Download DE Vocabulary Unit 1.1 - Stratford High School

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Transcript
DE Vocabulary
y
Unit 1.1
Capacitor - An electrical device used to
store electrical charge.
Cold Solder Joint - A solder connection
that is characterized by a grayish,
porous appearance
p
pp
due to excessive
impurities in the solder, inadequate
cleaning prior to soldering
soldering, and/or the
insufficient application of heat during
soldering.
soldering
Digital Multimeter - Electronic test
equipment that can perform multiple
tasks. Typically
yp
y one capable
p
of
measuring voltage, current, and
resistance More sophisticated modern
resistance.
digital multimeters also measure
capacitance inductance
capacitance,
inductance, current gain
of transistors, and/or anything else
th t can b
that
be measured
d electronically.
l t i ll
Diode - A two terminal device that
conducts in only one direction.
Dual In-Line Package (DIP) - A very
common IC package with two parallel
rows of p
pins intended to be inserted
into a socket of through holes drilled in
a printed circuit board
board.
Engineering Notation - A floating point
system in which numbers are
expressed
p
as p
products consisting
g of a
number greater than one multiplied by
an appropriate power of ten that is
some multiple of three.
Fuse - A protective device in the current
path that melts or breaks when current
exceeds a p
predetermined maximum
value.
LED - Light-emitting diode. An electronic
device that conducts current in one
direction onlyy and illuminates when it
is conducting.
Plastic Leaded Chip Carrier (PLCC) A square IC package with leads on all
four sides designed
g
for surface
mounting on a circuit board.
Printed Circuit Board - Insulating
board containing conductive tracks for
circuit connections.
Resistor - Component made of material
that opposes flow of current and
therefore has some value of
resistance.
Resistor Color Code - Coding system
of colored stripes on a resistor to
indicate the resistor's value and
tolerance.
Scientific Notation - Numbers entered
as a number from one to ten multiplied
byy a p
power of ten.
SI Notation - Abbreviation of System
International, a system of practical
units based on the meter, kilogram,
g
second, ampere, Kelvin, mole, and
candela.
candela
Seven-Segment Display - An array of
seven independently controlled lightemitting
g diodes ((LED)) or liquid
q
crystal
y
display (LCD) elements, shaped like a
figure-8
figure
8, which can be used to display
decimal digits and other characters by
turning on the appropriate elements
elements.
Small Outline IC (SOIC) - An IC
package similar to a DIP, but smaller,
which is designed
g
for automatic
placement and soldering on the
surface of a circuit board
board.
Solder - Metallic alloy of tin and lead
that is used to join two metal surfaces.
Solder Bridge - The unwanted
formation of a conductive path of
solder between conductors.
Soldering - Process of joining two
metallic surfaces to make an electrical
contact byy melting
g solder ((usually
y tin
and lead) across them.
Soldering Iron - Tool with an internal
heating element used to heat surfaces
being
g soldered to the p
point where the
solder becomes molten.
Tinning - The process of applying a thin
coat of solder to materials prior to their
being
g soldered; for example,
p
application of a light coat of solder to
the filaments of a conductor to hold
the filaments in place prior to soldering
the conductor
conductor.
Transistor - Term derived from "transfer
resistor." Semiconductor device that
can be used as an amplifier
p
or as an
electronic switch.