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High Current Voltage Regulator Module Employs Novel
High Current Voltage Regulator Module Employs Novel

... contact pads that can be soldered directly to the PCB. The copper 'can' forms the drain connection from the other side of the die to the board (See Fig. 1). A proprietary passivation system on the silicon die isolates the gate and the source pads to prevent shorting and acts as a solder mask when th ...
580393681ADM3202_22_1385_c.pdf
580393681ADM3202_22_1385_c.pdf

... data transmission at rates well in excess of the EIA/RS-232E specifications. RS-232 voltage levels are maintained at data rates up to 460 kbps even under worst-case loading conditions. This allows high speed data links between two terminals and is suitable for the new generation ISDN modem standards ...
CSPEMI201A 数据资料DataSheet下载
CSPEMI201A 数据资料DataSheet下载

... pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom−designed to interface with a speaker port on a cellular telephone or similar device. Each high quality filter provides more than 35 dB attenuation in the 800−2700 MHz range. Th ...
the original construction manual in Word format.
the original construction manual in Word format.

... leads will need to be bent in a bit to fit the holes - solder and clip leads i. Once the components are installed carefully inspect all joints making sure that all components are installed in the correct holes, observing polarity when necessary, and that all solder joints are good. Carefully check f ...
SBB-2082S 数据资料DataSheet下载
SBB-2082S 数据资料DataSheet下载

... RFMD’s SBB-2082S is a high performance InGaP HBT utilizing a Darlington configuration with an active bias network. The active bias network provides stable current over temperature and process Beta variations. Designed to run directly form a 5V supply, the SBB-2082S does not require a dropping resist ...
Arctic RS-485 / RS-422 RS
Arctic RS-485 / RS-422 RS

... If biasing is required set DIP switch 3 to ”ON” and manually connect Arctic RS2 pins 2-7 and 3-8 together If termination is required set DIP switch 4 to ”ON” and manually connect Arctic RS2 pins 2-7 and 3-8 together Connect Arctic pin 7 (TXD/RXD+) to other device non-inverting pin (usually marked po ...
HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH
HS-303ARH, HS-303AEH, HS-303BRH, HS-303BEH

... 2. If a pin one identification mark is used in addition to a tab, the limits of dimension k do not apply. 3. This dimension allows for off-center lid, meniscus, and glass overrun. 4. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. The max ...
The Picaxe Hatchet Board
The Picaxe Hatchet Board

... up with a neat application that you would like to share with other Hatchet users, please let me know and I will post it in the Hatchet folder. As of right now, there is no detailed Step by Step tutorial on how to assemble the Hatchet kit. Assembly is quite straight forward; however, as the Hatchet b ...
Part 4 - iaria
Part 4 - iaria

... between equipment and power supply  Knowing the dip performance of equipment allows to select most appropriate equipment – Equipment with greater immunity may be more expensive ... Today ...
Industrial / Power
Industrial / Power

... • Precision molded in gold colored, flame retardant, thermosetting epoxy resin • Laser marked for improved legibility, and tapered end on positive terminal • Standard orders are taped and reeled; under 500 pieces are ammo packed ...
CSPEMI202A 数据资料DataSheet下载
CSPEMI202A 数据资料DataSheet下载

... The CSPEMI202AG is a dual low−pass filter array integrating two pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom−designed to interface with a microphone port on a cellular telephone or similar device. Each high quality filter ...
PT2262 - Adafruit
PT2262 - Adafruit

... PT2262 is a remote control encoder paired with PT2272 utilizing CMOS Technology. It encodes data and address pins into a serial coded waveform suitable for RF or IR modulation. PT2262 has a maximum of 12 bits of tri-state address pins providing up to 531,441 (or 312) address codes; thereby, drastica ...
Installation Manual
Installation Manual

... SW3 and 4. Selects the time the system will be bypassed, this should be a little longer that the gate takes to close on its own. SW5 and 6. Selects how long the output relay activates for. SW7 and 8. Selects the duration of the cycle. The system will cycle until the zone is restored, this is to ensu ...
DM74AS804B Hex 2-Input NAND Driver
DM74AS804B Hex 2-Input NAND Driver

74HC157 pdf
74HC157 pdf

... The MM74HC157 high speed Quad 2-to-1 Line data selector/Multiplexers utilizes advanced silicon-gate CMOS technology. It possesses the high noise immunity and low power consumption of standard CMOS integrated circuits, as well as the ability to drive 10 LS-TTL loads. This device consists of four 2-in ...
DM74AS805B Hex 2-Input NOR Driver
DM74AS805B Hex 2-Input NOR Driver

... These devices contain six independent drivers, each of which performs the logic NOR function. Each driver has increased output drive capability to allow the driving of high capacitive loads. ...
DM74AS1805 - uri=media.digikey
DM74AS1805 - uri=media.digikey

... operated at these limits. The parametric values defined in the Electrical Characteristics tables are not guaranteed at the absolute maximum ratings. The “Recommended Operating Conditions” table will define the conditions for actual device operation. ...
LM185 LM285 LM385 Adjustable Micropower Voltage References
LM185 LM285 LM385 Adjustable Micropower Voltage References

... The LM185/LM285/LM385 are micropower 3-terminal adjustable band-gap voltage reference diodes. Operating from 1.24 to 5.3V and over a 10 mA to 20 mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolera ...
ComponentIdentification
ComponentIdentification

... • Demonstrate how to read a resistor’s nominal value and how to measure its actual value with a Digital Multi-Meter (DMM). • Define a capacitor and present various capacitor types and package styles. • Demonstrate how to read a capacitor’s nominal value. ...
DM74ALS245A Octal 3-STATE Bus Transceiver
DM74ALS245A Octal 3-STATE Bus Transceiver

... Octal 3-STATE Bus Transceiver General Description ...
a Complete 700 ns Sample-and-Hold Amplifier AD781*
a Complete 700 ns Sample-and-Hold Amplifier AD781*

... 5. Excellent choice as a front-end SHA for high speed analogto-digital converters such as the AD671, AD7586, AD674B, AD774B, AD7572 and AD7672. 6. Fully specified and tested hold mode distortion guarantees the performance of the SHA in sampled data systems. 7. The AD781 is available in versions comp ...
74F245 - EE Sharif
74F245 - EE Sharif

... Order Number 74F245SC 74F245SJ ...
Assembly and Printed Circuit Board (PCB) Package
Assembly and Printed Circuit Board (PCB) Package

... The reduction in size and high performance of electronic systems is due to electronic circuits’ integration and packaging as well as device assembly. ICs can have millions of transistors that can perform a large set of functions in an extremely small area. The interconnection between different ICs o ...
Faculty Websites
Faculty Websites

... other hand, surface mount components are so designed that they can be attached directly on to the surface of the board. • Two types of lead configurations are commonly found in discrete components. The components with axial leads have two leads, each extending from each side of the component like ar ...
DM74LS273 8-Bit Register with Clear
DM74LS273 8-Bit Register with Clear

... The DM74LS273 is a high speed 8-bit register, consisting of eight D-type flip-flops with a common Clock and an asynchronous active LOW Master Reset. This device is supplied in a 20-pin package featuring 0.3 inch row spacing. ...
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Dual in-line package



In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.DIP packages are usually made from an opaque molded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. Most DIP packages are secured to a printed circuit board by inserting the pins through holes in the board and soldering them in place. Where frequent replacement of the parts is desired, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Some sockets include a zero insertion force mechanism.Variations of the DIP package include those with only a single row of pins, possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of the package. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a printed circuit board and which allow higher density of interconnections.
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