RFMD Datasheet Template
... RFMD’s SBB-4082S is a high-performance InGaP HBT MMIC amplifier utilizing a Darlington configuration with an active bias network in a hermetic package. The active bias network provides stable current over temperature and Beta process variations. The SBB-4082S is designed for high linearity gain bloc ...
... RFMD’s SBB-4082S is a high-performance InGaP HBT MMIC amplifier utilizing a Darlington configuration with an active bias network in a hermetic package. The active bias network provides stable current over temperature and Beta process variations. The SBB-4082S is designed for high linearity gain bloc ...
8-Channel ESD Protection Array
... international standard (Level 4, ±8 kV contact discharge). All I/Os are rated at ±25 kV using the IEC 61000−4−2 contact discharge method. Using the MIL−STD−883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than ±30 kV. The Chip ...
... international standard (Level 4, ±8 kV contact discharge). All I/Os are rated at ±25 kV using the IEC 61000−4−2 contact discharge method. Using the MIL−STD−883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than ±30 kV. The Chip ...
Development of pre-molded leadframe package technologies to suit
... which connection of single or multiple chips and/or other components may be made. The cavity itself can be shaped, round, square and can have multiple depths depending upon application and chip designs. The exterior of the cavity can also be shaped as required or incorporate features to house extern ...
... which connection of single or multiple chips and/or other components may be made. The cavity itself can be shaped, round, square and can have multiple depths depending upon application and chip designs. The exterior of the cavity can also be shaped as required or incorporate features to house extern ...
PDF Version(93KB)
... Sample Shipment Targets The new modules’ high-efficiency energy use, long life, low power loss and high reliability are expected to attract the attention of companies producing general-purpose inverters, elevators, UPS, wind- and solar-power equipment, servos and other industrial equipment. Package ...
... Sample Shipment Targets The new modules’ high-efficiency energy use, long life, low power loss and high reliability are expected to attract the attention of companies producing general-purpose inverters, elevators, UPS, wind- and solar-power equipment, servos and other industrial equipment. Package ...
LM137/LM337 3-Terminal Adjustable Negative Regulators
... Order Number LM137K/883 LM137KPQML and LM137KPQMLV(Note 5) See NS Package Number K02C Order Number LM337K STEEL See NS Package Number K02A ...
... Order Number LM137K/883 LM137KPQML and LM137KPQMLV(Note 5) See NS Package Number K02C Order Number LM337K STEEL See NS Package Number K02A ...
LM137/LM337 3-Terminal Adjustable Negative Regulators
... Order Number LM137K/883 LM137KPQML and LM137KPQMLV(Note 5) See NS Package Number K02C Order Number LM337K STEEL See NS Package Number K02A ...
... Order Number LM137K/883 LM137KPQML and LM137KPQMLV(Note 5) See NS Package Number K02C Order Number LM337K STEEL See NS Package Number K02A ...
PGA Series of High Power Laser-Diodes for Industrial Range Finding
... The laser is operated by pulsing current in the forward bias direction. The Excelitas warranty applies only to devices operated within the maximum rating, as specified. Exceeding these conditions is likely to cause permanent “burn off” damage to the laser facet and consequently a significant reducti ...
... The laser is operated by pulsing current in the forward bias direction. The Excelitas warranty applies only to devices operated within the maximum rating, as specified. Exceeding these conditions is likely to cause permanent “burn off” damage to the laser facet and consequently a significant reducti ...
SIMULIA
... Developed in the 1960s by IBM for use in mainframe computers, flip-chips are now used in all kinds of electronic devices including watches, smart cards, RFID tags, and cellular telephones. The chips are mounted face-down, or “flipped”, directly onto a substrate, circuit board, or carrier. They make ...
... Developed in the 1960s by IBM for use in mainframe computers, flip-chips are now used in all kinds of electronic devices including watches, smart cards, RFID tags, and cellular telephones. The chips are mounted face-down, or “flipped”, directly onto a substrate, circuit board, or carrier. They make ...
Learn-to-Solder Exercise: Practice Flasher Circuit
... the negative lead is marked and is also shorter) ...
... the negative lead is marked and is also shorter) ...
Light Sensor (AMS3) - Panasonic Industrial Devices
... • Atmosphere: Low-dust and free from noxious chemicals such as sulfurous acid gas ✽ During soldering, when adding thermal stress in a moisture absorbing state, moisture evaporates, swells and generates stress to the internal package. To avoid swellings and cracks in the surface of the package, follo ...
... • Atmosphere: Low-dust and free from noxious chemicals such as sulfurous acid gas ✽ During soldering, when adding thermal stress in a moisture absorbing state, moisture evaporates, swells and generates stress to the internal package. To avoid swellings and cracks in the surface of the package, follo ...
