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Transcript
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Capacitor and EMI Considerations for New High Frequency
Switching Regulators – Design Note 95
Carl Nelson and Bob Essaff
Capacitor Technology Considerations
At lower frequencies, magnetics dominates the size of
DC-to-DC converters, but at frequencies above 200kHz
the largest component is typically the input and output
bypass capacitors. This makes it important to pick the
right capacitor technology in critical size applications.
The most important parameter in choosing the capacitor
is cost versus size and impedance. The input and output
capacitors must have low impedance at the switching
frequency to limit voltage ripple and power dissipation.
It is also desirable to have low impedance at much higher
frequencies because high amplitude narrow spikes are
created if the capacitor has even a few nH of inductance.
The amplitude of these spikes is determined by the
rate-of-rise of current (dl/dt) fed to the capacitor. For
a high speed converter, dl/dt may be as high as 0.5A/
ns. Even 3nH of capacitor lead inductance will create
(0.5 e9) (3 e–9) = 1.5V spikes. The second part of this
Design Note shows how to attenuate these spikes using
parasitic PC board elements.
Figure 1 details the impedance characteristics of the
most popular switching regulator capacitors. These
are aluminum electrolytic, solid tantalum, OS-CON, and
ceramic. Within one technology, impedance at lower
frequencies tends to closely track physical volume of the
capacitor, with larger volume giving lower impedance.
Aluminum electrolytics perform poorly and are rarely
used at frequencies above 100kHz, but their low cost
and higher voltage capability may cause them to be
used for input bypass applications.
01/95/95_conv
1
0.3
IMPEDANCE (Ω)
The LT®1372 family of boost and flyback converters
and the LT1376 buck converter form a new line of high
frequency switching regulators offered by Linear Technology. Up to 10 times faster (250kHz to 1MHz) than
older devices, these new converters are actually more
efficient than older designs. Several design considerations for high frequency switchers are discussed here.
10μF, 16V
OS-CON
180μF, 10V
SM ALUM ELEC
GENERIC SOLID
TANT, E CASE
AVX TPS
TANT, E CASE
0.1
0.03
100μF, 35V
LG ALUM ELEC
47μF, 10V
OS-CON
5nH LINE
0.01
0.03
0.10
1
0.30
FREQUENCY (MHz)
1nH
LINE
10μF
CERAMIC
3
10
DN94 • F01
Figure 1. Capacitor Impedance
Solid tantalum capacitors offer small size, low impedance, and low Q (to prevent loop stability problems).
The down side of tantalum is limited voltage, typically
50V maximum, and a tendency for a small percentage
of units to self-destruct when subjected to very high
turn-on surge currents. AVX addresses the problem with
their TPS line which features more rugged construction
and special surge testing. Even TPS units must be voltage derated by 2:1 if high turn-on surges are expected,
limiting practical operating voltage to 25V. Even with
their shortcomings, solid tantalum seems to be the
technology of choice for medium to high frequency
DC-to-DC converters.
OS-CON capacitors from Sanyo and Marcon are made
with a semiconductor-like dielectric that gives very low
impedance per unit volume. They greatly outperform
aluminum units, but have a few pitfalls of their own.
Maximum voltage is 25V, height is significantly greater
than solid tantalum, and most units are not surface
mount. The very low ESR (effective series resistance)
of OS-CON capacitors can also cause a problem with
loop stability in switching regulators.
Ceramic capacitors offer the lowest impedance at
500kHz and beyond, but they suffer from high cost,
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks
of Linear Technology Corporation. All other trademarks are the property of their
respective owners.
large footprint, and limited temperature range. They
are probably best suited for input bypassing at higher
voltages, and very high frequency (≥1MHz) applications.
Note that at high frequencies, most of the capacitors
approach an inductive line of about 1nH to 5nH. Smaller
units in parallel will reduce effective inductance, but
cost goes up.
Controlling EMI: Conducted and Radiated
EMI strikes terror into system designers because its
causes and cures are not well understood. There are
two separate issues involved; meeting external FCC
standards and avoiding internal system malfunctions.
