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a FEATURES High CMRR: 100 dB Typ Low Nonlinearity: 0.001% Max Low Distortion: 0.001% Typ Wide Bandwidth: 3 MHz Typ Fast Slew Rate: 9.5 V/s Typ Fast Settling (0.01%): 1 s Typ Low Cost APPLICATIONS Summing Amplifiers Instrumentation Amplifiers Balanced Line Receivers Current-Voltage Conversion Absolute Value Amplifier 4 to 20 mA Current Transmitter Precision Voltage Reference Applications Lower Cost and Higher Speed Version of INA105 Precision, Unity-Gain Differential Amplifier AMP03 FUNCTIONAL BLOCK DIAGRAM AMP03 25k⍀ 25k⍀ –IN 2 SENSE 7 +VCC 6 OUTPUT 4 –VEE 1 REFERENCE 25k⍀ 25k⍀ +IN 5 3 PIN CONNECTIONS 8-Lead PDIP (P Suffix) GENERAL DESCRIPTION The AMP03 is a monolithic unity-gain, high speed differential amplifier. Incorporating a matched thin film resistor network, the AMP03 features stable operation over temperature without requiring expensive external matched components. The AMP03 is a basic analog building block for differential amplifier and instrumentation applications. REFERENCE 1 8 NC AMP03 www.BDTIC.com/ADI The differential amplifier topology of the AMP03 both amplifies the difference between two signals and provides extremely high rejection of the common-mode input voltage. By providing common-mode rejection (CMR) of 100 dB typical, the AMP03 solves common problems encountered in instrumentation design. As an example, the AMP03 is ideal for performing either addition or subtraction of two signals without using expensive externally matched precision resistors. The large common-mode rejection is made possible by matching the internal resistors to better than 0.002% and maintaining a thermally symmetric layout. Additionally, due to high CMR over frequency, the AMP03 is an ideal general amplifier for buffering signals in a noisy environment into data acquisition systems. The AMP03 is a higher speed alternative to the INA105. Featuring slew rates of 9.5 V/µs and a bandwidth of 3 MHz, the AMP03 offers superior performance to the INA105 for high speed current sources, absolute value amplifiers, and summing amplifiers. –IN 2 7 V+ TOP VIEW (Not to Scale) 6 OUTPUT 3 +IN V– 4 5 SENSE NC = NO CONNECT 8-Lead SOIC (S Suffix) REFERENCE 1 –IN 2 8 NC AMP03 7 V+ TOP VIEW (Not to Scale) 3 6 OUTPUT +IN 5 SENSE V– 4 NC = NO CONNECT Header (J Suffix) NC 8 REFERENCE 1 7 V+ –IN 2 6 OUTPUT 5 SENSE +IN 3 4 V– NC = NO CONNECT REV. F Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved. AMP03–SPECIFICATIONS ELECTRICAL CHARACTERISTICS (@ V = ⴞ15 V, T = +25ⴗC, unless otherwise noted.) S A Parameter Symbol Conditions Min AMP03F Typ Max Offset Voltage Gain Error VOS –400 +10 Input Voltage Range Common-Mode Rejection Power Supply Rejection Ratio Output Swing Short-Circuit Current Limit IVR CMR PSRR VO ISC Small-Signal Bandwidth (–3 dB) Slew Rate Capacitive Load Drive Capability Supply Current BW SR VCM = 0 V No Load, VIN = ± 10 V, RS = 0 Ω (Note 1) VCM = ± 10 V VS = ± 6 V to ± 18 V RL = 2 kΩ Output Shorted to Ground RL = 2 kΩ RL = 2 kΩ CL ISY No Oscillation No Load Min AMP03B AMP03G Typ Max Min Typ Max +400 –700 0.00004 0.008 ± 20 85 ± 12 10 ± 12 +45/–15 6 +700 –750 95 0.6 ± 13.7 10 ± 12 300 2.5 +45/–15 3 9.5 6 300 