Dynaco Mark VI manual
... clearly. See that uninsulated wires do not touch each other unless, of course, they are connected to the same point. It is especially important that uninsulated wires or component leads or terminals do not touch the chassis accidentally. Whenever one wire is to be soldered to a connection such as a ...
... clearly. See that uninsulated wires do not touch each other unless, of course, they are connected to the same point. It is especially important that uninsulated wires or component leads or terminals do not touch the chassis accidentally. Whenever one wire is to be soldered to a connection such as a ...
Connecting Arduino to Grasshopper
... Both Weiser and Ishii have had a significant impact on the development of physical computing, a term used to describe a field of research interested in the construction of physical systems that can sense and respond to their surroundings through the use of software and hardware systems. It overlaps ...
... Both Weiser and Ishii have had a significant impact on the development of physical computing, a term used to describe a field of research interested in the construction of physical systems that can sense and respond to their surroundings through the use of software and hardware systems. It overlaps ...
Untitled
... neutral and the voltage to ground does not exceed 120 V. Two-pole independent-trip breakers and single-pole breakers with handle ties that are rated 125/250 V dc have been investigated for use in line-to-line connected 3-wire dc circuits supplied from a system with a grounded neutral, where the volt ...
... neutral and the voltage to ground does not exceed 120 V. Two-pole independent-trip breakers and single-pole breakers with handle ties that are rated 125/250 V dc have been investigated for use in line-to-line connected 3-wire dc circuits supplied from a system with a grounded neutral, where the volt ...
IB-51802 PowlVac ITE-HK Remote Racking Device
... B. Safety Guidelines Study this instruction bulletin and all other associated documentation before uncrating the circuit breakers. Each user has the responsibility to instruct and supervise all personnel associated with usage, installation, operation, and maintenance of this equipment on all safety ...
... B. Safety Guidelines Study this instruction bulletin and all other associated documentation before uncrating the circuit breakers. Each user has the responsibility to instruct and supervise all personnel associated with usage, installation, operation, and maintenance of this equipment on all safety ...
User guide - NXP Semiconductors
... and supply terminals. This EVB may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via off-the-shelf cables. This EVB is not a Reference Design and is not intended to represent a final design recommendation for any particul ...
... and supply terminals. This EVB may be used with any development system or other source of I/O signals by simply connecting it to the host MCU or computer board via off-the-shelf cables. This EVB is not a Reference Design and is not intended to represent a final design recommendation for any particul ...
CHAPTER 2 Week 4
... The Component Design Bar button is selected by default, since the first logical activity is to place components on the circuit window. The Component Editor Design Bar button lets you modify the components, or add components. The Instruments Design Bar button lets you attach instruments to your circu ...
... The Component Design Bar button is selected by default, since the first logical activity is to place components on the circuit window. The Component Editor Design Bar button lets you modify the components, or add components. The Instruments Design Bar button lets you attach instruments to your circu ...
PAM8303C Description Pin Assignments
... The PAM8303C is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (THD) as low as possible. Power supply decoupling also prevents the oscillations causing by long lead length between the amplifier and the speaker. Th ...
... The PAM8303C is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure the output total harmonic distortion (THD) as low as possible. Power supply decoupling also prevents the oscillations causing by long lead length between the amplifier and the speaker. Th ...
Fabricating Printed Circuit Boards
... ity transparency, or viewgraph. However these can cost up to $20 to $40 per photoplot and be a significant item on project budgets. Some people have tried to get around this problem by printing their artworks directly on transparencies, thus effectively simulating photoplots. However, those who have ...
... ity transparency, or viewgraph. However these can cost up to $20 to $40 per photoplot and be a significant item on project budgets. Some people have tried to get around this problem by printing their artworks directly on transparencies, thus effectively simulating photoplots. However, those who have ...
EEE529:Microsystems
... Coil ends are connected to substrate via contacts; More turns means larger value of inductance, however it induces high resistive elements. Electroplating the contacts could reduce the resistance. The inductance is given by : L = ...
... Coil ends are connected to substrate via contacts; More turns means larger value of inductance, however it induces high resistive elements. Electroplating the contacts could reduce the resistance. The inductance is given by : L = ...
lab 3 Energy and Capacitors
... currents on protein suspensions. The method used in the research is to charge a capacitor and discharge it to provide a large current. One day, you need to increase the capacitance of the capacitor to get larger discharging current. However, no larger capacitor is available. Fortunately, you have an ...
... currents on protein suspensions. The method used in the research is to charge a capacitor and discharge it to provide a large current. One day, you need to increase the capacitance of the capacitor to get larger discharging current. However, no larger capacitor is available. Fortunately, you have an ...
Virtex-6 FPGA PCB Design Guide www.BDTIC.com/XILINX UG373 (v1.2) June 10, 2010
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
... substrate material (usually FR4, an epoxy/glass composite) with copper plating on both sides has portions of copper etched away to form conductive paths. Layers of plated and etched substrates are glued together in a stack with additional insulator substrates between the etched substrates. Holes are ...
E522.8x EMC Demonstrationboard AN 0128
... Note Elmos Semiconductor AG (below Elmos) reserves the right to make changes to the product contained in this publication without notice. Elmos assumes no responsibility for the use of any circuits described herein, conveys no licence under any patent or other right, and makes no representation that ...
... Note Elmos Semiconductor AG (below Elmos) reserves the right to make changes to the product contained in this publication without notice. Elmos assumes no responsibility for the use of any circuits described herein, conveys no licence under any patent or other right, and makes no representation that ...
The Duplex Optical Voice Link
... is not being applied — in which case you don't want to get anywhere near water anyway, for safety's sake. If you used a rosin core solder, clean the board with flux remover before washing in soap and water. Rinse thoroughly. Shake the board to remove water from under the ICs. Wipe everything dry wit ...
... is not being applied — in which case you don't want to get anywhere near water anyway, for safety's sake. If you used a rosin core solder, clean the board with flux remover before washing in soap and water. Rinse thoroughly. Shake the board to remove water from under the ICs. Wipe everything dry wit ...
PTN3360D 1. General description Enhanced performance HDMI/DVI level shifter with active DDC
... HVQFN48 package supply ground is connected to both GND pins and exposed center pad. GND pins and the exposed center pad must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board usi ...
... HVQFN48 package supply ground is connected to both GND pins and exposed center pad. GND pins and the exposed center pad must be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the board usi ...
Winding Capacitance and Leakage Inductance
... between windings; and (4) stray capacitance. The net effect of the capacitance is normally seen by the lumped capacitance, Cp, on the primary, as shown in Figure 17-1. The lumped capacitance is very difficult to calculate by itself. It is much easier to measure the primary inductance and the resonan ...
... between windings; and (4) stray capacitance. The net effect of the capacitance is normally seen by the lumped capacitance, Cp, on the primary, as shown in Figure 17-1. The lumped capacitance is very difficult to calculate by itself. It is much easier to measure the primary inductance and the resonan ...
milltronics ZSS
... Qualified Personnel: This device/system may only be set up and operated in conjunction with this manual. Qualified personnel are only authorized to install and operate this equipment in accordance with established safety practices and standards. Unit Repair and Excluded Liability: ...
... Qualified Personnel: This device/system may only be set up and operated in conjunction with this manual. Qualified personnel are only authorized to install and operate this equipment in accordance with established safety practices and standards. Unit Repair and Excluded Liability: ...
Surface-mount technology
Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In the industry it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board for components not suited to surface mounting such as large transformers and heat-sinked power semiconductors.An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component.