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Aufbau Diagram Directions
Aufbau Diagram Directions

... Pauli Exclusion: an atomic orbital may describe at most 2 electrons (each electron will have a different spin) Hund’s Rule: When electrons occupy orbitals of equal energy, one electron enters each orbital until all the orbitas contain one electron, then a second electron is added to each orbital. Ho ...
Primary electrons make random elastic and inelastic collision either
Primary electrons make random elastic and inelastic collision either

... Signals such as secondary electrons (SE) and Auger electrons come from only a very tiny portion of the total interaction volume, since they lack the energy to travel large distances… Only these SE electrons that originated within a few nanometer of the surface are able to escape from sample…. SE has ...
Slide 1
Slide 1

Chap 2 Solns
Chap 2 Solns

... 2.4 (a) Two important quantum-mechanical concepts associated with the Bohr model of the atom are (1) that electrons are particles moving in discrete orbitals, and (2) electron energy is quantized into shells. (b) Two important refinements resulting from the wave-mechanical atomic model are (1) that ...
Quantum Numbers
Quantum Numbers

... ...
< 1 ... 28 29 30 31 32

Electron-beam lithography



Electron-beam lithography (often abbreviated as e-beam lithography) is the practice of scanning a focused beam of electrons to draw custom shapes on a surface covered with an electron-sensitive film called a resist (""exposing""). The electron beam changes the solubility of the resist, enabling selective removal of either the exposed or non-exposed regions of the resist by immersing it in a solvent (""developing""). The purpose, as with photolithography, is to create very small structures in the resist that can subsequently be transferred to the substrate material, often by etching.The primary advantage of electron-beam lithography is that it can draw custom patterns (direct-write) with sub-10 nm resolution. This form of maskless lithography has high resolution and low throughput, limiting its usage to photomask fabrication, low-volume production of semiconductor devices, and research & development.
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