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Two Channel SATA 3 Gbps Redriver with Cable Detect
Two Channel SATA 3 Gbps Redriver with Cable Detect

... up to 3.0Gbps that complies with SATA spec revision 2.6. The SN75LVCP412CD operates from a single 3.3V supply. Integrated 100-Ω line termination and self-biasing make the device suitable for AC coupling. The inputs incorporate an OOB detector which automatically turns the differential outputs off wh ...
Nanoscale Electro-Thermal Sciences Laboratory Department of Mechanical Engineering Southern Methodist University
Nanoscale Electro-Thermal Sciences Laboratory Department of Mechanical Engineering Southern Methodist University

... difficulties of having to access features of a submicron device with an external probe, or in the case of embedded features, fabricate a measuring probe into the device, and then having to isolate and exclude the influence of the measuring probe itself [4]. Alternatively, optical methods can be used ...
61-164 SureTest Circuit Analyzer Instructions
61-164 SureTest Circuit Analyzer Instructions

Example Generic Electrical Procedure Manual
Example Generic Electrical Procedure Manual

Datasheet - Texas Instruments
Datasheet - Texas Instruments

... All part numbers of the LM75 will operate properly over the +VS supply voltage range of 3 V to 5.5 V. The devices are tested and specified for rated accuracy at their nominal supply voltage. Accuracy will typically degrade 1°C/V of variation in +VS as it varies from the nominal value. For best accur ...
IBP1011L900 - Integra Technologies, Inc.
IBP1011L900 - Integra Technologies, Inc.

... Integra Technologies Inc. reserves the right to make changes without further notice to any products herein. Integra Technologies Inc. makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Integra Technologies Inc. assume any lia ...
What is USB
What is USB

AN1709 APPLICATION NOTE EMC DESIGN GUIDE FOR ST MICROCONTROLLERS
AN1709 APPLICATION NOTE EMC DESIGN GUIDE FOR ST MICROCONTROLLERS

... Functional Tests are performed to measure the robustness of ST Microcontrollers running in an application. Based on a simple program (toggling 2 LEDs through I/O ports), the product is stressed by 2 different EMC events until a run-away condition (failure) occurs. 2.1.1.1 Functional ElectroStatic Di ...
Features • Single
Features • Single

... protocol ignores following bytes, if more bytes are sent. • The STUP over the SpaceWire link uses 4 bytes for commands. It also supports ...
A Review of Polarization Index and IEEE Standard 43-2000
A Review of Polarization Index and IEEE Standard 43-2000

CA320002EN
CA320002EN

... sections of underground cable systems. These faulted circuit indicators (FCIs) can be used on both 200 A separable connectors and 600 A terminators with a voltage test point. The removable sleeve allows for use on major manufacturers’ loadbreak elbows. S.T.A.R. TPR FCIs feature a stored energy desig ...
DS90LV001 800 Mbps LVDS Buffer (Rev. E)
DS90LV001 800 Mbps LVDS Buffer (Rev. E)

... MODE OF OPERATION The DS90LV001 can be used as a "stub-hider." In many systems, signals are distributed across backplanes, and one of the limiting factors for system speed is the "stub length" or the distance between the transmission line and the unterminated receivers on the individual cards. Altho ...
Installation Testing Power
Installation Testing Power

... c) The microprocessor unit (MPU) monitors the Rectifier Fail Alarm (RFA), as a supplemental and adjunct monitoring operation to the SBC Alarm Network design. (I.e., the RFA shall be monitored directly by an approved alarm collection system and shall not be dependent upon the interactive operation of ...
electrical insulation systems and materials
electrical insulation systems and materials

... hold up under these high temperature stresses for the life of the device. ...
A The device type on this drawing have been changed to reflect... 03-12-04 Thomas M. Hess
A The device type on this drawing have been changed to reflect... 03-12-04 Thomas M. Hess

... 3.3.9 Test functional tape # or name. 3.3.10 Timing diagram(s). 3.3.11 Fault coverage measurement of manufacturing logic tests. 3.3.12 Burn-in circuit. 3.3.13 Radiation exposure circuit. 3.3.14 ESD class and voltage. 3.3.15 Device electrical performance characteristics (additions to Table I). Device ...
Interfacing TPS65381 With Hercules
Interfacing TPS65381 With Hercules

... Sheet (SLVSBC4). The RM46 control card design followed this recommendation with the following differences and highlights: • In Figure 1, the SPI interface from the MCU side is MIBSPI1, 3, 5 while the control card uses SPI2 to talk to TPS65381. TPS65381 can accept both the SPI compatibility and MibSP ...
Design - University of Portland
Design - University of Portland

... shaped into a pulse using resistors and capacitors. Once the pulse is shaped, it is sent to the logic unit, which is composed of an application-specific integrated circuit known as a MOSIS chip. The MOSIS chip uses timers to compare the time between radiation events. Based on these times, it produce ...
Introduction to SIDACtor® Devices
Introduction to SIDACtor® Devices

... current that can be applied to the ESD protector without damaging the device. The surge waveform conditions are always specified. Sometimes, several surge waveforms are specified: ...
EM powerLED PRO DIM C 45 W
EM powerLED PRO DIM C 45 W

... • Secondary switching is not permitted. • The LED Driver has no inverse-polarity protection on the secondary side. Wrong polarity can damage LED modules with no inverse-polarity protection. • Wrong wiring of the LED Driver can lead to malfunction or irreparable ...
impedance stabilization network for screened balanced pairs
impedance stabilization network for screened balanced pairs

... Impedance stabilization networks (ISN, or with CISPR 16-1-2 called AAN: asymmetric artificial network or AN: artificial networks for coaxial and other screened cables) are defined for measuring of conducted common mode disturbances at information technology equipment (ITE) as required in CISPR 22. T ...
Operating instructions K3G175RC0503 - ebm
Operating instructions K3G175RC0503 - ebm

SN75ALS161 数据资料 dataSheet 下载
SN75ALS161 数据资料 dataSheet 下载

... SN75ALS161 eight-channel Data Transfer general-purpose interface bus transceivers are high-speed, advanced low-power Schottky-process devices designed to provide the bus-management and data-transfer signals between operating units of a single-controller instrumentation system. When combined with the ...
ac current
ac current

... Selection of a lower range will move the decimal point one place and increase the accuracy of the reading .An OL(Over limit) display means the range is too low .select the next higher range. Meter Functions Resistance(Ω) IMPORTANT: if you are testing an application that has capacitors in the circuit ...
VC97
VC97

... 2-4.”DC/AC”key: switch DC and AC work mode.. 2-5.RANGE key:select auto range or manual range mode, Auto range is the original states, it will display ”AUTO” symbol ,press it change to manual range .Press it more than 2 second , it will return to auto range states 2-6.MAX/MIN key :press it, turn into ...
PV Module Reliability Scorecard
PV Module Reliability Scorecard

... As the solar industry matures long term performance and reliability of PV modules and other system components (i.e. inverters) have received increased focus from the investment community. Reduced cost of capital has resulted in the out years having real value in discounted cash flow analysis. The ob ...
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Automatic test equipment



Automatic or automated test equipment (ATE) is any apparatus that performs tests on a device, known as the Device Under Test (DUT), Equipment Under Test (EUT) or Unit Under Test (UUT), using automation to quickly perform measurements and evaluate the test results. An ATE can be a simple computer controlled digital multimeter, or a complicated system containing dozens of complex test instruments (real or simulated electronic test equipment) capable of automatically testing and diagnosing faults in sophisticated electronic packaged parts or on Wafer testing, including System-On-Chips and Integrated circuits.
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