Higher frequency switching regulators would seem to
make the whole problem much worse, but there are
several mitigating circumstances that have allowed
nearly all systems to use high frequency converters
with few problems.
Contrary to popular misconceptions, older switching
regulators rarely were a major contributor to overall
system noise problems if the system contained reasonable amounts of logic chips. The noise created by
a microprocessor, databusses, clock drivers, etc. usually swamps out switcher noise. This can be seen very
simply by connecting a linear regulator temporarily in
place of the switcher. Radiated noise using standard
FCC methods, and supply line noise often show almost
no change when the switcher is turned off.
The second reason for reduced high frequency switcher
noise problems is that the components used are physically smaller. Radiated noise is proportional to radiating
line length, so smaller, tightly packed components radiate
significantly less.
Conducted EMI usually makes its appearance as ripple
current fed back into the input supply, or as ripple voltage at the regulator output. Figure 2 shows how both of
these effects can be virtually eliminated by using parasitic
inductance in input or output lines. At 500kHz each inch
of board trace represents nearly 0.1Ω of reactance, and
for the higher harmonics the impedance is much higher.
This impedance can be used in combination with existing
capacitors to create “free” filter action.
HIGH FREQUENCY CONVERTER
LUMPED
LOW
SOURCE
RIPPLE
CURRENT INDUCTANCE
INPUT
CURRENT
WITH RIPPLE
OUTPUT
LUMPED
VOLTAGE
OUTPUT
WITH RIPPLE INDUCTANCE
AND SPIKES
EXISTING INPUT
CAPACITOR
LOAD
LOAD
BYPASS
CAPACITOR
DN94 • F02
Figure 2. Free High Frequency Filters Using Parasitics
Linear Technology Corporation
At the input, as shown in Figure 3, the switching ripple
current will all disappear into the input bypass capacitor if the reactance in the input lines is large compared
to the capacitor impedance. For instance, an OS-CON
33μF, 20V capacitor has an impedance of about 0.02Ω
at 500kHz. If the supply lines have an effective length
of six inches (input plus return), the line reactance will
be about 0.6Ω at 500kHz. The fundamental of the ripple
current will be attenuated by the ratio of line impedance to capacitor impedance = 0.6/0.02 = 30:1. Higher
harmonics will virtually disappear.
CONVERTER INPUT
CURRENT RIPPLE
V = 500mA/DIV
0V
SMOOTHED RIPPLE CURRENT
AT INPUT SUPPLY
V = 500mA/DIV
0A
H = 500ns/DIV
Figure 3
Output ripple can be filtered by utilizing the reactance of
output lines in conjunction with load bypass capacitors
as shown in Figure 4. With two inches of output trace
(0.16Ω at 500kHz) and 0.15Ω capacitor impedance,
fundamental ripple will be attenuated by two-to-one
and output noise spikes virtually eliminated. The Fourier
components of these spikes start above 25MHz where
line reactance is 4Ω per inch.
CONVERTER OUTPUT
CURRENT RIPPLE
WITH SPIKES
V = 200mA/DIV
REDUCED VOLTAGE
RIPPLE AND SPIKES
AT THE LOAD
V = 200mA/DIV
H = 500ns/DIV
Figure 4
A common cause of radiated noise is the use of “open
core” magnetics. The lowest cost high frequency inductors are wound on ferrite rods or barrels, which do not
have a closed magnetic field path. This generates large
local B fields that can play havoc with sensitive low level
circuitry such as disk drives, A-to-D converters, and IF
strips. Each application needs to be evaluated separately,
but in situations where low signal levels exist in close
proximity to the converter, closed core magnetics such
as toroids or E cores should be used until extensive
system level testing has proved out a cheaper solution.
dn95f_conv LT/GP 0195 160K • PRINTED IN THE USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507 ● www.linear.com
© LINEAR TECHNOLOGY CORPORATION 1995