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Project Name Features: Diagram/Schematics: This section should be filled with brief points describing the main features of the design and emphasizing what is unique about it compared to similar designs in the market, e.g. This section provides any pin I/o diagrams, high level block diagrams and schematics that will assist the understanding of the design description in the next section. An example of a block diagram is shown in Figure 2. • Overload Protection on the Input and Output No Latch-Up When the Common Mode Range is Exceeded Package Types: What are the packaging requirements for this design? Number of pins? Package type? Figure 1 shows an example of packaging details. Description: This section provides a high level description of the internal operational details of the design, which will assist the reviewers to get a better understanding of the design, its complexity, its importance and impact to the market/society. It can also include operational ranges (voltage, temperature,…etc). Fig. 1 Package Types Testing Methodology: What is the expected testing methodology? Will testing be done in-house (by your team)? Or will it be outsourced? If so, where? Patents/Publications: Fig. 2 Block diagram for the project description Applications: This section mentions any pending/issue patents or publications related to the design(s) within this project. Also, if the results of this project are to be published, which conferences/journals are you targeting? This section describes: In which fields/products will this design be used? Who are the target users? What is the market size? Will this design be provided as a soft /hard IP or as an end product? How will this impact the market/society? References: This section contains any references used within the description of this project.