2.5 3.5 0.001 0.008 % V 95 dB 0.7 10 µV/V ± 13.7 V ± 20 80 +45/–15 3 9.5 +750 µV +25 0.00004 0.008 ± 20 80 100 0.6 ± 13.7 +20 mA MHz V/µs 3 9.5 6 300 2.5 3.5 Unit 3.5 pF mA NOTES 1 Input voltage range guaranteed by CMR test. Specifications subject to change without notice. ELECTRICAL CHARACTERISTICS (@ V = ⴞ15 V, –55ⴗC ≤ T ≤ +125ⴗC for B Grade) S A Parameter Symbol Conditions Min Offset Voltage Gain Error Input Voltage Range Common-Mode Rejection Power Supply Rejection Ratio Output Swing Slew Rate Supply Current VOS VCM = 0 V No Load, VIN = ± 10 V, RS = 0 Ω –1500 AMP03B Typ +150 0.0014 www.BDTIC.com/ADI IVR CMR VCM = ± 10 V PSRR VO SR ISY VS = ± 6 V to ± 18 V RL = 2 kΩ RL = 2 kΩ No Load ± 20 75 ± 12 Max Unit +1500 0.02 µV % V dB 20 µV/V V V/µs mA 95 0.7 ± 13.7 9.5 3.0 4.0 Specifications subject to change without notice. ELECTRICAL CHARACTERISTICS (@ V = ⴞ15 V, –40ⴗC ≤ T ≤ +85ⴗC for F and G Grades) S A AMP03F Typ Max Parameter Symbol Conditions Min Offset Voltage Gain Error Input Voltage Range Common-Mode Rejection Power Supply Rejection Ratio Output Swing Slew Rate Supply Current VOS VCM = 0 V No Load, VIN = ± 10 V, RS = 0 Ω –1000 +100 +1000 0.0008 0.015 ± 20 80 95 IVR CMR VCM = ± 10 V PSRR VO SR ISY VS = ± 6 V to ± 18 V RL = 2 kΩ RL = 2 kΩ No Load ± 12 0.7 ± 13.7 9.5 2.6 Min –2000 +200 0.002 ± 20 75 90 15 ± 12 4.0 AMP03G Typ Max 1.0 ± 13.7 9.5 2.6 Unit +2000 µV 0.02 % V dB 15 4.0 µV/V V V/µs mA Specifications subject to change without notice. –2– REV. F AMP03 WAFER TEST LIMITS (@ V = ⴞ15 V, T = 25ⴗC, unless otherwise noted.)* S A AMP03GBC Limit Parameter Symbol Conditions Offset Voltage Gain Error Input Voltage Range Common-Mode Rejection Power Supply Rejection Ratio Output Swing Short-Circuit Current Limit Supply Current VOS VS = ± 18 V No Load, VIN = ± 10 V, RS = 0 Ω IVR CMR PSRR VO ISC ISY VCM = ± 10 V VS = ± 6 V to ± 18 V RL = 2 kΩ Output Shorted to Ground No Load Unit 0.5 0.008 ± 10 80 8 ± 12 +45/–15 3.5 mV max % max V min dB min µV/V max V max mA min mA max *Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing. ABSOLUTE MAXIMUM RATINGS 1 DICE CHARACTERISTICS Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V Input Voltage2 . . . . . . . . . . . . . . . . . . . . . . . . . Supply Voltage Output Short-Circuit Duration . . . . . . . . . . . . . . Continuous Storage Temperature Range P, J Package . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . 300°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Operating Temperature Range AMP03B . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C AMP03F, AMP03G . . . . . . . . . . . . . . . . . . –40°C to +85°C Package Type Header (J) 8-Lead PDIP (P) 8-Lead SOIC (S) JA3 JC Unit 150 103 155 18 43 40 °C/W °C/W °C/W 1. 2. 3. 4. 5. 6. 7. 8. REFERENCE –IN +IN –VEE SENSE OUTPUT +VCC NC www.BDTIC.com/ADI NOTES 1 Absolute maximum ratings apply to both DICE and packaged parts, unless otherwise noted. 2 For supply voltages less than ± 18 V, the absolute maximum input voltage is equal to the supply voltage. 