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Transcript
Integration of Front-End Electronics with the Ceramic Detector Ossy Siegmund, Experimental Astrophysics Group, Space Sciences Laboratory, U. California at Berkeley LAPPD Team meeting 6/10/2010 1 Anode Design for Ceramic Package has Pin Connections High Voltage connections 50Ω structure has 3.5mm period Complete ground plane back surface LAPPD Team meeting 6/10/2010 2 Anode interface Design for Ceramic Package 0.020” pins with MoMnW - Ni brazed into holes. Spacing easily achieved Reflections and impedence mismatching? Details can be manipulated LAPPD Team meeting 6/10/2010 3 Electronics interface Design for Ceramic Package Crude concept using J-F Electronics Scheme Attach front end chip array to anode pins using through hole connections. LAPPD Team meeting 6/10/2010 4 Bond circuit ground planes to back of anode. Electronics interface Design for Ceramic Package Through hole connections on preamp boards allow simple solder connections. Ground plane connection via silver epoxy? LAPPD Team meeting 6/10/2010 5 High Voltage Connections to Anode on Ceramic Package High voltage resistors Cable to HV supply LAPPD Team meeting 6/10/2010 6