FEATURES PIN ASSIGNMENT
... For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. ...
... For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. ...
LM35/LM35A/LM35C/LM35CA/LM35D Precision Centigrade Temperature Sensors Precision Centigrade
... The LM35 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.01§ C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface tempe ...
... The LM35 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.01§ C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface tempe ...
LM35 - nskelectronics
... The LM35 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.01§ C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface tempe ...
... The LM35 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.01§ C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface tempe ...
LM35/LM35A/LM35C/LM35CA/LM35D Precision Centigrade
... The LM35 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.01§ C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface tempe ...
... The LM35 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.01§ C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface tempe ...
K107_Manual - Circuit Creations Home
... The OC_OUT output is an open collector output that is normally open (i.e. high impedance) and is active low depending on the operating mode determined by switch S1. The OC_OUT output can be used to connect to higher power circuits such as a relay. TABLE 2 – Circuit Output Descriptions ...
... The OC_OUT output is an open collector output that is normally open (i.e. high impedance) and is active low depending on the operating mode determined by switch S1. The OC_OUT output can be used to connect to higher power circuits such as a relay. TABLE 2 – Circuit Output Descriptions ...
Aeroflex / KDI-Integrated Products - Aeroflex Microelectronic Solutions
... JY04B ASIC from Cobham – FPGA Net List Conversion ...
... JY04B ASIC from Cobham – FPGA Net List Conversion ...
LM117 LM317A LM317 3-Terminal Adjustable Regulator
... An input bypass capacitor is recommended. A 0.1 mF disc or 1 mF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the po ...
... An input bypass capacitor is recommended. A 0.1 mF disc or 1 mF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the po ...
LM117/LM317A/LM317 3-Terminal Adjustable Regulator
... An input bypass capacitor is recommended. A 0.1 mF disc or 1 mF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the po ...
... An input bypass capacitor is recommended. A 0.1 mF disc or 1 mF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the po ...
2.5-V Integrated Reference Circuit (Rev. N)
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
microelectronics
... Figure 1-1 shows a typical vacuum-tube chassis. The actual size of the transformer is approximately 4 × 4 × 3 inches. Capacitors are approximately 1 × 3 inches. The components in the figure are very large when compared to modern microelectronics. ...
... Figure 1-1 shows a typical vacuum-tube chassis. The actual size of the transformer is approximately 4 × 4 × 3 inches. Capacitors are approximately 1 × 3 inches. The components in the figure are very large when compared to modern microelectronics. ...
DS1250Y/AB 4096k Nonvolatile SRAM FEATURES PIN ASSIGNMENT
... 9. Each DS1250 has a built-in switch that disconnects the lithium source until the user first applies VCC. The expected tDR is defined as accumulative time in the absence of VCC starting from the time power is first applied by the user. This parameter is assured by component selection, process contr ...
... 9. Each DS1250 has a built-in switch that disconnects the lithium source until the user first applies VCC. The expected tDR is defined as accumulative time in the absence of VCC starting from the time power is first applied by the user. This parameter is assured by component selection, process contr ...
LM117/LM317A/LM317 3-Terminal Adjustable Regulator General Description
... do not appreciably improve the ripple rejection at frequencies above 120 Hz. If the bypass capacitor is used, it is sometimes necessary to include protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the device. In general, the best type of capa ...
... do not appreciably improve the ripple rejection at frequencies above 120 Hz. If the bypass capacitor is used, it is sometimes necessary to include protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the device. In general, the best type of capa ...
LM117/LM317A/LM317 3-Terminal Adjustable Regulator
... do not appreciably improve the ripple rejection at frequencies above 120 Hz. If the bypass capacitor is used, it is sometimes necessary to include protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the device. In general, the best type of capa ...
... do not appreciably improve the ripple rejection at frequencies above 120 Hz. If the bypass capacitor is used, it is sometimes necessary to include protection diodes to prevent the capacitor from discharging through internal low current paths and damaging the device. In general, the best type of capa ...
DCR02 Series - Texas Instruments
... device input pins as possible. If more than eight devices are required to be synchronized, it is recommended that external synchronization be used. Details of this procedure are contained in application report SBAA035, External Synchronization of the DCP01/02 Series of DC/DC Converters, available fo ...
... device input pins as possible. If more than eight devices are required to be synchronized, it is recommended that external synchronization be used. Details of this procedure are contained in application report SBAA035, External Synchronization of the DCP01/02 Series of DC/DC Converters, available fo ...
