Haptics: Touch feedback that really moves you
... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain t ...
... Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain t ...
Evaluation Board User Guide UG-189
... ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken ...
... ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken ...
cautions for proper use of aluminum electrolytic capacitor
... 8）Consideration for Circuit Design ・In designing a printed circuit board (PCB) with Aluminum Electrolytic Capacitors, the following matters should be ensured: ①Alignment of through-hole pitch on the circuit with radial lead pitch of each capacitor. ②Avoid wiring or circuit pattern around the capacit ...
... 8）Consideration for Circuit Design ・In designing a printed circuit board (PCB) with Aluminum Electrolytic Capacitors, the following matters should be ensured: ①Alignment of through-hole pitch on the circuit with radial lead pitch of each capacitor. ②Avoid wiring or circuit pattern around the capacit ...
MMA7260QT - NXP Semiconductors
... The Freescale accelerometer is a surface-micromachined integrated-circuit accelerometer. The device consists of two surface micromachined capacitive sensing cells (g-cell) and a signal conditioning ASIC contained in a single integrated circuit package. The sensing elements are sealed hermetically at ...
... The Freescale accelerometer is a surface-micromachined integrated-circuit accelerometer. The device consists of two surface micromachined capacitive sensing cells (g-cell) and a signal conditioning ASIC contained in a single integrated circuit package. The sensing elements are sealed hermetically at ...
Evaluation Board User Guide UG-155
... (“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal, temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Boar ...
... (“ADI”), with its principal place of business at One Technology Way, Norwood, MA 02062, USA. Subject to the terms and conditions of the Agreement, ADI hereby grants to Customer a free, limited, personal, temporary, non-exclusive, non-sublicensable, non-transferable license to use the Evaluation Boar ...
BDTIC www.BDTIC.com/infineon Application Note No. 020
... available as a single device from Infineon - BCR400W. For further information please refer to Application Note No.14. However, the resistors R1 and R3 are sufficient in most applications for stabilization purposes. This circuit is not optimized, for low noise figure, it is a first step to a good des ...
... available as a single device from Infineon - BCR400W. For further information please refer to Application Note No.14. However, the resistors R1 and R3 are sufficient in most applications for stabilization purposes. This circuit is not optimized, for low noise figure, it is a first step to a good des ...
A Simple Modification
... sure that you select each resistor with the correct resistance before placing it on the PCB. The resistor and capacitor values used in this project are not that critical. Being off 10% for the resistors or capacitors shouldn't make any difference. If you build more critical circuits (e.g., a tune ci ...
... sure that you select each resistor with the correct resistance before placing it on the PCB. The resistor and capacitor values used in this project are not that critical. Being off 10% for the resistors or capacitors shouldn't make any difference. If you build more critical circuits (e.g., a tune ci ...
Evaluates: MAX9390/MAX9391 MAX9390 Evaluation Kit General Description Features
... designed for direct differential probing at the LVDS inputs/outputs and single-ended probing at the outputs using the respective 2-pin headers. The EV kit operates from a single 3.3V supply that provides 150mA of output current. The MAX9390 EV kit consists of two independent LVDS channels (A and B) ...
... designed for direct differential probing at the LVDS inputs/outputs and single-ended probing at the outputs using the respective 2-pin headers. The EV kit operates from a single 3.3V supply that provides 150mA of output current. The MAX9390 EV kit consists of two independent LVDS channels (A and B) ...
Facilities - Forest Fire Lookout Association
... than 1 milliohm. The ½-inch stranded copper wire that is the were physically damaged or had been removed entirely. minimum size for down and main conductors in the Class A common fault is the failure to bond metal items in and II standard has a resistance of less than 0.1 ohm per 1,000 around the ca ...
... than 1 milliohm. The ½-inch stranded copper wire that is the were physically damaged or had been removed entirely. minimum size for down and main conductors in the Class A common fault is the failure to bond metal items in and II standard has a resistance of less than 0.1 ohm per 1,000 around the ca ...
![Application Note [AN-004] Resistive Touch Panel Technologies](http://s1.studyres.com/store/data/000087727_1-d4cbc23776babe9b0e906bacf50dca62-300x300.png)
Application Note [AN-004] Resistive Touch Panel Technologies
... 2.3 Typical configuration of 4-wire Touch Panels The difference between 4-wire, 5-wire technologies is the measurement operation and the way in which the voltage is applied to the conductive layers. In the 4-wire technology there are four connections at the two conductive layers: Two bus bars for ea ...
... 2.3 Typical configuration of 4-wire Touch Panels The difference between 4-wire, 5-wire technologies is the measurement operation and the way in which the voltage is applied to the conductive layers. In the 4-wire technology there are four connections at the two conductive layers: Two bus bars for ea ...
Chapter 10: Passive Components
... inductance terminations to minimize ESL. Dependent upon their electrical and physical size, film capacitors can be useful at frequencies to well above 10 MHz. At the very high frequencies, stacked film types only should be considered. Some manufacturers are also supplying film types in leadless surf ...
... inductance terminations to minimize ESL. Dependent upon their electrical and physical size, film capacitors can be useful at frequencies to well above 10 MHz. At the very high frequencies, stacked film types only should be considered. Some manufacturers are also supplying film types in leadless surf ...
