Download BFP405F

BFP405F
Low Noise Silicon Bipolar RF Transistor
• For low current applications
3
• Minimum noise figure NFmin = 1.25 dB at 1.8 GHz
2
4
1
Outstanding G ms = 22.5 dB at 1.8 GHz
• Transition frequency fT = 25 GHz
• Pb-free (RoHS compliant) and halogen-free thin small
flat package (1.4 x 0.8 x 0.59 mm) with visible leads
• Qualification report according to AEC-Q101 available
BDTIC
ESD (Electrostatic discharge) sensitive device, observe handling precaution!
Type
BFP405F
Marking
ALs
1=B
Pin Configuration
2=E
3=C
4=E
-
Package
-
TSFP-4
Maximum Ratings at TA = 25 °C, unless otherwise specified
Parameter
Symbol
Collector-emitter voltage
VCEO
Value
Unit
V
TA = 25 °C
4.5
TA = -55 °C
4.1
Collector-emitter voltage
VCES
15
Collector-base voltage
VCBO
15
Emitter-base voltage
VEBO
1.5
Collector current
IC
25
Base current
IB
3
Total power dissipation1)
Ptot
75
mW
Junction temperature
TJ
150
°C
Storage temperature
TStg
mA
TS ≤ 112 °C
1T
S is
-55 ... 150
measured on the emitter lead at the soldering point to the pcb
Thermal Resistance
Parameter
Symbol
Value
Unit
Junction - soldering point1)
RthJS
500
K/W
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2013-09-19
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BFP405F
Electrical Characteristics at T A = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)CEO
4
5
-
V
ICES
-
-
10
µA
DC Characteristics
Collector-emitter breakdown voltage
IC = 1 mA, I B = 0
Collector-emitter cutoff current
VCE = 15 V, VBE = 0
BDTIC
Collector-base cutoff current
ICBO
-
-
100
nA
IEBO
-
-
1
µA
hFE
60
95
130
VCB = 5 V, IE = 0
Emitter-base cutoff current
VEB = 0.5 V, IC = 0
DC current gain
-
IC = 5 mA, VCE = 4 V, pulse measured
1For
the definition of RthJS please refer to Application Note AN077 (Thermal Resistance Calculation)
2
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2013-09-19
BFP405F
Electrical Characteristics at TA = 25 °C, unless otherwise specified
Symbol
Values
Parameter
Unit
min.
typ.
max.
18
25
-
Ccb
-
0.05
0.1
Cce
-
0.2
-
Ceb
-
0.25
-
NFmin
-
1.25
-
dB
Gms
-
22.5
-
dB
|S21|2
-
18
-
IP3
-
14
-
P-1dB
-
0
-
AC Characteristics (verified by random sampling)
Transition frequency
fT
GHz
IC = 10 mA, VCE = 3 V, f = 2 GHz
Collector-base capacitance
pF
VCB = 2 V, f = 1 MHz, VBE = 0 ,
emitter grounded
Collector emitter capacitance
BDTIC
VCE = 2 V, f = 1 MHz, VBE = 0 ,
base grounded
Emitter-base capacitance
VEB = 0.5 V, f = 1 MHz, VCB = 0 ,
collector grounded
Minimum noise figure
IC = 2 mA, VCE = 2 V, f = 1.8 GHz, ZS = ZSopt
Power gain, maximum stable1)
IC = 5 mA, VCE = 2 V, ZS = ZSopt ,
ZL = ZLopt , f = 1.8 GHz
Insertion power gain
VCE = 2 V, IC = 5 mA, f = 1.8 GHz,
ZS = ZL = 50 Ω
Third order intercept point at output2)
dBm
VCE = 2 V, IC = 5 mA, f = 1.8 GHz,
ZS = ZL = 50 Ω
1dB compression point at output
IC = 5 mA, VCE = 2 V, ZS = ZL = 50 Ω,
f = 1.8 GHz
1G
ms = |S 21 / S12 |
2IP3 value depends
on termination of all intermodulation frequency components.
Termination used for this measurement is 50Ω from 0.1 MHz to 6 GHz
3
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2013-09-19
BFP405F
Total power dissipation P tot = ƒ(TS)
90
mW
Ptot
70
60
50
BDTIC
40
30
20
10
0
0
30
60
90
°C
150
TS
4
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2013-09-19
Package TSFP-4
BFP405F
BDTIC
5
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2013-09-19
BFP405F
Edition 2009-11-16
Published by
Infineon Technologies AG
81726 Munich, Germany
 2009 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
BDTIC
The information given in this document shall in no event be regarded as a guarantee
of conditions or characteristics. With respect to any examples or hints given herein,
any typical values stated herein and/or any information regarding the application of
the device, Infineon Technologies hereby disclaims any and all warranties and
liabilities of any kind, including without limitation, warranties of non-infringement of
intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices,
please contact the nearest Infineon Technologies Office (<www.infineon.com>).
Warnings
Due to technical requirements, components may contain dangerous substances.
For information on the types in question, please contact the nearest Infineon
Technologies Office.
Infineon Technologies components may be used in life-support devices or systems
only with the express written approval of Infineon Technologies, if a failure of such
components can reasonably be expected to cause the failure of that life-support
device or system or to affect the safety or effectiveness of that device or system.
Life support devices or systems are intended to be implanted in the human body or
to support and/or maintain and sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or other persons may be
endangered.
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2013-09-19