MAX2839EVKIT
... capacitor as close to each supply pin as possible. This arrangement provides local decoupling at each VCC pin. Use at least one via per bypass capacitor for a lowinductance ground connection. Do not share the capacitor ground vias with any other branch. ...
... capacitor as close to each supply pin as possible. This arrangement provides local decoupling at each VCC pin. Use at least one via per bypass capacitor for a lowinductance ground connection. Do not share the capacitor ground vias with any other branch. ...
Decoupling Capacitor with Low Inductance for High
... incorporated in wiring circuit layer in circuit board, (b) interposer type capacitor placed between LSI and circuit board, and (c) discrete type capacitor mounted on circuit board. ...
... incorporated in wiring circuit layer in circuit board, (b) interposer type capacitor placed between LSI and circuit board, and (c) discrete type capacitor mounted on circuit board. ...
full abstracts in word format
... material with each pulse. The amount of material removed is dependent on the material itself, the length of the pulse, and the intensity (fluency) of the laser light. Below certain threshold fluency, dependent on the material, the laser light has no effect. As the fluency is increased above the thre ...
... material with each pulse. The amount of material removed is dependent on the material itself, the length of the pulse, and the intensity (fluency) of the laser light. Below certain threshold fluency, dependent on the material, the laser light has no effect. As the fluency is increased above the thre ...
The course document
... electrical and electronics circuits and building projects that can be used in daily applications. It is the study of how different electronic components can be connected to perform a task. It looks at how information can be entered into, passed between, processed, and interpreted from electronic cir ...
... electrical and electronics circuits and building projects that can be used in daily applications. It is the study of how different electronic components can be connected to perform a task. It looks at how information can be entered into, passed between, processed, and interpreted from electronic cir ...
Dual Hot Swap Controller Evaluation Module
... use external N-channel MOSFETs as high-side switches in power applications. The devices integrate features such as overcurrent protection, inrushcurrent control, output-power status reporting, and separation of load transients from actual load increases, which are the critical requirements for hotsw ...
... use external N-channel MOSFETs as high-side switches in power applications. The devices integrate features such as overcurrent protection, inrushcurrent control, output-power status reporting, and separation of load transients from actual load increases, which are the critical requirements for hotsw ...
Evaluates: MAX9590/MAX9591 MAX9591 Evaluation Kit General Description Features
... for later use. 10) Set the power supply to 15V and disable the powersupply output. 11) Connect the power-supply positive terminal to the AVDD PCB pad and the negative terminal to the AGND PCB pad next to AVDD. 12) Enable the power-supply output. 13) Start the MAX9591 EV kit software by opening its i ...
... for later use. 10) Set the power supply to 15V and disable the powersupply output. 11) Connect the power-supply positive terminal to the AVDD PCB pad and the negative terminal to the AGND PCB pad next to AVDD. 12) Enable the power-supply output. 13) Start the MAX9591 EV kit software by opening its i ...
sub=rf_remote_control
... If you have any electronic equipment that over the years has degraded its performance, developed quirks, sometimes ending in complete failure, the chances are good that one or more electrolytic capacitors inside it have degraded, causing the problem. Electrolytic capacitors age in several ways: They ...
... If you have any electronic equipment that over the years has degraded its performance, developed quirks, sometimes ending in complete failure, the chances are good that one or more electrolytic capacitors inside it have degraded, causing the problem. Electrolytic capacitors age in several ways: They ...
RC circuit
... resistor and 2000-μF electrolytic capacitor charged to 240 V. If the lamp resistor is 12 , find (a) the peak charging current, (b) the time required for the capacitor to fully charge, (c) the peak discharging current, (d) the total energy stored in the capacitor, and (e) the average power dissipate ...
... resistor and 2000-μF electrolytic capacitor charged to 240 V. If the lamp resistor is 12 , find (a) the peak charging current, (b) the time required for the capacitor to fully charge, (c) the peak discharging current, (d) the total energy stored in the capacitor, and (e) the average power dissipate ...
fundamentals of single chip packaging
... Plastic QFP – established member of the family of peripherally-leaded packages Main difference – runs around all four sides Enables higher pin count – up to 304 pins The most common usage – 48 to 128 range Very popular choice for lower cost microprocessors and other ICs for portable system ...
