• Study Resource
  • Explore
    • Arts & Humanities
    • Business
    • Engineering & Technology
    • Foreign Language
    • History
    • Math
    • Science
    • Social Science

    Top subcategories

    • Advanced Math
    • Algebra
    • Basic Math
    • Calculus
    • Geometry
    • Linear Algebra
    • Pre-Algebra
    • Pre-Calculus
    • Statistics And Probability
    • Trigonometry
    • other →

    Top subcategories

    • Astronomy
    • Astrophysics
    • Biology
    • Chemistry
    • Earth Science
    • Environmental Science
    • Health Science
    • Physics
    • other →

    Top subcategories

    • Anthropology
    • Law
    • Political Science
    • Psychology
    • Sociology
    • other →

    Top subcategories

    • Accounting
    • Economics
    • Finance
    • Management
    • other →

    Top subcategories

    • Aerospace Engineering
    • Bioengineering
    • Chemical Engineering
    • Civil Engineering
    • Computer Science
    • Electrical Engineering
    • Industrial Engineering
    • Mechanical Engineering
    • Web Design
    • other →

    Top subcategories

    • Architecture
    • Communications
    • English
    • Gender Studies
    • Music
    • Performing Arts
    • Philosophy
    • Religious Studies
    • Writing
    • other →

    Top subcategories

    • Ancient History
    • European History
    • US History
    • World History
    • other →

    Top subcategories

    • Croatian
    • Czech
    • Finnish
    • Greek
    • Hindi
    • Japanese
    • Korean
    • Persian
    • Swedish
    • Turkish
    • other →
 
Profile Documents Logout
Upload
Developing a 1296 MHz Beacon - Mini-Kits
Developing a 1296 MHz Beacon - Mini-Kits

... Oscillator Module The images are from the output of a 10 GHz source. The equipment consisted of G4DDK004 Crystal Oscillator/Multipliers with RF output on 2.5 GHz. The multipliers are x3,x2,x2,x2 This is then multiplied by a further x4 multiplier to provide output on 10.368 GHz. There is a 78L08 reg ...
Evaluates:  DS1077(L), DS1085(L), DS1086(L) and DS1087(L) DS1070K EconOscillator Programming Kit Features
Evaluates: DS1077(L), DS1085(L), DS1086(L) and DS1087(L) DS1070K EconOscillator Programming Kit Features

... ming kit should be powered to the same voltage level as the application board and the two boards should share a common ground connection. Ensure no devices are installed in the kit board’s sockets because they may cause a 2-wire addressing conflict if present. When the software is started it should ...
ITA04 MKII 50mW green DMX laser User manual - Bax-shop
ITA04 MKII 50mW green DMX laser User manual - Bax-shop

A crystal cleavage mechanism for UHV STM.
A crystal cleavage mechanism for UHV STM.

... semiconductors crystals to prepare the samples. Moreover the position of the sample front surface (relative to the knife) edge is fixed during sample installation. Therefore a geometry size of cleaving crystals is of no importance and restricted only by the size of vice clamp and the spring force. O ...
FAN3111 — Single 1A High-Speed, Low-Side Gate Driver
FAN3111 — Single 1A High-Speed, Low-Side Gate Driver

... and airflow. The value given is for natural convection with no heatsink using a 2S2P board,, as specified in JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate. 5. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction temperature and an a ...
AN10721 Logic level VGS ratings for NXP power MOSFETs
AN10721 Logic level VGS ratings for NXP power MOSFETs

... rating infers a thick gate oxide. In most cases, both requirements can be met whereby gate bias life testing can be performed at a value of 100 % of the absolute maximum rating. However, there are some instances where this is not possible. When logic level devices were first introduced they were des ...
CIRCUIT PROTECTION
CIRCUIT PROTECTION

DMT121 – ELECTRONIC I
DMT121 – ELECTRONIC I

... MOSFET (Metal Oxide Semiconductor Field-Effect Transistor) Different from JFET – no pn junction structure. Gate of MOSFET is insulated from the channel by silicon dioxide (SiO2) layer. 2 types – enhancement and depletion. ...
X04704145151
X04704145151

... organics. Most commercial materials are inorganic especially for high power use. However, organic materials are perceived as being structurally more diverse and therefore are believed to have more long term promise than inorganics. Recent interest is concentrated on metal complexes of organic compou ...
Old Company Name in Catalogs and Other Documents
Old Company Name in Catalogs and Other Documents

... of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others. You shou ...
VBIC Description and Derivation Details
VBIC Description and Derivation Details

Understanding True CMOS Outputs
Understanding True CMOS Outputs

... Today’s integrated digital logic devices trace their roots back to RTL (Resistor-Transistor Logic) components which were pioneered in the 1960s. RTL eventually evolved into DTL (DiodeTransistor Logic) which in turn was followed by TTL. With TTL (Transistor-Transistor Logic) and then ECL (Emitter Cou ...
Cisco`s Routers Cisco Devices
Cisco`s Routers Cisco Devices

a-study-on-the
a-study-on-the

... that the percentage of transmission (85.39%) was enhanced due to doping. This property can be used for optical applications. FTIR analysis identified the functional groups present in the grown single crystals. From the thermal studies, it was found that the doped crystal was stable up to 200°C and h ...
Design Consideration for Boundary Conduction Mode Power Factor
Design Consideration for Boundary Conduction Mode Power Factor

