance in the visible region [20]. The extinction co-efficient (k) of the grown crystals were plotted against the wavelength given in Figure 4. It suggests that ...
Coupling an Ensemble of Electrons on Superfluid Helium to a
Coupling an Ensemble of Electrons on Superfluid Helium to a

... quantum optics and quantum computing [1–4]. They form an extremely clean two-dimensional electron gas [5], as evidenced by a mobility exceeding 107 cm2 =V s [6,7], and the electron spin coherence time is predicted to exceed 103 s [1]. Electrons on helium have been used to study Wigner crystallizatio ...
Hot Socketing and Power-On Reset in Stratix III Devices
Hot Socketing and Power-On Reset in Stratix III Devices

... prevent excess I/O leakage during power up. When the voltage ramps up very slowly, it is still relatively low, even after the POR signal is released and the configuration is completed. The CONF_DONE, nCEO, and nSTATUS pins fail to respond, as the output buffer cannot flip from the state set by the h ...
PAM2305D Description Pin Assignments
PAM2305D Description Pin Assignments

... In continuous mode, the source current of the top MOSFET is a square wave of duty cycle VOUT/VIN. To prevent large voltage transients, a low ESR input capacitor sized for the maximum RMS current must be used. The maximum RMS capacitor current is given by: ...
LC081
LC081

... device can retain its output state of 0 or 1 as long as power supply voltage is applied. The outputs of latch are named as Q and Q. The main output Q is the output that repeats the logic signal in input S. The latch is set, when Q  1, and the latch is reset or cleared, when Q  0. Now we will analy ...
PLD Basics - Elisa.net
PLD Basics - Elisa.net

... package sizes from 20 pins to 28 pins. • All GAL devices have registered or combinatorial options, OE control, and selectable output polarity. ...
Analysis of Avalanche Behaviour for Paralleled MOSFETs
Analysis of Avalanche Behaviour for Paralleled MOSFETs

AP4340S Datasheet - Diodes Incorporated
AP4340S Datasheet - Diodes Incorporated

... indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more U ...
AL9910-5 - Diodes Incorporated
AL9910-5 - Diodes Incorporated

... both - depending on the application. Pulling the PWM_D pin to ground will turn off the AL9910. When disabled, the AL9910’s quiescent current is typically 0.5mA (0.65 for AL9910A). Reducing the LD voltage will reduce the LED current but it will not entirely turn off the external power transistor and ...
LM137/LM337 3-Terminal Adjustable Negative Regulators
LM137/LM337 3-Terminal Adjustable Negative Regulators

handling and design guidelines
handling and design guidelines

... circuit formed by the parasitic transistors and resistors is the basic configuration of a silicon controlled rectifier, or SCR. In the latch up condition, transistors Q1 and Q2 are turned ON, each providing the base current necessary for the other to remain in saturation, thereby latching the device ...
Current Simulation for CMOS Circuits
Current Simulation for CMOS Circuits

V GS(on)
V GS(on)

AP3988 Description A Product Line of
AP3988 Description A Product Line of

... indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more U ...
lecture17_08_04_2010..
lecture17_08_04_2010..

... We note that in forward bias, I increases exponentially and is in the A-mA range for voltages typically in the range of 0.6-0.8V. In reverse bias, the current is essentially zero. EE40 Summer 2010 ...
HEMT and HBTstructuresR1
HEMT and HBTstructuresR1

... semi-insulating substrates. The proposed EPIC will be developed based on a single epi growth, which stacks HBT layers on top of GSE laser layers as shown in Fig. 27. Combining both together on the same circuit will dramatically simplify EPIC processing and down-stream module packaging. Higher speed ...
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Semiconductor device



Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum.Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a number—from a few (as low as two) to billions—of devices manufactured and interconnected on a single semiconductor substrate, or wafer.Semiconductor materials are useful because their behavior can be easily manipulated by the addition of impurities, known as doping. Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. Current conduction in a semiconductor occurs via mobile or ""free"" electrons and holes, collectively known as charge carriers. Doping a semiconductor such as silicon with a small amount of impurity atoms, such as phosphorus or boron, greatly increases the number of free electrons or holes within the semiconductor. When a doped semiconductor contains excess holes it is called ""p-type"", and when it contains excess free electrons it is known as ""n-type"", where p (positive for holes) or n (negative for electrons) is the sign of the charge of the majority mobile charge carriers. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to control precisely the location and concentration of p- and n-type dopants. The junctions which form where n-type and p-type semiconductors join together are called p–n junctions.
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