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10760 1 present work, low series resistances have been obtained using
10760 1 present work, low series resistances have been obtained using

Generic Stress Factors and De-rating
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... Electronic components fail during design, manufacturing, and field usage of equipment for various reasons. The nature of the failures of components could be classified as either mechanical or chemical [1]. The coil ends of electromagnetic ...
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Power MOSFET Models Including Quasi-Saturation Effect
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... Fig. 3 shows the simulated drain current results obtained with the standard power MOSFET model in comparison to the measurements. The standard power MOSFET model cannot simulate the high gate bias conditions. On the other hand, Fig. 5 shows the simulated, with the proposed model, and the measured ou ...
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... Thus, a possible way to influence the total supercurrent in a SNS junction is to change the electron energydistribution function f (E). This is done by using a sample geometry in which the normal region of the SNS junction is also coupled to two large electron reservoirs (see Figs 2 and 5). By apply ...
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... through by a common number in order to simplify them by, for example, removing a common factor. This operation of multiplication simply generates a parallel plane which is at a different distance from the origin of the particular unit cell being considered. e.g. (200) is transformed to (100) by divi ...
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Lecture 12
Lecture 12

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Semiconductor device



Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum.Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a number—from a few (as low as two) to billions—of devices manufactured and interconnected on a single semiconductor substrate, or wafer.Semiconductor materials are useful because their behavior can be easily manipulated by the addition of impurities, known as doping. Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. Current conduction in a semiconductor occurs via mobile or ""free"" electrons and holes, collectively known as charge carriers. Doping a semiconductor such as silicon with a small amount of impurity atoms, such as phosphorus or boron, greatly increases the number of free electrons or holes within the semiconductor. When a doped semiconductor contains excess holes it is called ""p-type"", and when it contains excess free electrons it is known as ""n-type"", where p (positive for holes) or n (negative for electrons) is the sign of the charge of the majority mobile charge carriers. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to control precisely the location and concentration of p- and n-type dopants. The junctions which form where n-type and p-type semiconductors join together are called p–n junctions.
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