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Hardware Requirements and Diagrams
Hardware Requirements and Diagrams

PL-2303 Series (USB-to-Serial) Product Selection
PL-2303 Series (USB-to-Serial) Product Selection

... This application note guides you through the process of determining the most suitable Prolific USB-to-Serial Bridge Controller chip for your product. Prolific’s PL-2303 range of controller chips provides a convenient solution for connecting an RS232-like full-duplex asynchronous serial device to any ...
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... Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. The Infineon Technologies component described in this Data Sheet may be used in life-support devices or systems and/or automo ...
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CHARACTERISATION OF THE ELECTRICAL RESPONSE OF A APPLICATIONS

... most of the current emphasis for these devices is placed in The device investigated in this work has a similar structure using the bolometer in the infrared (IR) range. to traditional bolometer devices, but differs in that it This work, however, is aimed at investigating and consists of two metal re ...
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... The capacitor active parts shall be assembled in a clean and controlled atmosphere (dust, humidity, temperature) manufacturing line according to ISO 14644-1 Class level 8. The capacitor unit shall be filled under vacuum to insure full impregnation and improved performance. Insulating fluid shall be ...
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Chapter-16 Computerized Testing of Energy Meters

... When the capacity of a meter under test is high, a test with the ordinary loading arrangements would involve a considerable waste of power. To avoid this,”Phantom” or “Fictitious” loading is employed which consists in supplying the voltage circuit with the required ( normal ) voltage, and the curren ...
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... help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) ...
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... LioN-P Multi-protocol module, PROFINET or EtherNet/IP device, 4 digital input channels, 8 IO-Link channels, M8 I/O, 5-poles, B-coded, M12 Hybrid Y-coded data (LAN) and power supply connection, 8-poles, 30 mm housing ...
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SPF-2000 数据资料DataSheet下载

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... of currents shall be representative of stresses in the winding. When the transformer winding connected to the energy source is delta-connected, the first cycle peak asymmetrical current cannot be determined directly from terminal measurements at the source terminals. The following alternatives exist ...
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... applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask ...
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... applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask ...
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... engineers in compliance with the currently valid safety and accident prevention regulations. The "5 safety rules" must be observed. Failure to comply with these instructions may result in damage to the device, fire or other hazards. Hazard due to electric shock. Disconnect before working on the devi ...
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Automatic test equipment



Automatic or automated test equipment (ATE) is any apparatus that performs tests on a device, known as the Device Under Test (DUT), Equipment Under Test (EUT) or Unit Under Test (UUT), using automation to quickly perform measurements and evaluate the test results. An ATE can be a simple computer controlled digital multimeter, or a complicated system containing dozens of complex test instruments (real or simulated electronic test equipment) capable of automatically testing and diagnosing faults in sophisticated electronic packaged parts or on Wafer testing, including System-On-Chips and Integrated circuits.
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