EMIF06-MSD02N16
... squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. ...
... squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. ...
How to build the Seth PP2A3
... About 90% of the amp building time is spent on the chassis (both wood and metal work). I usually start by covering the top plate with masking tape and try out different layout that will be both functional and aesthetic (at least to me…). Figure 9 illustrate this process. Once the lay out is figured ...
... About 90% of the amp building time is spent on the chassis (both wood and metal work). I usually start by covering the top plate with masking tape and try out different layout that will be both functional and aesthetic (at least to me…). Figure 9 illustrate this process. Once the lay out is figured ...
Generic Stress Factors and De-rating
... Components are the basic elements for developing electronic equipment, and the data sheets of manufacturers are used for selecting the components. The data sheets specify maximum ratings and electrical characteristics for components. The parameters of maximum ratings are the reliability-related stre ...
... Components are the basic elements for developing electronic equipment, and the data sheets of manufacturers are used for selecting the components. The data sheets specify maximum ratings and electrical characteristics for components. The parameters of maximum ratings are the reliability-related stre ...
Rapid LED NanoCube 28 HQI Retrofit
... which has a very high probability of creating a short/intermittent connection, which has a high probability of destroying all of your LEDs. You should at most take 1-5 seconds to complete each solder joint. Leaving the iron touching a solder pad for longer than that is not advised. It also probably ...
... which has a very high probability of creating a short/intermittent connection, which has a high probability of destroying all of your LEDs. You should at most take 1-5 seconds to complete each solder joint. Leaving the iron touching a solder pad for longer than that is not advised. It also probably ...
Basic Electrical Wiring
... protect an electrical circuit from damage caused by overload or short circuit. • Its basic function is to detect a fault condition and, by interrupting continuity, to immediately discontinue electrical flow. • Unlike a fuse, which operates once and then has to be replaced, a circuit breaker can be r ...
... protect an electrical circuit from damage caused by overload or short circuit. • Its basic function is to detect a fault condition and, by interrupting continuity, to immediately discontinue electrical flow. • Unlike a fuse, which operates once and then has to be replaced, a circuit breaker can be r ...
Linear Transverters for 144 and 220 Mhz
... This transverter is built in a modular fashion. All of the major circuit blocks are built into separate enclosures and interconnected by 50-ohm coaxial cable. Modular construction lends itself to on-the-air experimentation and development, as well as simple troubleshooting. Any stage may be removed ...
... This transverter is built in a modular fashion. All of the major circuit blocks are built into separate enclosures and interconnected by 50-ohm coaxial cable. Modular construction lends itself to on-the-air experimentation and development, as well as simple troubleshooting. Any stage may be removed ...
HMC284MS8G / 284MS8GE
... 1. Set A/B control to 0/+5V, Vdd = +5V and use HCT series logic to provide a TTL driver interface. 2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd = +5 Volts applied to the CMOS logic gates. 3. DC blocking capacitors are required for each RF port as shown. Capacitor value ...
... 1. Set A/B control to 0/+5V, Vdd = +5V and use HCT series logic to provide a TTL driver interface. 2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd = +5 Volts applied to the CMOS logic gates. 3. DC blocking capacitors are required for each RF port as shown. Capacitor value ...
HMC284MS8G(E)
... 1. Set A/B control to 0/+5V, Vdd = +5V and use HCT series logic to provide a TTL driver interface. 2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd = +5 Volts applied to the CMOS logic gates. 3. DC blocking capacitors are required for each RF port as shown. Capacitor value ...
... 1. Set A/B control to 0/+5V, Vdd = +5V and use HCT series logic to provide a TTL driver interface. 2. Control inputs A/B can be driven directly with CMOS logic (HC) with Vdd = +5 Volts applied to the CMOS logic gates. 3. DC blocking capacitors are required for each RF port as shown. Capacitor value ...
FEATURES GENERAL DESCRIPTION
... By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the An ...
... By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the An ...
Analog Devices Welcomes Hittite Microwave Corporation
... The HMC321LP4 & HMC321LP4E are broadband nonreflective GaAs MESFET SP8T switches in low cost leadless surface mount packages. Covering DC to 8 GHz, this switch offers high isolation and low insertion loss. This switch also includes an on board binary decoder circuit which reduces the required logic ...
... The HMC321LP4 & HMC321LP4E are broadband nonreflective GaAs MESFET SP8T switches in low cost leadless surface mount packages. Covering DC to 8 GHz, this switch offers high isolation and low insertion loss. This switch also includes an on board binary decoder circuit which reduces the required logic ...
Varistors MLA Automotive Datasheet
... Series is typically applied to protect integrated circuits and other components at the circuit board level. The wide operating voltage and energy range make the MLA Automotive Series suitable for numerous applications on power supply, control and signal lines. The MLA Automotive Series is manufactur ...
... Series is typically applied to protect integrated circuits and other components at the circuit board level. The wide operating voltage and energy range make the MLA Automotive Series suitable for numerous applications on power supply, control and signal lines. The MLA Automotive Series is manufactur ...
Evaluation Board User Guide UG-116
... By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the An ...
... By using the evaluation board discussed herein (together with any tools, components documentation or support materials, the “Evaluation Board”), you are agreeing to be bound by the terms and conditions set forth below (“Agreement”) unless you have purchased the Evaluation Board, in which case the An ...
CHAPTER VI ELECTRICAL COMPONENTS September 2004
... perform their safety function in those harsh environments after the effects of inservice aging. 10 CFR 50.49 requires that the effects of significant aging mechanisms be addressed as part of environmental qualification. Components in the EQ program have a qualified life, and the components are repla ...
... perform their safety function in those harsh environments after the effects of inservice aging. 10 CFR 50.49 requires that the effects of significant aging mechanisms be addressed as part of environmental qualification. Components in the EQ program have a qualified life, and the components are repla ...
