HMC544 数据资料DataSheet下载
... should be generated with proper RF circuit design techniques. Signal lines at the RF port should have 50 ohm impedance and the package ground leads should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Microwa ...
... should be generated with proper RF circuit design techniques. Signal lines at the RF port should have 50 ohm impedance and the package ground leads should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Microwa ...
troubleshooting guide
... control circuit the charge control circuit board (51). Check fuse. board. Replace charge No voltage present Check unit wiring and Ok No voltage present control thermostat. charge control circuit board fuses. Voltage present Check control Voltage present Replace charge control transformer(s) and the ...
... control circuit the charge control circuit board (51). Check fuse. board. Replace charge No voltage present Check unit wiring and Ok No voltage present control thermostat. charge control circuit board fuses. Voltage present Check control Voltage present Replace charge control transformer(s) and the ...
026-1704 MultiFlex I/O Board - Emerson Climate Technologies
... All boards feature both +5VDC and +12VDC output voltage points for use in powering transducers or other input devices that require power. On the RS485 Network, the MultiFlex combination input/output boards present themselves to the Einstein or REFLECS site controller as 16AI Analog Input Boards, 8RO ...
... All boards feature both +5VDC and +12VDC output voltage points for use in powering transducers or other input devices that require power. On the RS485 Network, the MultiFlex combination input/output boards present themselves to the Einstein or REFLECS site controller as 16AI Analog Input Boards, 8RO ...
Dong-PZT.pdf
... III. Analysis of Magneto-(Elasto)-Electric Coupling The ME behavior of laminate composites is a product property. Product properties do not naturally occur in single phase materials, but rather are due to the integration of multiple functionalities within a composite. Two sets of linear constitutive ...
... III. Analysis of Magneto-(Elasto)-Electric Coupling The ME behavior of laminate composites is a product property. Product properties do not naturally occur in single phase materials, but rather are due to the integration of multiple functionalities within a composite. Two sets of linear constitutive ...
RF3705 数据资料DataSheet下载
... The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrica ...
... The PCB land pattern has been designed with a thermal pad that matches the die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrica ...
Integration Of Passive Components Into Integrated Circuits
... Integration Of Passive Components Into Integrated Circuits Gajanana G K Winter Academy, Digha(9'th to 16'th December, 2006) ...
... Integration Of Passive Components Into Integrated Circuits Gajanana G K Winter Academy, Digha(9'th to 16'th December, 2006) ...
Dielectric
... We just saw that the energy is reduced by the introduction of a dielectric. Since systems want to reduce their energy, the dielectric will be sucked into the capacitor. Alternatively, since opposing charges are induced on the dielectric surfaces close to the plates, the attraction between these will ...
... We just saw that the energy is reduced by the introduction of a dielectric. Since systems want to reduce their energy, the dielectric will be sucked into the capacitor. Alternatively, since opposing charges are induced on the dielectric surfaces close to the plates, the attraction between these will ...
Chapter 4
... Fig. 4.26: National Semiconductor´s TapePak component packages are specified with terminal numbers between 40 and close to 600. To the left we see a 40 leads TapePak in the form it is received by the user with a protective ring around it, and test points outside the ring. To the right is TapePak 40 ...
... Fig. 4.26: National Semiconductor´s TapePak component packages are specified with terminal numbers between 40 and close to 600. To the left we see a 40 leads TapePak in the form it is received by the user with a protective ring around it, and test points outside the ring. To the right is TapePak 40 ...
AP1506 150KHz, 3A PWM BUCK DC/DC CONVERTER Description
... curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware that there are many factors that can affect the junction temperature. When load currents higher than 3A are used, double sided or multi-layer PC boards with large copper areas and/or air ...
... curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware that there are many factors that can affect the junction temperature. When load currents higher than 3A are used, double sided or multi-layer PC boards with large copper areas and/or air ...
design rules - Binus Repository
... set of mask design guidelines called design rules • Design rules are a set of guidelines that specify the minimum dimensions and spacings allowed in a layout drawing • Violating a design rule might result in a non-functional circuit or in a highly reduced yield • The design rules can be expressed as ...
... set of mask design guidelines called design rules • Design rules are a set of guidelines that specify the minimum dimensions and spacings allowed in a layout drawing • Violating a design rule might result in a non-functional circuit or in a highly reduced yield • The design rules can be expressed as ...
11. High-Speed Board Layout Guidelines Introduction
... capacitance of a conductor pair, with the capacitance of the conductor pair in a vacuum. The dielectric constant affects the impedance of a transmission line. Signals can propagate faster in materials that have a lower dielectric constant. A high-frequency signal that propagates through a long line ...
... capacitance of a conductor pair, with the capacitance of the conductor pair in a vacuum. The dielectric constant affects the impedance of a transmission line. Signals can propagate faster in materials that have a lower dielectric constant. A high-frequency signal that propagates through a long line ...
Rapid LED NanoCube 28 CF Quad Retrofit
... Too little will lower conductivity and too much will create a mess. A thin layer works best. The photo below indicates approximately about how much thermal grease should be applied. ...
... Too little will lower conductivity and too much will create a mess. A thin layer works best. The photo below indicates approximately about how much thermal grease should be applied. ...
HMC336MS8G 数据资料DataSheet下载
... This switch is suitable for usage in DC - 6.0 GHz 50Ohm or 75-Ohm systems: ...
... This switch is suitable for usage in DC - 6.0 GHz 50Ohm or 75-Ohm systems: ...
Layout and Termination Techniques For Cypress Clock Generators
... source, thus resulting in less noise, electromagnetic interference (EMI), and radio frequency interference (RFI). However, from a practical standpoint, either of the two techniques can be used, depending on the system under design. Common Types of Transmission Lines Microstrip lines and strip lines ...
... source, thus resulting in less noise, electromagnetic interference (EMI), and radio frequency interference (RFI). However, from a practical standpoint, either of the two techniques can be used, depending on the system under design. Common Types of Transmission Lines Microstrip lines and strip lines ...
Evaluation Board User Guide UG-119
... The record path includes an integrated microphone bias circuit and six inputs. The inputs can be mixed and muxed before the ADC, or they can be configured to bypass the ADC. The ADAU1361 includes a stereo digital microphone input. The ADAU1361 includes five high power output drivers (two differentia ...
... The record path includes an integrated microphone bias circuit and six inputs. The inputs can be mixed and muxed before the ADC, or they can be configured to bypass the ADC. The ADAU1361 includes a stereo digital microphone input. The ADAU1361 includes five high power output drivers (two differentia ...
UM1452
... The STM32100B-MCKIT starter kit contains electrostatic sensitive components which may be damaged through improper use. ...
... The STM32100B-MCKIT starter kit contains electrostatic sensitive components which may be damaged through improper use. ...
Introduction to Basic Electronic Components
... microprocessor, the kind used in a PC. A typical microcontroller contains all the memory and I/O interfaces needed, whereas a general purpose microprocessor requires additional chips to provide these necessary functions. There are many manufacturers of microcontrollers that make a wide range of devi ...
... microprocessor, the kind used in a PC. A typical microcontroller contains all the memory and I/O interfaces needed, whereas a general purpose microprocessor requires additional chips to provide these necessary functions. There are many manufacturers of microcontrollers that make a wide range of devi ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.