DS1218 Nonvolatile Controller FEATURES PIN ASSIGNMENT
... switched on to supply RAM with uninterrupted power. Special circuitry uses a low-leakage CMOS process which affords precise voltage detection at extremely low battery consumption. The 8-pin package keeps PC board real estate requirements to a minimum. By combining the DS1218 nonvolatile controller c ...
... switched on to supply RAM with uninterrupted power. Special circuitry uses a low-leakage CMOS process which affords precise voltage detection at extremely low battery consumption. The 8-pin package keeps PC board real estate requirements to a minimum. By combining the DS1218 nonvolatile controller c ...
The future Of Packaging
... Virtually every electronic device must connect to an electronic system by means of an electromechanical structure called the package. The electronic component package concept has been in use for more than a century and electronics would not exist without the “package”. Electronics can be divided int ...
... Virtually every electronic device must connect to an electronic system by means of an electromechanical structure called the package. The electronic component package concept has been in use for more than a century and electronics would not exist without the “package”. Electronics can be divided int ...
6 Appx-M
... Low-profile, fine-pitch ball grid array (.80mm pitch). Provide a minimal footprint and can benefit high bit-width applications. LFBGA’s offer more power and ground pins than other packages, providing a clear advantage in ground bounce. This package provides the most effective solution for performanc ...
... Low-profile, fine-pitch ball grid array (.80mm pitch). Provide a minimal footprint and can benefit high bit-width applications. LFBGA’s offer more power and ground pins than other packages, providing a clear advantage in ground bounce. This package provides the most effective solution for performanc ...
74F38 Quad Two-Input NAND Buffer (Open Collector)
... Quad Two-Input NAND Buffer (Open Collector) General Description This device contains four independent gates, each of which performs the logic NAND function. The open-collector outputs require external pull-up resistors for proper logical operation. ...
... Quad Two-Input NAND Buffer (Open Collector) General Description This device contains four independent gates, each of which performs the logic NAND function. The open-collector outputs require external pull-up resistors for proper logical operation. ...
ds26ls31cm
... The DS26LS31 is a quad differential line driver designed for digital data transmission over balanced lines. The DS26LS31 meets all the requirements of EIA Standard RS-422 and Federal Standard 1020. It is designed to provide unipolar differential drive to twisted-pair or parallel-wire transmission li ...
... The DS26LS31 is a quad differential line driver designed for digital data transmission over balanced lines. The DS26LS31 meets all the requirements of EIA Standard RS-422 and Federal Standard 1020. It is designed to provide unipolar differential drive to twisted-pair or parallel-wire transmission li ...
PDF Version(82KB)
... About Mitsubishi Electric Corporation With over 90 years of experience in providing reliable, high-quality products, Mitsubishi Electric Corporation (TOKYO: 6503) is a recognized world leader in the manufacture, marketing and sales of electrical and electronic equipment used in information processin ...
... About Mitsubishi Electric Corporation With over 90 years of experience in providing reliable, high-quality products, Mitsubishi Electric Corporation (TOKYO: 6503) is a recognized world leader in the manufacture, marketing and sales of electrical and electronic equipment used in information processin ...
PCTF® Approach Saves MW/RF Component/Module Costs
... mechanisms under thermomechanical stresses. All testing was performed while packages were mounted directly on high-frequency PCBs. The reliability data are shown in the table. ...
... mechanisms under thermomechanical stresses. All testing was performed while packages were mounted directly on high-frequency PCBs. The reliability data are shown in the table. ...
SMPD Product Brief - IXYS Power
... offers a smaller version of the SMPD package – the Mini SMPD, which is illustrated in Figure 2 below. Just like in the SMPD, an electrical isolation of 4500V between the semiconductor chip and base copper is achieved with the Direct Copper Bond (DCB) technology, which is a well-known technique for hi ...
... offers a smaller version of the SMPD package – the Mini SMPD, which is illustrated in Figure 2 below. Just like in the SMPD, an electrical isolation of 4500V between the semiconductor chip and base copper is achieved with the Direct Copper Bond (DCB) technology, which is a well-known technique for hi ...
LM1558/LM1458 Dual Operational Amplifier
... The LM1558 and the LM1458 are general purpose dual operational amplifiers. The two amplifiers share a common bias network and power supply leads. Otherwise, their operation is completely independent. The LM1458 is identical to the LM1558 except that the LM1458 has its specifications guaranteed over ...
... The LM1558 and the LM1458 are general purpose dual operational amplifiers. The two amplifiers share a common bias network and power supply leads. Otherwise, their operation is completely independent. The LM1458 is identical to the LM1558 except that the LM1458 has its specifications guaranteed over ...
Component Identification: Digital
... Surface Mount Technology (SMT) • SMT components are mounted on the surface of the PCB, so no holes need to be drilled. • Primary Advantages: – Designs with SMT components are smaller than THTbased designs because SMT components are significantly smaller and have much higher pin counts than THT comp ...
... Surface Mount Technology (SMT) • SMT components are mounted on the surface of the PCB, so no holes need to be drilled. • Primary Advantages: – Designs with SMT components are smaller than THTbased designs because SMT components are significantly smaller and have much higher pin counts than THT comp ...
Bill of Materials_revised
... Used only after the students have debugged their circuits. Prior to this, they should power their circuits using either the 5V pin on mbed or 5/9V from the benchtop dc power supplies Used only after the students have debugged their circuits. Prior to this, they should power their circuits using eith ...
... Used only after the students have debugged their circuits. Prior to this, they should power their circuits using either the 5V pin on mbed or 5/9V from the benchtop dc power supplies Used only after the students have debugged their circuits. Prior to this, they should power their circuits using eith ...
