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eeprom - Cypress Semiconductor
eeprom - Cypress Semiconductor

... © Cypress Semiconductor Corporation, 2010-2012. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license u ...
NI Multisim User Manual
NI Multisim User Manual

... The media on which you receive National Instruments software are warranted not to fail to execute programming instructions, due to defects in materials and workmanship, for a period of 90 days from date of shipment, as evidenced by receipts or other documentation. National Instruments will, at its o ...
interactive
interactive

Multisim User Guide - National Instruments
Multisim User Guide - National Instruments

... The media on which you receive National Instruments software are warranted not to fail to execute programming instructions, due to defects in materials and workmanship, for a period of 90 days from date of shipment, as evidenced by receipts or other documentation. National Instruments will, at its o ...
Precision Metal Film Resistors
Precision Metal Film Resistors

... The units are helixed to a predetermined base to final value ratio to obtain the best TCR, noise and stability characteristics. 3. FILM. Metal-film resistors have a homogeneous film of metal alloy applied by vacuum deposition. 4. SUBSTRATES. The substrates are of a proprietary non alkaline ceramic, ...
How to Find Burnt Resistor Value Even Without a Schematic
How to Find Burnt Resistor Value Even Without a Schematic

... A resistor should have a wattage rating high enough to dissipate the power produced by the current flowing through the resistance, without becoming too hot. However, if a resistor is forced to exceed its power rating, it cannot shed heat fast enough to maintain a stable temperature. Ultimately, the ...
IB-60202 PowlVac® CDR Vacuum Circuit Breaker
IB-60202 PowlVac® CDR Vacuum Circuit Breaker

7. calculation of turn-turn capacitance of the hfcg
7. calculation of turn-turn capacitance of the hfcg

Document
Document

... Researchers from Argonne National Laboratory use the energy of the x-ray to weld metal-matrix composite (Ti or Al / Al2O3 or SiC) materials.  Diode laser welding, once limited to compact disks, laser printers, and laser pointers, are now making their way to the manufacturing floor. Welding Type 304 ...
Fix Anything Electronic
Fix Anything Electronic

... infringement of the trademark. Where such designations appear in this book, they have been printed with initial caps. McGraw-Hill eBooks are available at special quantity discounts to use as premiums and sales promotions, or for use in corporate training programs. To contact a representative please ...
Chapter 24 Capacitance
Chapter 24 Capacitance

3NP Fuse Switch Disconnector – the Optimum Handle on Every
3NP Fuse Switch Disconnector – the Optimum Handle on Every

... All of these features reduce valuable mounting and installation time. It also means that the correct tightening torque of the screws doesn’t have to be checked and adjusted. The mounting rail latching mechanisms, integrated into the basic size 000 and 00 devices, also provide a clear financial benef ...
Application Manual for Power Supply Noise Suppression
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... Bead 3-Terminal Capacitor Large-Capacitance Capacitor ...
PSPICE Lecture #1 - Faculty Websites
PSPICE Lecture #1 - Faculty Websites

... • Only node voltages can be displayed. Node voltages can be used to calculate component voltages. For example, the voltage across R1 (+ on left) is: VR1 = VA – VB = 24.00 – 13.99 = 10.01 V • PSPICE only shows positive current values. A dotted line shows which end of the component the positive curren ...
PSPICE
PSPICE

... • Only node voltages can be displayed. Node voltages can be used to calculate component voltages. For example, the voltage across R1 (+ on left) is: VR1 = VA – VB = 24.00 – 13.99 = 10.01 V • PSPICE only shows positive current values. A dotted line shows which end of the component the positive curren ...
Understanding electromagnetic effects using PCB demos
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... Network Program [ASEU], or within PATON [PATON09]. Two main drawbacks could be observed: 1. We could easily show the fundamental aspects such as Lenz Law, or crosstalk, in an idealized world, but this was not taken for granted by practicing engineers: these engineers needed a link to their own world ...
RPvdsEx Manual - Tucker
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... To optimize performance, DSPs must be programmed in low-level assembly code. Because programming in assembly is a complex, tedious, and lengthy process that requires the programmer to be familiar with the target processor’s architecture, DSPs are typically programmed “at the factory” to run speciali ...
IP4786CZ32
IP4786CZ32

...  Simplified flow-through routing utilizing less overall PCB space  Highest integration in a small footprint, PCB level, optimized RF routing, 32-pin HVQFN leadless package ...
Understanding and Mitigating System-Level ESD and EOS
Understanding and Mitigating System-Level ESD and EOS

... The scaling trend of the semiconductor industry, “Moore's Law,” leads to a reduction in integrated circuit component-level ESD immunity. In previous technology generations, a high level of integrated circuit (IC) component ESD immunity was often able to protect against low-level system ESD and EOS e ...
Carlo Gavazzi Product Overview
Carlo Gavazzi Product Overview

... the East to North America in the West, you are assured that product support, service and inventory are only a phone call or email away. s Carlo Gavazzi products have earned the independent approval of the relevant bodies which govern our own industry and the many industries we serve. They are develo ...
MMU 0102, MMA 0204, MMB 0207
MMU 0102, MMA 0204, MMB 0207

... The resistors are suitable for processing on automatic SMD assembly systems. They are suitable for automatic soldering using wave, reflow or vapor phase as shown in IEC 61760-1 (1). The encapsulation is resistant to all cleaning solvents commonly used in the electronics industry, including alcohols, ...
Short-Circuit Current Rating (Calculations and Marking) 2008 SPD
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... method. With the release of the UL 508A, UL Standard for Safety for Industrial Control Panels, an industry-approved method is now available. UL 508A, Supplement SB, provides an analytical method to determine the short-circuit current rating of an industrial control panel. This method is based upon t ...
IP4786CZ32 DVI and HDMI interface ESD and
IP4786CZ32 DVI and HDMI interface ESD and

IP4786CZ32 DVI and HDMI interface ESD and
IP4786CZ32 DVI and HDMI interface ESD and

... The IP4786CZ32 is designed to protect High-Definition Multimedia Interface (HDMI) transmitter host interfaces. It includes HDMI 5 V overcurrent / overvoltage protection, Data Display Channel (DDC) buffering and decoupling, hot plug detect, backdrive protection, Consumer Electronic Control (CEC) buff ...
June 13, 2011 - Telecommunications Industry Association
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... WTO. This year, ITA expansion would complement one of APEC’s themes for 2011 -innovation and ICT usage. The Federal Register Notice asks: “(1) Which additional information and communications technology (ICT) products the United States should seek to include and provide duty-free treatment under the ...
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Surface-mount technology



Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.
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