ANN-S/PG Serial/Parallel Printer Interface Module - Fire
... alarm control panel (FACP) directly to a printer to print event history. You can also print system event logs in real time and detector status from addressable FACPs. This document is for quick reference. For more information, refer to the FACP installation manual. Note: Installation and wiring of t ...
... alarm control panel (FACP) directly to a printer to print event history. You can also print system event logs in real time and detector status from addressable FACPs. This document is for quick reference. For more information, refer to the FACP installation manual. Note: Installation and wiring of t ...
Electronic materials and components
... surfaces separated by an insulator (the 'dielectric'), with a lead connected to each surface. To create the values of capacitance needed for practical circuits, one needs conducting surfaces which are both very large and very close together, and separated by a material with a high 'dielectric consta ...
... surfaces separated by an insulator (the 'dielectric'), with a lead connected to each surface. To create the values of capacitance needed for practical circuits, one needs conducting surfaces which are both very large and very close together, and separated by a material with a high 'dielectric consta ...
CricketSat Wireless Sensor
... insertion into board – While pressing component to board, bend leads at an angle – This will hold components in place while soldering – Just 4 or 5 components at a time ...
... insertion into board – While pressing component to board, bend leads at an angle – This will hold components in place while soldering – Just 4 or 5 components at a time ...
Learn-to-Solder Exercise: Practice Flasher Circuit
... the negative lead is marked and is also shorter) ...
... the negative lead is marked and is also shorter) ...
Learn-to-Solder Exercise: Practice Flasher Circuit
... the negative lead is marked and is also shorter) ...
... the negative lead is marked and is also shorter) ...
Building a Flasher Circuit (AKA Learn to Solder Exercise)
... the negative lead is marked and is also shorter) ...
... the negative lead is marked and is also shorter) ...
DIP
... full spelling : Dual In-line Package Dual In-line Package also known as DIP, is a package for electroniccomponents with a rectangular housing and two parallel rows of electrical connecting pins. The DIP is characterized by two rows of external connecting terminals or pins. The Dual In-line Package c ...
... full spelling : Dual In-line Package Dual In-line Package also known as DIP, is a package for electroniccomponents with a rectangular housing and two parallel rows of electrical connecting pins. The DIP is characterized by two rows of external connecting terminals or pins. The Dual In-line Package c ...
Datasheet
... ■ Switching specifications guaranteed over full temperature and VCC range ■ Advanced oxide-isolated, ion-implanted Schottky TTL process ■ Functionally and pin for pin compatible with Schottky and low power Schottky TTL counterpart ■ Improved AC performance over Schottky and low power Schottky counte ...
... ■ Switching specifications guaranteed over full temperature and VCC range ■ Advanced oxide-isolated, ion-implanted Schottky TTL process ■ Functionally and pin for pin compatible with Schottky and low power Schottky TTL counterpart ■ Improved AC performance over Schottky and low power Schottky counte ...
Electronic Component Identification
... The type number of the device is an individual part number given to the device. Device numbers normally conform to the JEDEC (American) or Pro-Electron (European) numbering systems - see Related Articles under main left hand menu block. There is also a Japanese standard system for transistor numberi ...
... The type number of the device is an individual part number given to the device. Device numbers normally conform to the JEDEC (American) or Pro-Electron (European) numbering systems - see Related Articles under main left hand menu block. There is also a Japanese standard system for transistor numberi ...
The QFN: Smaller, Faster and Less Expensive
... the industry and is a significant breakthrough in IC packaging technology. It will certainly become one of the dominant packages, and is likely to replace many existing plastic formats with lead counts between 2-68. We believe that both QFN assembly processes will co-exist. The AM-SS is ideal for sm ...
... the industry and is a significant breakthrough in IC packaging technology. It will certainly become one of the dominant packages, and is likely to replace many existing plastic formats with lead counts between 2-68. We believe that both QFN assembly processes will co-exist. The AM-SS is ideal for sm ...
MS Word
... Surface mount devices medium power transistors Through hole package medium power transistors Medium/high power transistor/thyristor isolated packages GBU package R.F. hermetic packages with stud R.F. ceramic packages with stud R.F. hermetic flanged packages R.F. studless ceramic packages R.F. cerami ...
... Surface mount devices medium power transistors Through hole package medium power transistors Medium/high power transistor/thyristor isolated packages GBU package R.F. hermetic packages with stud R.F. ceramic packages with stud R.F. hermetic flanged packages R.F. studless ceramic packages R.F. cerami ...
Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.DIP packages are usually made from an opaque molded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. Most DIP packages are secured to a printed circuit board by inserting the pins through holes in the board and soldering them in place. Where frequent replacement of the parts is desired, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Some sockets include a zero insertion force mechanism.Variations of the DIP package include those with only a single row of pins, possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of the package. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a printed circuit board and which allow higher density of interconnections.