Evaluation Board User Guide UG-136
... Ultrasmall 1 mm × 1 mm, 4-ball, 0.5 mm pitch WLCSP Small 2 mm × 2 mm, 6-lead, 0.5 mm pitch LFCSP Low RDSON of 65 mΩ at 1.8 V Low input voltage range of 1.1 V to 3.6 V 1 amp continuous operating current Operating temperature range: TJ = −40°C to +85°C ...
... Ultrasmall 1 mm × 1 mm, 4-ball, 0.5 mm pitch WLCSP Small 2 mm × 2 mm, 6-lead, 0.5 mm pitch LFCSP Low RDSON of 65 mΩ at 1.8 V Low input voltage range of 1.1 V to 3.6 V 1 amp continuous operating current Operating temperature range: TJ = −40°C to +85°C ...
UM0969
... and high voltage. All measuring equipment must be isolated from the mains before powering the board. When using an oscilloscope with the demonstration board, it must be isolated from the AC line. This prevents shock from occurring as a result of touching any SINGLE point in the circuit, but does NOT ...
... and high voltage. All measuring equipment must be isolated from the mains before powering the board. When using an oscilloscope with the demonstration board, it must be isolated from the AC line. This prevents shock from occurring as a result of touching any SINGLE point in the circuit, but does NOT ...
BDTIC Application Note No. 019
... The layout size can be reduced by using chip-coils instead of the microstrip lines TrL1 and TrL2 Improved stabilization behaviour versus temperature and reduced variation in amplifier performance due to the device‘s Beta (current gain) distribution can be achieved by using an active bias circuit. Su ...
... The layout size can be reduced by using chip-coils instead of the microstrip lines TrL1 and TrL2 Improved stabilization behaviour versus temperature and reduced variation in amplifier performance due to the device‘s Beta (current gain) distribution can be achieved by using an active bias circuit. Su ...
Second Order Circuits I
... The circuit shown below has reached steady state at t = 0-. If the make-before-break switch moves to position b at t = 0, calculate i(t) for t > 0. • Please refer to lecture or textbook for more detail elaboration. Answer: i(t) = e–2.5t[5cos1.6583t – 7.538sin1.6583t] A ...
... The circuit shown below has reached steady state at t = 0-. If the make-before-break switch moves to position b at t = 0, calculate i(t) for t > 0. • Please refer to lecture or textbook for more detail elaboration. Answer: i(t) = e–2.5t[5cos1.6583t – 7.538sin1.6583t] A ...
dielectric strength
... DIELECTRIC CONSTANT (PERMITIVITY) CASE STUDY : Effect of temperature on Dielectric constant (loss factor) ...
... DIELECTRIC CONSTANT (PERMITIVITY) CASE STUDY : Effect of temperature on Dielectric constant (loss factor) ...
HMC544 / 544E
... should be generated with proper RF circuit design techniques. Signal lines at the RF port should have 50 ohm impedance and the package ground leads should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Microwa ...
... should be generated with proper RF circuit design techniques. Signal lines at the RF port should have 50 ohm impedance and the package ground leads should be connected directly to the ground plane similar to that shown above. The evaluation circuit board shown above is available from Hittite Microwa ...
Engineering Skills - Electrical and Electronic (June 2008) Part 2hot!
... Mains voltage is usually 230 Volt in the UK and power cables are designed to carry mains voltages and currents or greater. Mains cables Two-core and three-core power cables – usually called mains cables – are used to connect appliances to the public mains supply via a 13A plug and socket. Since main ...
... Mains voltage is usually 230 Volt in the UK and power cables are designed to carry mains voltages and currents or greater. Mains cables Two-core and three-core power cables – usually called mains cables – are used to connect appliances to the public mains supply via a 13A plug and socket. Since main ...
Logic Design Board
... Most of electrical engineering students are introduced to logic circuit design as one of the first classes in their undergrad curriculum. Having to learn logic design techniques as well as working with actual chips can become very overwhelming for some students. We realized that many young students ...
... Most of electrical engineering students are introduced to logic circuit design as one of the first classes in their undergrad curriculum. Having to learn logic design techniques as well as working with actual chips can become very overwhelming for some students. We realized that many young students ...
32 LED-es Knight Rider Villogó PIC-el
... very fast rate so that the LEDs appear to be continuously lit rather than only being on for some of the time. This system of driving the LEDs is called "multiplexing". Its big advantage is that it saves power and drastically reduces the number of connections required. If the LEDs were not multi-plex ...
... very fast rate so that the LEDs appear to be continuously lit rather than only being on for some of the time. This system of driving the LEDs is called "multiplexing". Its big advantage is that it saves power and drastically reduces the number of connections required. If the LEDs were not multi-plex ...
PCB Layout Guidelines - Dialog Semiconductor
... Care should be taken not to cut up the VDD plane with plated-through holes. Using micro/laser vias for ground connections helps reduce this cut-up as they are smaller and do not affect the inner layers. Many PCB layouts feature a micro-via stitching ring around the outside of the PCB. This helps red ...
... Care should be taken not to cut up the VDD plane with plated-through holes. Using micro/laser vias for ground connections helps reduce this cut-up as they are smaller and do not affect the inner layers. Many PCB layouts feature a micro-via stitching ring around the outside of the PCB. This helps red ...
2005 Residential Wireman Renewal Exam #1
... Fire pump supply conductors on the load side of the final disconnecting means and overcurrent device(s) are permitted to be routed through a building if: a. Encased in at least 2” of brick. b. Installed in conduits or raceways with lighting and power conductors. c. Concealed within walls, floors, or ...
