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FONTARGEN AP 22LL Slow-drying, flux-free copper-tin hard solder paste with average metal content, for steels, copper and copper alloys. Specification Based on DIN 8513: L - CuSn 20 Composition, guiding analysis (%) Sn Cu 20,0 80,0 Metal content approx. 82 % Technical specifications Melting range: 800-890°C Brazing range: 930-890°C Sources of heat Shielding gas furnace. The brazing temperature and furnace atmospheres depend on the type of base materials that are brazen. Paste application Manually or automatically with pneumatic dosing devices (see prospect FONTARGEN-“Dosing technology”). Properties FONTARGEN AP 22LL is a flux-free, slow-drying copper-tin hard solder paste with a medium viscosity and medium metal content. AP 22LL can be used in hydrogen-nitrogen mixtures or exothermic atmospheres. Thanks to its low melting temperature range, the paste is suited to brazing of work pieces made of copper and copper alloys. Application AP 22LL can be used for the brazing of unalloyed and alloyed steels, copper, copper alloys and coppered parts. The paste should be used on components subject to low mechanical stress. Tensile strength On steel St 37-2/1.0037 in tensile tests complying with DIN 50145: Gap of 0,05 mm: 205 N/mm 2 Gap of 0,15 mm: 127 N/mm2 Availability Batch sizes: 5,0/25,0/50,0 kg Smaller batch sizes on demand. Rev.-No.: 0/08.01/pi