Hermetic Packages
... laminated and then fired to create the package body. Leads are then brazed to the package body. The metallized areas of the package are then electroplated (usually nickel followed by gold). After assembly, the hermetic seal is achieved by soldering a metal lid onto the metallized and plated seal rin ...
... laminated and then fired to create the package body. Leads are then brazed to the package body. The metallized areas of the package are then electroplated (usually nickel followed by gold). After assembly, the hermetic seal is achieved by soldering a metal lid onto the metallized and plated seal rin ...
AD633 Low Cost Analog Multiplier Data Sheet (REV. E)
... by a buried Zener. The AD633 is the first product to offer these features in modestly priced 8-lead plastic DIP and SOIC packages. The AD633 is laser calibrated to a guaranteed total accuracy of 2% of full scale. Nonlinearity for the Y input is typically less than 0.1% and noise referred to the outp ...
... by a buried Zener. The AD633 is the first product to offer these features in modestly priced 8-lead plastic DIP and SOIC packages. The AD633 is laser calibrated to a guaranteed total accuracy of 2% of full scale. Nonlinearity for the Y input is typically less than 0.1% and noise referred to the outp ...
DE Vocabulary Unit 1.1 - Stratford High School
... Engineering Notation - A floating point system in which numbers are expressed p as p products consisting g of a number greater than one multiplied by an appropriate power of ten that is some multiple of three. ...
... Engineering Notation - A floating point system in which numbers are expressed p as p products consisting g of a number greater than one multiplied by an appropriate power of ten that is some multiple of three. ...
TQP369182封装信息
... DC-6 GHz Gain Block Mechanical Information Package Marking and Dimensions The component will be marked on the top surface of package with a “369182” designator and an alphanumeric lot code. ...
... DC-6 GHz Gain Block Mechanical Information Package Marking and Dimensions The component will be marked on the top surface of package with a “369182” designator and an alphanumeric lot code. ...
TQP369185封装信息
... DC-6 GHz Gain Block Mechanical Information Package Marking and Dimensions The component will be marked on the top surface of package with a “369185” designator and an alphanumeric lot code. ...
... DC-6 GHz Gain Block Mechanical Information Package Marking and Dimensions The component will be marked on the top surface of package with a “369185” designator and an alphanumeric lot code. ...
1 Attachment A Whitepaper on Semiconductor Die and Packaging
... A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP ...
... A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP ...
TQP369184封装信息
... Mechanical Information Package Information and Dimensions The component is marked on the top surface of the package with a “184” designator and on the bottom surface with an alphanumeric lot code. ...
... Mechanical Information Package Information and Dimensions The component is marked on the top surface of the package with a “184” designator and on the bottom surface with an alphanumeric lot code. ...
TQP369181封装信息
... Mechanical Information Package Information and Dimensions The component is marked on the top surface of the package with a “181” designator and on the bottom surface with an alphanumeric lot code. ...
... Mechanical Information Package Information and Dimensions The component is marked on the top surface of the package with a “181” designator and on the bottom surface with an alphanumeric lot code. ...
fundamentals of single chip packaging
... A Ball-Grid-Array is an array package with a ball pitch of 0.8mm or greater. Includes very high leadcount packages (>500 I/O) A Chip-Scale-Package is an array package with a ball pitch of 0.8mm or less (0.5, 0.75, or 0.8) and area no more than 50% more than the IC. ...
... A Ball-Grid-Array is an array package with a ball pitch of 0.8mm or greater. Includes very high leadcount packages (>500 I/O) A Chip-Scale-Package is an array package with a ball pitch of 0.8mm or less (0.5, 0.75, or 0.8) and area no more than 50% more than the IC. ...
DS9034PCX PowerCap with Crystal GENERAL DESCRIPTION FEATURES
... Compatible with these 34-Pin PowerCap Module Boards: ...
... Compatible with these 34-Pin PowerCap Module Boards: ...
DS9034PCX - Maxim Integrated
... ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to the absolute maximum rating conditions for extended periods may affect ...
... ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to the absolute maximum rating conditions for extended periods may affect ...
LM35 - Techno e
... calibration or trimming to provide typical accuracies of ± 1⁄4˚C at room temperature and ± 3⁄4˚C over a full −55 to +150˚C temperature range. Low cost is assured by trimming and calibration at the wafer level. The LM35’s low output impedance, linear output, and precise inherent calibration make inte ...
... calibration or trimming to provide typical accuracies of ± 1⁄4˚C at room temperature and ± 3⁄4˚C over a full −55 to +150˚C temperature range. Low cost is assured by trimming and calibration at the wafer level. The LM35’s low output impedance, linear output, and precise inherent calibration make inte ...
15.5 Other Practical Considerations
... Make sure your power supply can provide adequate current for the entire design. If necessary, use separate power supplies for your signal and power circuits. ...
... Make sure your power supply can provide adequate current for the entire design. If necessary, use separate power supplies for your signal and power circuits. ...
Dual in-line package
In microelectronics, a dual in-line package (DIP or DIL), or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.A DIP is usually referred to as a DIPn, where n is the total number of pins. For example, a microcircuit package with two rows of seven vertical leads would be a DIP14. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as four and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets.DIP packages are usually made from an opaque molded epoxy plastic pressed around a tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. Most DIP packages are secured to a printed circuit board by inserting the pins through holes in the board and soldering them in place. Where frequent replacement of the parts is desired, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Some sockets include a zero insertion force mechanism.Variations of the DIP package include those with only a single row of pins, possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of the package. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a printed circuit board and which allow higher density of interconnections.