PROMOTIONAL SAMPLE - IPC Training Home Page
... the marked lead or Pin One of a multi-pinned component should be placed. Matching Pin One of the component to the correct land or pad on the PWB is critical for the proper function of the component. For components that have the positive or anode lead marked, like polarized capacitors, the square lan ...
... the marked lead or Pin One of a multi-pinned component should be placed. Matching Pin One of the component to the correct land or pad on the PWB is critical for the proper function of the component. For components that have the positive or anode lead marked, like polarized capacitors, the square lan ...
PROMOTIONAL SAMPLE has LOW RESOLUTION IMAGES is not for reproduction and
... the marked lead or Pin One of a multi-pinned component should be placed. Matching Pin One of the component to the correct land or pad on the PWB is critical for the proper function of the component. For components that have the positive or anode lead marked, like polarized capacitors, the square lan ...
... the marked lead or Pin One of a multi-pinned component should be placed. Matching Pin One of the component to the correct land or pad on the PWB is critical for the proper function of the component. For components that have the positive or anode lead marked, like polarized capacitors, the square lan ...
Portable Audio – Customer Review
... • There are several ways TI provides a ruggedized plastic package for our 175C offerings • We have a different material set than the commercial/industrial devices to improve reliability at temperature • Special leadframe, mold compounds, and die attach to withstand the stresses from CTE mismatch • S ...
... • There are several ways TI provides a ruggedized plastic package for our 175C offerings • We have a different material set than the commercial/industrial devices to improve reliability at temperature • Special leadframe, mold compounds, and die attach to withstand the stresses from CTE mismatch • S ...
GTL2012
... Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are m ...
... Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are m ...
Using a Dallas/Maxim DS1811 in the Reset Section. There is also
... Note the 1k pull-up resistor is needed for additional current draw for all devices needing reset. If not installed, the MPU board can be intermittent on powerup because the DS1811 can't source enough current to bring the reset signal high by itself. As Neil explains, replacing resistor R11 is a goo ...
... Note the 1k pull-up resistor is needed for additional current draw for all devices needing reset. If not installed, the MPU board can be intermittent on powerup because the DS1811 can't source enough current to bring the reset signal high by itself. As Neil explains, replacing resistor R11 is a goo ...
Radio-Frequency Semiconductors Diodes
... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHI ...
... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHI ...
HMC641LC4 - Electrocomponents
... [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 or Arlon FR4 ...
... [1] Reference this number when ordering complete evaluation PCB [2] Circuit Board Material: Rogers 4350 or Arlon FR4 ...
Simultaneous-Switching Noise Analysis For Texas Instruments FIFO
... reduce the inductance by improved packaging techniques, such as decreasing the various inductive contributions to ground bounce.2 Surface-mount packages, such as PQFPs, are a better package option than through-hole packages, such as DIP or PGA, because the former have shortened pins or a lower-profi ...
... reduce the inductance by improved packaging techniques, such as decreasing the various inductive contributions to ground bounce.2 Surface-mount packages, such as PQFPs, are a better package option than through-hole packages, such as DIP or PGA, because the former have shortened pins or a lower-profi ...
SN54ABT2241, SN74ABT2241 OCTAL BUFFERS AND LINE/MOS DRIVERS WITH 3-STATE OUTPUTS
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
Lead-on chip semiconductor device having peripheral bond pads
... surface of the chip is illustrated, and includes a plurality packaged using either a metal leadframe or a TAB (tape 55 of bond pads 14 positioned along a periphery of the automated bonding) leadframe. Much of the existing chip. The chip has four sides, two of which are much LOC technology is directe ...
... surface of the chip is illustrated, and includes a plurality packaged using either a metal leadframe or a TAB (tape 55 of bond pads 14 positioned along a periphery of the automated bonding) leadframe. Much of the existing chip. The chip has four sides, two of which are much LOC technology is directe ...
Selecting Decoupling Capacitors for Atmel`s PLDs
... things, will determine just how much is really needed. The best bet is to use a good 0.22 µF and be safe. Besides, the more decoupling is taken care of by local capacitors, the lower the board’s HF emissions will be. ...
... things, will determine just how much is really needed. The best bet is to use a good 0.22 µF and be safe. Besides, the more decoupling is taken care of by local capacitors, the lower the board’s HF emissions will be. ...
SN54ABT241, SN74ABT241A OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
... TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous mater ...
PIC16F874A-E/P - Datasheet.Directory
... removed from the flex circuit cable (see Figure 2-1) when emulator power is being used and the processor module is not connected to the target. This will eliminate any loading effects on I/O pins. ...
... removed from the flex circuit cable (see Figure 2-1) when emulator power is being used and the processor module is not connected to the target. This will eliminate any loading effects on I/O pins. ...