Easy-Shift Kill Box Installation Instructions
... Use the diagram above. The pin numbers run in order through the 3 rows of the connector. Row 1 is pins 1-3, row 2 is pins 4-6, row 3 is pins 7-9. The red wire is pin 1. It should connect to key-on power. The horn fused (10Amp) circuit is a good source. Pin 2 should be connected to battery ground. Ma ...
... Use the diagram above. The pin numbers run in order through the 3 rows of the connector. Row 1 is pins 1-3, row 2 is pins 4-6, row 3 is pins 7-9. The red wire is pin 1. It should connect to key-on power. The horn fused (10Amp) circuit is a good source. Pin 2 should be connected to battery ground. Ma ...
RF3855 数据资料DataSheet下载
... The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation ...
... The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bottom of the device. Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation ...
™ Reference Manual Universal Development Board Table of Contents
... board. PIMs are visually indexed for proper orientation. The PIM is always installed with the notched corner mark to the upper left. When installing or removing a PIM module, use care to ensure that the pins of the PIM connector socket properly seat into the socket on the PIM and take care to not be ...
... board. PIMs are visually indexed for proper orientation. The PIM is always installed with the notched corner mark to the upper left. When installing or removing a PIM module, use care to ensure that the pins of the PIM connector socket properly seat into the socket on the PIM and take care to not be ...
NOT FOR NEW DESIGNS
... Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. ...
... Thermal vias are required in the PCB layout to effectively conduct heat away from the package. The via pattern has been designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating routing strategies. ...
DIP IPM Vers.3 Demo Board (1200V) Manual
... Figure 4: SC detection circuit: operation of the IPM In case that the separate current information of the three legs is not required, it is possible to connect all three open emitters together and to use just a single shunt resistor. Hence, the diodes D1…D3 and R11 have no function and could be omit ...
... Figure 4: SC detection circuit: operation of the IPM In case that the separate current information of the three legs is not required, it is possible to connect all three open emitters together and to use just a single shunt resistor. Hence, the diodes D1…D3 and R11 have no function and could be omit ...
BalloonSat Manual - LaSPACE - Louisiana State University
... When designing devices which will interface to the BASIC Stamp I/O pin usage must be allocated to prevent contention of devices. It is possible to have multiple I2C devices sharing the same hardware I/O lines if each device has a unique I2C address. MICROWIRE devices can share clock and data lines b ...
... When designing devices which will interface to the BASIC Stamp I/O pin usage must be allocated to prevent contention of devices. It is possible to have multiple I2C devices sharing the same hardware I/O lines if each device has a unique I2C address. MICROWIRE devices can share clock and data lines b ...
Diversa PIR WOR 347 Install Guide for web
... operation the sensor will detect initial motion using Passive Infrared (PIR); once motion is detected, the internal contact will close. Motion through PIR is used to maintain the occupied condition as long as occupants remain ...
... operation the sensor will detect initial motion using Passive Infrared (PIR); once motion is detected, the internal contact will close. Motion through PIR is used to maintain the occupied condition as long as occupants remain ...
MAX9650/MAX9651 High-Current VCOM Drive Op Amps for TFT LCDs General Description
... The MAX9650/MAX9651 are single- and dual-channel VCOM amplifiers with rail-to-rail inputs and outputs. The MAX9650/MAX9651 can drive up to 1300mA of peak current per channel and operate up to 20V. The MAX9650/MAX9651 are designed to source and sink a high current quickly to hold the VCOM voltage sta ...
... The MAX9650/MAX9651 are single- and dual-channel VCOM amplifiers with rail-to-rail inputs and outputs. The MAX9650/MAX9651 can drive up to 1300mA of peak current per channel and operate up to 20V. The MAX9650/MAX9651 are designed to source and sink a high current quickly to hold the VCOM voltage sta ...
A3290 and A3291 - Allegro Microsystems
... to 125°C). Superior high-temperature performance is made possible through Dynamic Offset Cancellation, which reduces the residual offset voltage normally caused by device package overmolding, temperature dependencies, and thermal stress. The two devices are identical except for their magnetic switch ...
... to 125°C). Superior high-temperature performance is made possible through Dynamic Offset Cancellation, which reduces the residual offset voltage normally caused by device package overmolding, temperature dependencies, and thermal stress. The two devices are identical except for their magnetic switch ...
Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.DIP packages are usually made from an opaque molded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. Most DIP packages are secured to a printed circuit board by inserting the pins through holes in the board and soldering them in place. Where frequent replacement of the parts is desired, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Some sockets include a zero insertion force mechanism.Variations of the DIP package include those with only a single row of pins, possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of the package. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a printed circuit board and which allow higher density of interconnections.