Download 1.2 A Programmable Device Power Supply AD5560

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Data Sheet
AD5560
TEMPERATURE CONTOUR MAP ON THE TOP OF THE PACKAGE
BGA Package
Due to localized heating, temperature at the top surface of
the package has steep gradient. Thus, the θJC value is highly
dependent on where the case temperature is measured.
Figure 61 shows the top of the die temperature contour map
for the TQFP_EP.
Due to localized heating, temperature at the top surface of
the package has steep gradient. Thus, the θJC value is highly
dependent on where the case temperature is measured.
Figure 62 shows the top of the die temperature contour map
for the flip chip BGA.
07779-064
TQFP_EP Package
07779-065
Figure 61. Temperature Contour Map for 64-Lead TQFP_EP
Figure 62. Temperature Contour Map for the Flip Chip BGA
Rev. D | Page 63 of 68