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Transcript
Electronics Cooling MPE 635 Mechanical Power Engineering Dept. Course Goals 1. To establish fundamental understanding of heat transfer in electronic equipment. 2. To select a suitable cooling processes for electronic components and systems. 3. To increase the capabilities of post-graduate students in design and analysis of cooling of electronic packages. 4. To analysis the thermal failure for electronic components and define the solution. • Part-A • Main topics • Introduction to electronics cooling and thermal packaging • Introduction to basic modes of heat transfer • Conduction heat transfer and extended surfaces in electronic devices • Transient conduction • Natural convection heat transfer (i.e. PCB cooling) • Forced convection heat transfer (Internal and External flow ) • Fan performance • Radiation heat transfer and its applications in electronic devices • Solving the electronics cooling problems with EES software • Electronics cooling problems • Solution of selected electronics cooling problems 2. Packaging Trends and Thermal Management options in the Electronic Industry Electronic Packaging and Interconnection Technology • Electronics • Materials properties and materials compatibility • Mechanics • Chemistry • Metallurgy • Production technology • Heat transfer • Reliability, etc Types of Electronics and Demands on Them Electronic product Production Volume Life/ reliability Weight and Power Acceptable Development cost Comments Satellite electronics one unit 20 years low weight and power very high acceptable no repair medical electronics medium 20 years low weight and power very high acceptable harsh environment Telephone main switchboard low and high 10 years Variable high price pressure benign environment High very rough environment Military electronics Very high reliability Computers low and high Very short product life Consumer products very big market very short product life High performance and reliability low weight and power Extreme price pressure No repair. Packaging Levels • Level 0: Bare semiconductor (unpackaged). • Level 1: Packaged semiconductor or packaged electronic functional device. • Level 2: Printed wiring assembly (PWA). • Level 3: Electronic subassembly. Packaging Levels • • Level 4: Electronic assembly. Level 5: System. This refers to the completed product. Package Function • Signal distribution • Power Delivery • Thermal management • Gentle environment • Minimum signal delay • Minimum cost Stages in the Development of a Packaging Technology • • • • • • Environment Building blocks Enabling technology Modeling and simulation Comparison to specifications Preparation for manufacturing Environment Device and chip technology System Architecture System Specifications Manufacturing and field Support Building Blocks Single Chip Package Chip on Board Multi-Chip Module Stages in the Develop ment of a Packagin g Technolo gy Enabling Technologies Package attach "PowerSignal-Mechanical" Chip attach "Power-SignalMechanical" Thermal Control Technique Mechanical Components Substrate Material and Chip Protection Substrate connect "Power-SignalMechanical" Modeling and Simulation Simulation Tools Comparison to specification SCP Performance COB Performance MCM Performance Iteration ≠ = Preparation for fabrication Manufacturing Drawings Product Categories • Commodity <$300; disk drives, displays, micro-controllers, boom-boxes, VCR’s • Hand-Held < $1000 ; PDA’s, cellular phones • Cost/Performance <$3000; PC’s and Notebooks • High-Performance > $3000; Workstations, Servers, Supercomputers • Harsh Environment; Automotive • Memory; DRAMs, SRAMs Thermal Packaging Strategies • Commodity & Memory: - Natural Convection • Hand-Held: - Natural Convection + Spreaders Thermal Packaging Strategies • Cost/Performance: - PC - Forced-Air Heat Sinks, Fan-Sinks - Notebooks - Heat Pipe Spreaders, Fans, Heat Sinks Thermal Packaging Strategies • High-Performance: - Forced-Air Heat Sinks; Water-Cooled Cold Plates; Refrigeration; Immersion • Harsh Environment: - Forced Air Heat Sink Automotive Electronics Electronic content in cars and trucks has significantly increased in the last 30 years. Much of the functional content of these vehicles is now generated or controlled by electronic systems. History of typical engine control modules (ECMs) Examples of thermal requirements for various products • Cost/Performance 2004 Microprocessor Thermal Requirements - Power Dissipation - 200W Temperatures: Junct = 95C; Ambient = 45C Chip Size - 15mm x 15mm 0.3mm Thermal “Space Claim” - 100 x 100 x 50mm Thermal “Mass Claim” - 250gm Flow Parameters: Pressure Drop = 40Pa (0.15”H2O), 40cfm Examples of thermal requirements for various products • Cost/Performance 2004 RF Chip Thermal Requirements - Power Dissipation - 100W Temperatures: Junct = 150C; Ambient = 45C Chip Size - 3mm x 1mm 0.3mm Wireless Module = 10 Chips, 1kW Thermal “Space Claim” - 150 x 150 x 150mm Thermal Resistances: Spreading (Chip Level) = 0.6K/W Internal Convective (Chip Level) = 0.2K/W External Convective (Module Level) = 0.25K/W Thermal Packaging, Future Forecasting • Future Thermal Packaging Needs - • Higher Power Dissipation Higher Volumetric Heat Density Market-Driven Thermal Solutions Air as the Ultimate Heat Sink Environmentally-Friendly Design Future Thermal Packaging Solutions - Thermo-fluid Modeling Tools Integrated Packaging CAD Compact Heat Exchanger Technology Design for Manufacturability/Sustainability “Commodity” Refrigeration Technology Thermal Packaging Options and Trends Aims of thermal control • PREVENT CATASTROPHIC FAILURE - Electronic Function - Structural Integrity • PROVIDE ACCEPTABLE MICROCLIMATE - Device Reliability - Packaging Reliability - Prevent Fatigue, Plastic Deformation and Creep • SYSTEM OPTIMIZATION - Fail Safe or Graceful Degradation - Multilevel Design - Reduction of “Cost of Ownership”