... to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or ...
PDF
PDF

... his colleagues A Multi-Gate transistor incorporates more than one gate in to one single device. To minimize the short channel effect FinFET can be used in place of conventional CMOS circuits [8]. FinFET (fin-type field-effect transistors), an emerging transistor technology that is likely to suppleme ...
fire alarm system record of completion
fire alarm system record of completion

... below, on the date shown below, and were found to be operating properly in accordance with the requirements for the following: Modifications to an existing system All newly modified operational features and functions of the system were tested by, or in the presence of, the signer shown below, on the ...
FIRE ALARM SYSTEM RECORD OF COMPLETION
FIRE ALARM SYSTEM RECORD OF COMPLETION

... below, on the date shown below, and were found to be operating properly in accordance with the requirements for the following: Modifications to an existing system All newly modified operational features and functions of the system were tested by, or in the presence of, the signer shown below, on the ...
NFPA 72 Fire Alarm/Communication Form
NFPA 72 Fire Alarm/Communication Form

... below, on the date shown below, and were found to be operating properly in accordance with the requirements for the following: Modifications to an existing system All newly modified operational features and functions of the system were tested by, or in the presence of, the signer shown below, on the ...
Glossary of Commonly Used Ion Implantation
Glossary of Commonly Used Ion Implantation

... A term referring to a low dose measurement technique using a Four Point Probe (FPP). An infrequent technique used by a few fabs where a high dose (> 5E14 generally) is done on a series of wafers and then annealed and probed. Wafers with good uniformity results are then used for subsequent low dose i ...
AP3436/A Description Pin Assignments
AP3436/A Description Pin Assignments

... modulation (PWM) mode with 1.25MHz switching frequency internally, which allows small-sized components, such as capacitors and inductors. This feature greatly simplifies the design of switchmode power supplies. Under PWM mode, the device remains at the fixed PWM operation (typical at 1.25MHz), regar ...
Comparison of Amorphous Selenium and Amorphous Silicon Flat
Comparison of Amorphous Selenium and Amorphous Silicon Flat

SiC Power Devices and Modules Application Note
SiC Power Devices and Modules Application Note

FAN6224 Synchronous Rectification Controller for Flyback and Forward Freewheeling Rectification
FAN6224 Synchronous Rectification Controller for Flyback and Forward Freewheeling Rectification

... FAN6224 can be applied in Continuous or Discontinuous Conduction Mode (CCM and DCM) and Quasi-Resonant (QR) flyback converters based on a proprietary linear-predict timing-control technique. The benefits of this technique include a simple control method without current-sense circuitry to accomplish ...
Lecture 12-power-examples
Lecture 12-power-examples

... Activity factor: probability a that a node switches 0→1 Define probability Pi that a node is “1” Probability that a node is “0” is then Pi = 1-Pi ai = Pi * Pi Completely random data has P = 0.5 and a = 0.25 Data is often not completely random Data propagating through ANDs and ORs has lower activity ...
< 1 ... 21 22 23 24 25 26 27 28 29 ... 132 >

Semiconductor device



Semiconductor devices are electronic components that exploit the electronic properties of semiconductor materials, principally silicon, germanium, and gallium arsenide, as well as organic semiconductors. Semiconductor devices have replaced thermionic devices (vacuum tubes) in most applications. They use electronic conduction in the solid state as opposed to the gaseous state or thermionic emission in a high vacuum.Semiconductor devices are manufactured both as single discrete devices and as integrated circuits (ICs), which consist of a number—from a few (as low as two) to billions—of devices manufactured and interconnected on a single semiconductor substrate, or wafer.Semiconductor materials are useful because their behavior can be easily manipulated by the addition of impurities, known as doping. Semiconductor conductivity can be controlled by introduction of an electric or magnetic field, by exposure to light or heat, or by mechanical deformation of a doped monocrystalline grid; thus, semiconductors can make excellent sensors. Current conduction in a semiconductor occurs via mobile or ""free"" electrons and holes, collectively known as charge carriers. Doping a semiconductor such as silicon with a small amount of impurity atoms, such as phosphorus or boron, greatly increases the number of free electrons or holes within the semiconductor. When a doped semiconductor contains excess holes it is called ""p-type"", and when it contains excess free electrons it is known as ""n-type"", where p (positive for holes) or n (negative for electrons) is the sign of the charge of the majority mobile charge carriers. The semiconductor material used in devices is doped under highly controlled conditions in a fabrication facility, or fab, to control precisely the location and concentration of p- and n-type dopants. The junctions which form where n-type and p-type semiconductors join together are called p–n junctions.
  • studyres.com © 2025
  • DMCA
  • Privacy
  • Terms
  • Report