... Fire pump supply conductors on the load side of the final disconnecting means and overcurrent device(s) are permitted to be routed through a building if: a. Encased in at least 2” of brick. b. Installed in conduits or raceways with lighting and power conductors. c. Concealed within walls, floors, or ...
Evaluates: MAX1561 MAX1561 Evaluation Kit General Description Features
... that the EV kit can be used without a connection to CTRL. With JU1 shorted and no other connection to CTRL, the LEDs are set to full brightness. If CTRL is being driven, the shunt across JU1 can be removed. Remove the jumper across JU1 when measuring quiescent current with the circuit in shutdown mo ...
... that the EV kit can be used without a connection to CTRL. With JU1 shorted and no other connection to CTRL, the LEDs are set to full brightness. If CTRL is being driven, the shunt across JU1 can be removed. Remove the jumper across JU1 when measuring quiescent current with the circuit in shutdown mo ...
Easy-to-build transistor projects
... per with plastic or cotton insulation. Any lead that will undergo repeated flexing is less likely to break if it is of the stranded type. It can also be employed throughout most of the circuit; but solid wire is much easier to crimp onto a solder lug or terminal strip. Enamel -covered wire (used for ...
... per with plastic or cotton insulation. Any lead that will undergo repeated flexing is less likely to break if it is of the stranded type. It can also be employed throughout most of the circuit; but solid wire is much easier to crimp onto a solder lug or terminal strip. Enamel -covered wire (used for ...
Circuit Note
... Note that the reference resistor, RREF, should be a precision 5.6 kΩ (±0.1%). The USB interface to the ADuCM360/ADuCM361 is implemented with an FT232R UART to USB transceiver, which converts USB signals directly to the UART. In addition to the decoupling shown Figure 1, the USB cable itself must hav ...
... Note that the reference resistor, RREF, should be a precision 5.6 kΩ (±0.1%). The USB interface to the ADuCM360/ADuCM361 is implemented with an FT232R UART to USB transceiver, which converts USB signals directly to the UART. In addition to the decoupling shown Figure 1, the USB cable itself must hav ...
MAX5976B Evaluation Kit Evaluates: General Description Features
... 3) Turn on the power supply and set the supply to 12V, then disable the power supply. 4) Connect the positive terminal of the power supply to the VIN banana jack on the EV kit. Connect the negative terminal of the power supply to the GND banana jack. 5) Enable the power supply. 6) Verify that th ...
... 3) Turn on the power supply and set the supply to 12V, then disable the power supply. 4) Connect the positive terminal of the power supply to the VIN banana jack on the EV kit. Connect the negative terminal of the power supply to the GND banana jack. 5) Enable the power supply. 6) Verify that th ...
AN 043 1/9 E521.14 CAN/LIN SBC WITH DC/DC BUCK
... VDD2 enable – close 1-2 to activate the internal LDO and provide VDD2 to the board and/or external load. Open to disable VDD2. A open Jumper could be over-written by X31.A7 ...
... VDD2 enable – close 1-2 to activate the internal LDO and provide VDD2 to the board and/or external load. Open to disable VDD2. A open Jumper could be over-written by X31.A7 ...
MAX3643 Evaluation Kit Evaluates: General Description Features
... a burst-off period, the voltage at MDIN is sampled and then mirrored at MDOUT during the burst-off period. If the monitor diode has a high bandwidth, the MDIN voltage falls significantly while being sampled, resulting in a lower/inaccurate voltage at MDOUT. To compensate for this, solder a capacitor ...
... a burst-off period, the voltage at MDIN is sampled and then mirrored at MDOUT during the burst-off period. If the monitor diode has a high bandwidth, the MDIN voltage falls significantly while being sampled, resulting in a lower/inaccurate voltage at MDOUT. To compensate for this, solder a capacitor ...
07_AVR_SHOT_2009_RevC (PPTmin)
... Board Safety: Caution: Many of the components used in this workshop are sensitive to electrostatic discharge (ESD). Please ensure that you are wearing your protective wrist strap at all times. There will be a warning slide when components are ESD and heat sensitive. ...
... Board Safety: Caution: Many of the components used in this workshop are sensitive to electrostatic discharge (ESD). Please ensure that you are wearing your protective wrist strap at all times. There will be a warning slide when components are ESD and heat sensitive. ...
High Voltage Fuses
... occurrence of a short-circuit fault. The same function can also be performed by a fuse, though with lesser reliability and efficiency. ...
... occurrence of a short-circuit fault. The same function can also be performed by a fuse, though with lesser reliability and efficiency. ...
CuVerro Brochure
... CuVerro® is a new type of touch surface material designed specifically for areas where cleanliness is a concern. ...
... CuVerro® is a new type of touch surface material designed specifically for areas where cleanliness is a concern. ...
BDTIC www.BDTIC.com/infineon AN2011-04 MA3L080E07_EVAL Evaluation Adapter Board for EconoPACK
... board F3L020E07-F-P_EVAL or could be a complementary part for an existing customer driver solution. For more details about the 3-Level topology, please refer to [1]. The board is available from Infineon in small quantities. The properties of this part are described in the datasheet chapter of this d ...
... board F3L020E07-F-P_EVAL or could be a complementary part for an existing customer driver solution. For more details about the 3-Level topology, please refer to [1]. The board is available from Infineon in small quantities. The properties of this part are described in the datasheet chapter of this d ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.