K.H. Cherenack, A.Z. Kattamis, B.Hekmatshoar, J.C. Sturm, and S. Wagner, "Amorphous-Silicon Thin-Film Transistors Fabricated at 300C on a Free-Standing Foil Substrate of Clear Plastic," IEEE Elec. Dev. Lett. EDL-28, pp. 1004-1006 (2007).
... Abstract—We have made hydrogenated amorphous-silicon thin-film transistors (TFTs) at a process temperature of 300 ◦ C on free-standing clear-plastic foil substrates. The key to the achievement of flat and smooth samples was to design the mechanical stresses in the substrate passivation and transisto ...
... Abstract—We have made hydrogenated amorphous-silicon thin-film transistors (TFTs) at a process temperature of 300 ◦ C on free-standing clear-plastic foil substrates. The key to the achievement of flat and smooth samples was to design the mechanical stresses in the substrate passivation and transisto ...
Next step towards higher power density with new IGBT and di
... The used approach in the IGBT development can be understood by investigating the event of short circuit: In the short circuit condition the device temperature is increasing rapidly due to the massive power dissipation, since power is equal voltage times current. The device temperature itself is then ...
... The used approach in the IGBT development can be understood by investigating the event of short circuit: In the short circuit condition the device temperature is increasing rapidly due to the massive power dissipation, since power is equal voltage times current. The device temperature itself is then ...
Syllabus for the Trade of ELECTRONICS MECHANIC
... semester is common for all three Electronics courses. Mechanic Electronic Consumer appliance (Only 4th Semester) Technician Power Electronics Systems (3rd and 4th Semester) Also on successful completion of the course they can pursue Apprenticeship training in the reputed Industries / Organizations. ...
... semester is common for all three Electronics courses. Mechanic Electronic Consumer appliance (Only 4th Semester) Technician Power Electronics Systems (3rd and 4th Semester) Also on successful completion of the course they can pursue Apprenticeship training in the reputed Industries / Organizations. ...
PDF
... Avoid placing simultaneously switching signals next to each other for long parallel runs Reroute signals which will be quiet during switching inbetween simultaneous switching signals Route signals close to power rails to provide capacitance ballast Tough problem to solve – moving one wire ca ...
... Avoid placing simultaneously switching signals next to each other for long parallel runs Reroute signals which will be quiet during switching inbetween simultaneous switching signals Route signals close to power rails to provide capacitance ballast Tough problem to solve – moving one wire ca ...
Information Sheet
... • Connector can be used for any combination of bare conductor, copper and aluminum. • Connector can be used for any combination of insulated conductor, copper or aluminum. However, the Tap side is limited to conductors with a maximum O.D. (including insulation) of .528. The following classes of 2/0 ...
... • Connector can be used for any combination of bare conductor, copper and aluminum. • Connector can be used for any combination of insulated conductor, copper or aluminum. However, the Tap side is limited to conductors with a maximum O.D. (including insulation) of .528. The following classes of 2/0 ...
BDTIC Application Note No. 017
... device‘s Beta (current gain) distribution can be achieved by using an active bias circuit. Such a circuit is available as a single device from Infineon - BCR400W. For further information please refer to Application Note No.14. However, in most applications, sufficient stabilization is achievable usi ...
... device‘s Beta (current gain) distribution can be achieved by using an active bias circuit. Such a circuit is available as a single device from Infineon - BCR400W. For further information please refer to Application Note No.14. However, in most applications, sufficient stabilization is achievable usi ...
AN2007-06 - MA300Exx, Module Adapter Boards for PrimePACK
... Active voltage clamping is a technique which keeps transient VCE overvoltages below VCES when the IGBT switches off. The standard approach to active clamping is to use a chain of avalanche diodes connected between the auxiliary collector and the gate of an IGBT module. When the VCE voltage exceeds t ...
... Active voltage clamping is a technique which keeps transient VCE overvoltages below VCES when the IGBT switches off. The standard approach to active clamping is to use a chain of avalanche diodes connected between the auxiliary collector and the gate of an IGBT module. When the VCE voltage exceeds t ...
MAX17598 Evaluation Kit MAX17598 in Active-Clamp Forward Converter Topology General Description
... Warning: The EV kit is designed to operate with high voltages. Dangerous voltages are present on this EV kit and on the equipment connected to it. Users who power up this EV kit or the power sources connected to it must be careful to follow safety procedures appropriately to work with high-voltage e ...
... Warning: The EV kit is designed to operate with high voltages. Dangerous voltages are present on this EV kit and on the equipment connected to it. Users who power up this EV kit or the power sources connected to it must be careful to follow safety procedures appropriately to work with high-voltage e ...
Evaluation Board User Guide UG-136
... Ultrasmall 1 mm × 1 mm, 4-ball, 0.5 mm pitch WLCSP Small 2 mm × 2 mm, 6-lead, 0.5 mm pitch LFCSP Low RDSON of 65 mΩ at 1.8 V Low input voltage range of 1.1 V to 3.6 V 1 amp continuous operating current Operating temperature range: TJ = −40°C to +85°C ...
... Ultrasmall 1 mm × 1 mm, 4-ball, 0.5 mm pitch WLCSP Small 2 mm × 2 mm, 6-lead, 0.5 mm pitch LFCSP Low RDSON of 65 mΩ at 1.8 V Low input voltage range of 1.1 V to 3.6 V 1 amp continuous operating current Operating temperature range: TJ = −40°C to +85°C ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.