Download 1.2 A Programmable Device Power Supply AD5560

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AD5560
Data Sheet
OUTLINE DIMENSIONS
1.20
MAX
0.75
0.60
0.45
12.20
12.00 SQ
11.80
0.675
0.872
5.95 BSC
64
49
1
1.00 REF
49
48
64
1
48
SEATING
PLANE
EXPOSED
PAD
5.95
BSC
10.20
10.00 SQ
9.80
7.85
BSC
TOP VIEW
(PINS DOWN)
0.15
0.05
0.08
COPLANARITY
BOTTOM VIEW
16
0.20
0.09
33
17
7°
3.5°
0°
VIEW A
32
16
17
32
7.85
BSC
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
VIEW A
(PINS UP)
33
10-19-2011-C
1.05
1.00
0.95
ROTATED 90° CCW
COMPLIANT TO JEDEC STANDARDS MS-026-ACD-HU
Figure 63. 64-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-64-3)
Dimensions shown in millimeters
8.10
8.00 SQ
7.90
5.720 REF
A1 BALL
CORNER
0.40 REF
A1 BALL
CORNER
(DIE OFFSET)
9
8
7
6
5
4
3
2
1
A
B
C
6.865 REF
6.40
BSC SQ
D
E
F
G
0.80
BSC
H
J
0.80
REF
*1.20
1.08
1.00
BOTTOM VIEW
DETAIL A
DETAIL A
0.36
REF
0.39
0.34
0.29
SEATING
PLANE
0.50
0.45
0.40
BALL DIAMETER
*COMPLIANT TO JEDEC STANDARDS MO-225 WITH
EXCEPTION TO PACKAGE HEIGHT.
Figure 64. 72-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-72-2)
Dimensions shown in millimeters
Rev. D | Page 64 of 68
0.81
0.76
0.71
COPLANARITY
0.12
04-19-2012-B
TOP VIEW