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Transcript
Linear Current Starved
Delay Element
ICEST 2005, Niš
Goran S. Jovanović and Mile K. Stojčev
Faculty of Electronic Engineering, Niš, Serbia and Montenegro
Definitions of some standard terms
Variable delay elements (VDEs)-definition
VDEs are inverter–based circuits used for fine, precise,
and accurate pulse delay control in a high-speed digital
and mixed integrated circuits.
How is achieved variable delay?
Using delay line (DL).
A chain of VDEs forms DL.
Where we meet delay lines?
DLs are constituents of:
•
•
•
•
DLLs (Delay Locked Loops),
TDCs (Time-to-Digital Converters),
VCOs (Voltage Controlled Oscillators),
PWCLs (Pulse-Width Control Loops), etc.
Typical Applications of DLs
• DLs are used as constituent in DLLs in order to:
– achieve correct synchronization between different
digital blocks (CPU and SDRAM interface, ...),
– eliminate clock skew and jitter within VLSI ICs.
• Vernier delay patterns implemented as TDCs,
usually composed with two DLs.
• DLs connected in a ring are building blocks of
VCO in PLLs.
• DLs are constituents of Duty Cycle Correctors
(DCCs) in systems with feedback loop.
Classification of delay line elements
Variable delay line elements are classified as:
• Digital- Controlled Delay Elements (DCDEs)
realized as series of delay elements of variable length (the
number of elements in a chain determines the amount of the
delay).
• Voltage-Controlled Delay Elements (VCDEs)
efficient in applications where small, accurate, and precise
amount of delay is necessary to achieve.
VCDEs are realized using:
 shunt capacitor,
 current starved.
Shunt capacitor delay element
capacitive loaded inverter
in
Vdd
M2
800
M6
out
Time tp [ps]
Vdd
840
720
M1
M5
VC
M3
M7
640
M4
M8
560
3
3.5
Shunt capacitor delay element:
(a) scheme
4
4.5
voltage Vc [V]
(b) typical characteristic
delay in term of control voltage
Shunt capacitor delay element has the following disadvantages:
a) the output capacitor occupies large silicon area;
b) the amount of a delay and the range of voltage regulation are small;.
5
Current starved delay elements
implemented using current inverters
2400
Vdd
2000
Vdd
M4
M2
M6
in
out
C
1600
1200
M5
M1
VBN
Time tp [ps]
VBP
M3
800
600
2.6
Current starved delay element:
(a) scheme
3
3.4
voltage Vc [V]
(b) typical characteristic
delay in term of control voltage
The current starved delay element has
a) simple structure;
b) relatively wide delay range of regulation;.
3.8
4
Common to both VCDLs
Advantages:
• Simple structures
• Fine delay resolution
Disadvantages:
• Shunt Capacitor and Current Starved DLs have
non-linear transfer function, delay variation in
term of control voltage
Problem of VCDL realization was considered by:
•
•
•
Y. Moon, et al., “An All-Analog Multiphase Delay-Locked Loop Using a Replica
Delay Line for Wide-Range Operation and Low-Jitter Performance”, IEEE JSSC,
vol.35, No. 3, pp. 377-384, March 2000.
M. Maymandi-Nejad, M. Sachdev, “A digitally Programmable Delay Element: Design
and Analysis”, IEEE Trans. on VLSI Systems, vol. 11, No. 5, October 2003.
G. Jovanović, M. Stojčev, “Voltage Controlled Delay Line for Digital Signal”, Facta
Universitatis, Series: Electronics and Energetic, vol. 16. No. 2, pp. 215-232, August
2003...
What we propose
• Linearization of VCDL’s transfer function
• We use Current Starved DE.
• Why:
– Simple structure
– Relatively wide range of delay regulation
• How we achieve linear VCDL?
– We modify the bias circuit.
– We use a non-linear bias circuit which is based on
the square-law characteristics of a MOS transistor
in saturation.
– By a cascade connection of two non-linear
elements, the bias circuit and the current starved
delay element, we obtain a linear transfer function
(delay in terms of control voltage).
Delay Line Element – standard solution
Cascade composition of a bias circuit and VCDL
Vdd
1.5/21
VBP
Vctrl
bias
circuit
C

Vsw
I cp
Vdd
Vdd
Icp
M5
M2
IN
VBN
tdelay
VBP
M1
2/21
OUT
2/7
VBN
Cload
M3
M4
1.5/7
2/21
Icp
2/7
M6
voltage control delay element
where:
tdelay - delay time,
C - parasitic output capacitance,
Vsw clock buffer (inverter) swing voltage,
Icp - charging/discharging current of C.
Bias circuit with reciprocal current regulation
Proposal
V
V
dd
dd
6/28

MB2
6/28

Vctrl
4/28

MB4
4/28

MB5
3/28

Vdiff
6/21
I1
WA / LA
MA1

VBN
VB2
MS1
B1
MS2
IBss
B2
BN
Icp
MS3
WA / LA

I2
MA2
VBP
- OF -
- CVC -
BP
2/28

I2
Output
Follower
Icp
6/21
B1
VB1
Vdd
MD2
R
2/28

Vdiff Vdiff+
- VCC -
Current
to
Voltage
Converter
Vdd
I0''
Vdiff
I1
Current Starved
Delay Elements
3/28