LM50 and LM50-Q1 SOT-23 Single-Supply Centigrade Temperature
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
Dielectric Materials Model Questions:
... Unit – IV : Problems on Dielectric Materials 01/CR120 A parallel plate capacitor consists of two plates of area 500 sq.cm separated by a thin sheet of mica of thickness 0.075 mm. If the Є of mica ~ 6.5, then calculate the capacitance value. [Ans. 0.0383 μF] 02/BG162 Esti ...
... Unit – IV : Problems on Dielectric Materials 01/CR120 A parallel plate capacitor consists of two plates of area 500 sq.cm separated by a thin sheet of mica of thickness 0.075 mm. If the Є of mica ~ 6.5, then calculate the capacitance value. [Ans. 0.0383 μF] 02/BG162 Esti ...
80m Receiver Version 4
... solderability, the jack is held in place, and soldered to the frame with plenty of solder. Instead of the DIN-jack a standard 3,5 mm headphone jack could be used. In this case a small toggle switch must be mounted beside the phone jack (to turn the receiver on/off). Now the PCBs are prepared. The di ...
... solderability, the jack is held in place, and soldered to the frame with plenty of solder. Instead of the DIN-jack a standard 3,5 mm headphone jack could be used. In this case a small toggle switch must be mounted beside the phone jack (to turn the receiver on/off). Now the PCBs are prepared. The di ...
FEATURES DEVICE DESCRIPTION
... ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken ...
... ESD (electrostatic discharge) sensitive device. Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken ...
maintenance instruction premium 10501
... The actuator lens of the unit is an optical component that is exposed to the environment. The environmental conditions in Juke-Box applications is not comparable with normal home use. For example, the nicotine from cigarette smoke can soil the lens. This might influence the playability of the system ...
... The actuator lens of the unit is an optical component that is exposed to the environment. The environmental conditions in Juke-Box applications is not comparable with normal home use. For example, the nicotine from cigarette smoke can soil the lens. This might influence the playability of the system ...
MIC Technology Applications of High Conductivity Traces in Thin
... Although much of the previous discussion refers to selectively thickened copper traces, MIC Technology has the ability to apply selective thick gold plating to lines as well. As noted in Table 2, 600 µin gold has a sheet resistance of about 1.5 mΩ. This approach is 4 times less resistive than standa ...
... Although much of the previous discussion refers to selectively thickened copper traces, MIC Technology has the ability to apply selective thick gold plating to lines as well. As noted in Table 2, 600 µin gold has a sheet resistance of about 1.5 mΩ. This approach is 4 times less resistive than standa ...
EMI Shielding Solutions
... magnetic field surrounding a current-carrying wire into a much higher permeable medium, then part of the magnetic field is converted into heat (an exothermic process in which the potential EMI is absorbed). ...
... magnetic field surrounding a current-carrying wire into a much higher permeable medium, then part of the magnetic field is converted into heat (an exothermic process in which the potential EMI is absorbed). ...
W. Rieutort-Louis, J. Sanz-Robinson, T. Moy, L.C. Huang, Y.Z. Hu, Y. Afsar, J.C. Sturm, N. Verma, S. Wagner, "Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems", IEEE Trans. Components Packaging Manufacturing Tech. Vol. 5, pp. 1219-1229 (2015).
... alignment of devices and circuits on plastic substrates, which, however, are not dimensionally stable. The robustness against misalignment is discussed in Section V. A particular advantage of large-area electronics is the ability to form diverse transducers with high spatial resolution and large exp ...
... alignment of devices and circuits on plastic substrates, which, however, are not dimensionally stable. The robustness against misalignment is discussed in Section V. A particular advantage of large-area electronics is the ability to form diverse transducers with high spatial resolution and large exp ...
Ultra-Compact Power Conversion Based on a CMOS
... construction yielded the highest inductance. Inductors were characterized both by impedance analysis as well as in a prototype buck DC-DC conversion circuit. When the converter was operated at 5 MHz, peak efficiency of 82% and an efficiency of 80% at a load current of 2.5A and output voltage of 2V w ...
... construction yielded the highest inductance. Inductors were characterized both by impedance analysis as well as in a prototype buck DC-DC conversion circuit. When the converter was operated at 5 MHz, peak efficiency of 82% and an efficiency of 80% at a load current of 2.5A and output voltage of 2V w ...
Printed circuit board
A printed circuit board (PCB) mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate. PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). Multi-layer PCBs allow for much higher component density. Conductors on different layers are connected with plated-through holes called vias. Advanced PCBs may contain components - capacitors, resistors or active devices - embedded in the substrate.FR-4 glass epoxy is the primary insulating substrate upon which the vast majority of rigid PCBs are produced. A thin layer of copper foil is laminated to one or both sides of an FR-4 panel. Circuitry interconnections are etched into copper layers to produce printed circuit boards. Complex circuits are produced in multiple layers. Printed circuit boards are used in all but the simplest electronic products. Alternatives to PCBs include wire wrap and point-to-point construction. PCBs require the additional design effort to lay out the circuit, but manufacturing and assembly can be automated. Manufacturing circuits with PCBs is cheaper and faster than with other wiring methods as components are mounted and wired with one single part. Furthermore, operator wiring errors are eliminated.When the board has only copper connections and no embedded components, it is more correctly called a printed wiring board (PWB) or etched wiring board. Although more accurate, the term printed wiring board has fallen into disuse. A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB assembly (PCBA). The IPC preferred term for assembled boards is circuit card assembly (CCA), and for assembled backplanes it is backplane assemblies. The term PCB is used informally both for bare and assembled boards.The world market for bare PCBs reached nearly $60 billion in 2012.