... Plastic QFP – established member of the family of peripherally-leaded packages Main difference – runs around all four sides Enables higher pin count – up to 304 pins The most common usage – 48 to 128 range Very popular choice for lower cost microprocessors and other ICs for portable system ...
The Evaluation of Steel Conduit and EMT as Equipment
... equipment and wiring and other electrically conductive material likely to become energized shall be installed in a manner that creates a low-impedance circuit facilitating the operation of the overcurrent device or ground detector for high-impedance grounded systems.” • “It shall be capable of safel ...
... equipment and wiring and other electrically conductive material likely to become energized shall be installed in a manner that creates a low-impedance circuit facilitating the operation of the overcurrent device or ground detector for high-impedance grounded systems.” • “It shall be capable of safel ...
10-V Reference - Texas Instruments
... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain t ...
... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain t ...
MAX15091/MAX15091A Evaluate: MAX15091/MAX15091A Evaluation Kits General Description
... the power supply until all connections are completed. 1) Verify that a shunt is installed across pins 1-2 on jumper JU1. 2) Turn on the power supply and set the supply to 12V, then disable the power supply. 3) Connect the positive terminal of the power supply to the IN banana jack on the EV kit. C ...
... the power supply until all connections are completed. 1) Verify that a shunt is installed across pins 1-2 on jumper JU1. 2) Turn on the power supply and set the supply to 12V, then disable the power supply. 3) Connect the positive terminal of the power supply to the IN banana jack on the EV kit. C ...
Investigating the Transistor
... 1. Using the nail or drawing pin provided, pierce small holes in the card where the round circles are marked. Place a piece of polystyrene or other suitable material under the card while you are doing this. 2. The battery, LED (light emitting diode) and transistor must be connected the right way rou ...
... 1. Using the nail or drawing pin provided, pierce small holes in the card where the round circles are marked. Place a piece of polystyrene or other suitable material under the card while you are doing this. 2. The battery, LED (light emitting diode) and transistor must be connected the right way rou ...
High Speed Layout Design Guidelines This application note
... transmission line, and signals can propagate faster in materials that have a lower εr. A high-frequency signal that propagates through a long line on the PCB from driver to receiver is severely affected by the loss tangent of the dielectric material. A large loss tangent means higher dielectric abso ...
... transmission line, and signals can propagate faster in materials that have a lower εr. A high-frequency signal that propagates through a long line on the PCB from driver to receiver is severely affected by the loss tangent of the dielectric material. A large loss tangent means higher dielectric abso ...
TECHNICIAN POWER ELECTRONICS SYSTEMS Government of India
... • Prepare a power point presentation on any three known topics with various design features • Prepare a power point presentation with different animation and visual effects. • Invoke excel sheet from MS WORD and vice versa • Convert the given PDF File into WORD File ...
... • Prepare a power point presentation on any three known topics with various design features • Prepare a power point presentation with different animation and visual effects. • Invoke excel sheet from MS WORD and vice versa • Convert the given PDF File into WORD File ...
UM0271
... The board haven't got the possibility to switch automatically from Ringing to Active mode (automatic Ring Trip detection) but it is necessary to move manually in the correct position the D0 and D1 switches and remove the input square wave applied to D2/RINGER connector. ...
... The board haven't got the possibility to switch automatically from Ringing to Active mode (automatic Ring Trip detection) but it is necessary to move manually in the correct position the D0 and D1 switches and remove the input square wave applied to D2/RINGER connector. ...
HMC284MS8G / 284MS8GE
... 1. Set A/B control to 0/+5V, Vdd = +5V and use HCT series logic to provide a TTL driver interface. 2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd = +5 Volts applied to the CMOS logic gates. 3. DC blocking capacitors are required for each RF port as shown. Capacitor value ...
... 1. Set A/B control to 0/+5V, Vdd = +5V and use HCT series logic to provide a TTL driver interface. 2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd = +5 Volts applied to the CMOS logic gates. 3. DC blocking capacitors are required for each RF port as shown. Capacitor value ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.