R
MD1
Voltage
to
Current
Converter
VdiffMB6
d_BPc
I0'
Vdiff+
- ASF -
d_BP
Fro
ban m
d-g
circ ap
uit
AGND
MB3
Asymmetrical
to
Symmetrical
Folower
To
Delay
Line
MB1
6/7
out
in
Schematic of a bias circuit
Vdd
Vdd
MB1
6/28

MB2
6/28

4/28

MB3
3/28

MB5
MB4
4/28

d_BP
d_BPc
I0'
Vdiff
3/28

6/21
VB1 
I1
 Vtn
kn
I1
B1
2/28

WA / LA
MA1
I1  I 0' 

Vdiff
R
I2
B1
MS2
IBss
B2
BN
MS3
WA / LA

I 2  I 0'' 
I Bss  A  B  I1  C  I1
BP
6/21
Vdiff+
MS1
MD2
R
2/28

Vdd
I0''
Vdiff
R
MD1
Vdiff -
MB6
To
Delay
Line
Fro
ban m
d-g
circ ap
uit
AGND
MA2
Vdiff
R
6/7
A
V
4
kp
B
dd
 2Vtp  Vtn


k p 2 Vdd  2Vtp  Vtn
4
1 kp
C 
4 kn
kn
2

Analytical model of a bias circuit
1.5
22
16
I 2  I 0'' 
R
1.2
I1
4
I1  I 0' 
-1 -0.8
-0.4
0
Vdiff [V]
Vdiff
0.8
Icp [A]
1
1
-1 -0.8
-0.4
a)
I cp  A  B  I1  C  I1
30
26
22
18
VB 2 
R
0.4
5.5
34
Transfer
function of
current-tovoltage
converter
V B1
1.1
36
Chargedischarge
current
variation in
terms of
control
voltage
V B2
I1
 Vtn
kn
1.3
12
8
VB1 
1.4
Vdiff
VB1, VB2 [V]
I2
Vdiff0 [V]
I2
 Vtn
kn
0.4
0.8 1
b)
4
x10
Reciprocal of
Chargedischarge
current
variation in
terms of
control
voltage
5
1/Icp [1/A]
Transfer
function of
voltage-tocurrent
converter
I1, I2 [A]
20
I cp ~
1
Vdiff
4
3
-1 -0.8
-0.4
0
Vdiff [V]
0.4
0.8 1
c)
2.5
-1 -0.8
-0.4
0
Vdiff [V]
0.4
0.8 1
d)
Technological and operating parameters for 1.2 m CMOS technology:
Cox=1.41e-3 F/m2; mp=195E-4 m2/V*s; mn=555E-4 m2/V*s; kn=0.5*78.255 mA/V2; kp=0.5*27.495 mA/V2;
Vtn=0.6259V; Vtp=1.14V; I0=12.5mA; R=120kW; Vdd=5V;
HSpice simulation of a bias circuit
0.08
1/ I cp [1/A]
Icp [A]
28
26
0.07
LA=10m
LA=12m
LA=14m
22
0.06
LA=10m
LA=12m
LA=14m
0.05
0.04
18
-0.8
-0.4
0
Vdiff [V]
0.4
0.8
1
-0.4
0
Vdiff [V]
0.4
0.8
1
b)
Reciprocal of Charge-discharge current
variation in terms of control voltage
a)
Charge-discharge current variation
in terms of control voltage
LA - is a transistors channel length in
Current-to-Voltage Converter
Relative approximation error of the
reciprocal charge-discharge current
variation in terms of control voltage
Approximation Error [%]
14
0.035
-0.8
2
1
0
-1
LA=10m
LA=12m
LA=14m
-2
-3
-4
-0.8
-0.4
0
Vdiff [V]
0.4
0.8
1
c)
Current starved VCDL with linear delay regulation
VBN
Vdiff+
Vdiff-
VCDE 1
Voltage
to
Current
Converter
- VCC -
I1
VBN
Current
to
Voltage
VB1
Output
Follower
- OF - CVC -
VB2
VBN
VCDE 3
CLKout4
delay
element
4
VBP
VBN
OB 4
VBP
VCDE 2
VCDE 4
VBP
Converter
I2
CLKout3
CLKout2
VBP
delay
element
3
OB 3
VBP
delay
element
2
bias
CLKin
OB 1
Vdd
delay
element
1
OB 2
CLKout1
- Complete design -
VBN
Schematic of four stage DL
HSpice delay line simulation
– results relate to CLKout4 –
3000
60
tdelay [ns]
2500
2000
50
1500
tdelay [ps]
1000
40
500
30
25
0
-500
-0.8
-0.4
0
Vdiff [V]
0.4
0.8
Time delay, tdelay , in term of
control voltage Vdiff
a)
1
-1000
-0.8
- 0.4
0
Vdiff [V]
0.4
0.8
b)
Relative approximation error
of time delay, tdelay , in term of
control voltage Vdiff
1
Conclusion
►An implementation of a linear VCDL is
proposed.
►Current starved DL is used.
►Linearization is achieved by modifying the bias
circuit of current starved DL.
► HSpice simulation results points to the fact
that for 1.2 m CMOS technology high delay
linearity (error is less then 500 ps) within the full
range of regulation (from 28 to 55 ns) is achieved.
►VCDL is used as a constituent of DLL, TDC,
PWCL, VCO,…
Q&A