JEDEC STANDARD
... thermal measurements on packages containing single chip semiconductor devices. Different aspects of the methodology are defined in separate detailed standards. To measure one component thermal value the supplier follows one standard from each of the categories in Table 1. The JEDEC Theta-JCx standar ...
... thermal measurements on packages containing single chip semiconductor devices. Different aspects of the methodology are defined in separate detailed standards. To measure one component thermal value the supplier follows one standard from each of the categories in Table 1. The JEDEC Theta-JCx standar ...
The DatasheetArchive - Datasheet Search Engine
... ■ 2.3V to 3.6V VCC specifications provided ■ 7.0 ns tPD max (VCC = 3.3V), 10 µA ICC max ■ Power down high impedance inputs and outputs ■ Supports live insertion/withdrawal (Note 1) ■ ±24 mA output drive (VCC = 3.0V) ■ Implements patented noise/EMI reduction circuitry ■ Latch-up performance exceeds 5 ...
... ■ 2.3V to 3.6V VCC specifications provided ■ 7.0 ns tPD max (VCC = 3.3V), 10 µA ICC max ■ Power down high impedance inputs and outputs ■ Supports live insertion/withdrawal (Note 1) ■ ±24 mA output drive (VCC = 3.0V) ■ Implements patented noise/EMI reduction circuitry ■ Latch-up performance exceeds 5 ...
LM137/LM337 3-Terminal Adjustable Negative Regulators (Rev. E)
... specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. ...
... specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. ...
SNx4HC05 Inverters With Open-Drain Outputs
... digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only three of the four buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Al ...
... digital logic devices are unused, for example, when only two inputs of a triple-input AND gate are used or only three of the four buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Al ...
GTL2034PW
... Moisture sensitivity precautions, as indicated on packing, must be respected at all times. ...
... Moisture sensitivity precautions, as indicated on packing, must be respected at all times. ...
LM317 - Electronics
... An input bypass capacitor is recommended. A 0.1μF disc or 1μF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the poss ...
... An input bypass capacitor is recommended. A 0.1μF disc or 1μF solid tantalum on the input is suitable input bypassing for almost all applications. The device is more sensitive to the absence of input bypassing when adjustment or output capacitors are used but the above values will eliminate the poss ...
471610 Manual
... Turn the crank vigorously for about 30 seconds. Notice that a blue-green region will appear around one of the conductors but not around the other. This colouration only appears around the positive lead. The colouration is due to the formation of copper chloride which is created due to the electrolys ...
... Turn the crank vigorously for about 30 seconds. Notice that a blue-green region will appear around one of the conductors but not around the other. This colouration only appears around the positive lead. The colouration is due to the formation of copper chloride which is created due to the electrolys ...
MPXV5004G, Integrated Silicon Pressure Sensor On-Chip
... The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel is ...
... The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel is ...
STA-5063Z 3.3GHz to 6.2GHz GENERAL PURPOSE 3.3V 15dBm AMPLIFIER Features
... RF input pin and power up down control. Supply VPC =3.3V thru a 4.7Kohm resistor to this pin. For more gain (~0.3dB), a 5.6nH inductor can also be used in place of the resistor. If an inductor is used, move the 4.7k resistor towards the DC supply, but still in series with pin 1. A minimum 1k series ...
... RF input pin and power up down control. Supply VPC =3.3V thru a 4.7Kohm resistor to this pin. For more gain (~0.3dB), a 5.6nH inductor can also be used in place of the resistor. If an inductor is used, move the 4.7k resistor towards the DC supply, but still in series with pin 1. A minimum 1k series ...
LM35 - Innoviris
... and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s te ...
... and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s te ...
LM35 - INNOVIRIS
... and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s te ...
... and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s te ...
manual - Jackson Harbor Press
... g) Q2 – 2n7000 (transistor - TO-92 case) – with the leads of Q1 in a triangular shape, with the middle lead (gate) pulled back by .1”, insert and solder Q2 to the left of the 8 pin socket h) R1 – 1.2 k (brown-red-red-gold) – form the leads of R1 by bending one lead around 180 degrees and then insert ...
... g) Q2 – 2n7000 (transistor - TO-92 case) – with the leads of Q1 in a triangular shape, with the middle lead (gate) pulled back by .1”, insert and solder Q2 to the left of the 8 pin socket h) R1 – 1.2 k (brown-red-red-gold) – form the leads of R1 by bending one lead around 180 degrees and then insert ...
Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.DIP packages are usually made from an opaque molded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. Most DIP packages are secured to a printed circuit board by inserting the pins through holes in the board and soldering them in place. Where frequent replacement of the parts is desired, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Some sockets include a zero insertion force mechanism.Variations of the DIP package include those with only a single row of pins, possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of the package. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a printed circuit board and which allow higher density of interconnections.