3 θJA is specified for worst-case mounting conditions, i.e., θJA is specified for device in socket for header and PDIP packages and for device soldered to printed circuit board for SOIC package. DIE SIZE 0.076 inch ⴛ 0.076 inch, 5,776 sq. mm (1.93 mm ⴛ 1.93 mm, 3.73 sq. mm) BURN-IN CIRCUIT +18V AMP03 25k⍀ 25k⍀ 25k⍀ ORDERING GUIDE Model1 AMP03GP AMP03BJ AMP03FJ AMP03BJ/883C AMP03GS AMP03GS-REEL 5962-9563901MGA AMP03GBC Temperature Range Package Description Package Option2 –40°C to +85°C –40°C to +85°C –40°C to +85°C –55°C to +125°C –40°C to +85°C –40°C to +85°C –55°C to +125°C 8-Lead PDIP Header Header Header 8-Lead SOIC 8-Lead SOIC Header Die P-8 H-08B H-08B H-08B S-8 S-8 H-08B –18V SLEW RATE TEST CIRCUIT +15V 0.1F AMP03 VOUT = ⴞ10V NOTES 1 Burn-in is available on commercial and industrial temperature range parts in PDIP and header packages. 2 Consult factory for /883 data sheet. VIN = ⴞ10V 0.1F –15V CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AMP03 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. REV. F –3– WARNING! ESD SENSITIVE DEVICE AMP03–Typical Performance Characteristics 120 100 TA = +25ⴗC VS = ⴞ15V AV = –1 90 80 0.010 THD+N (%) COMMON-MODE REJECTION (dB) 0.1 TA = +25ⴗC VS = ⴞ15V 110 70 60 50 40 RL = 600⍀ 0.001 30 RL = 100k⍀ 20 10 0 TPC 1. Small Signal Transient Response 1 10 100 1k 10k FREQUENCY (Hz) 100k 1M 0.0001 20 TPC 2. Common-Mode Rejection vs. Frequency 10k 20k TPC 3. Total Harmonic Distortion vs. Frequency 120 0.1 TA = +25ⴗC VS = ⴞ15V 110 100 TA = +25ⴗC VS = ⴞ15V AV = –1 90 –PSRR 80 0.010 70 DIM (%) POWER SUPPLY REJECTION (dB) 100 1k FREQUENCY (Hz) 60 50 +PSRR 40 RL = 600⍀, 100k⍀ 0.001 30 www.BDTIC.com/ADI 20 10 0 1 TPC 4. Large Signal Transient Response 1M 0.0001 2k 40 CLOSED-LOOP GAIN (dB) 600 400 200 0 –200 –400 –600 10k FREQUENCY (Hz) 50k TPC 6. Dynamic Intermodulation Distortion vs. Frequency 10 50 800 INPUT OFFSET VOLTAGE (V) 100k TPC 5. Power Supply Rejection vs. Frequency VS = ⴞ15V –800 –75 –50 –25 100 1k 10k FREQUENCY (Hz) TA = +25°C VS = ⴞ15V TA = +25°C VS = ⴞ15V 8 OUTPUT IMPEDANCE (⍀) 1000 10 30 20 10 0 –10 6 4 2 –20 0 25 50 75 100 125 150 TEMPERATURE (ⴗC) TPC 7. Input Offset Voltage vs. Temperature –30 100 0 1k 10k 100k FREQUENCY (Hz) 1M TPC 8. Closed-Loop Gain vs. Frequency –4– 10M 100 1k 10k 100k FREQUENCY (Hz) 1M TPC 9. Closed-Loop Output Impedance vs. Frequency REV. F AMP03 13 VS = ⴞ15V RS = 0⍀ SLEW RATE (V/s) GAIN ERROR (%) 0.001 0.000 –0.001 –0.002 8 MAXIMUM OUTPUT VOLTAGE (V) 3 2 1 4 3 2 1 0 –75 –50 –25 100 125 TPC 12. Supply Current vs. Temperature VS = ⴞ18V 15.0 TA = +25ⴗC VS = ⴞ15V 12.5 10.0 VS = ⴞ12V 7.5 VS = ⴞ9V 5.0 VS = ⴞ5V 2.5 VS = ⴞ18V –15.0 VS = ⴞ15V –12.5 –10.0 VS = ⴞ12V –7.5 VS = ⴞ9V –5.0 VS = ⴞ5V –2.5 www.BDTIC.com/ADI ⴞ5 ⴞ10 ⴞ15 SUPPLY VOLTAGE (V) ⴞ20 TPC 13. Supply Current vs. Supply Voltage 120 0 25 50 75 100 125 150 TEMPERATURE (ⴗC) –17.5 17.5 TA = +25ⴗC SUPPLY CURRENT (mA) 9 TPC 11. Slew Rate vs. Temperature 4 VOLTAGE NOISE DENSITY (nV/ Hz) 10 6 –75 –50 –25 0 25 50 75 TEMPERATURE (ⴗC) 0 25 50 75 100 125 150 TEMPERATURE (ⴗC) TPC 10. Gain Error vs. Temperature 0 11 7 –0.003 –75 –50 –25 0 VS = ⴞ15V 5 SUPPLY CURRENT (mA) 12 0.002 6 VS = ⴞ15V RL = 2k⍀ MAXIMUM OUTPUT VOLTAGE (V) 0.003 TA = +25ⴗC 0 0 0 6 12 18 24 30 OUTPUT SOURCE CURRENT (mA) 36 TPC 14. Maximum Output Voltage vs. Output Current (Source) 0 –2 –4 –6 –10 –8 OUTPUT SINK CURRENT (mA) –12 TPC 15. Maximum Output Voltage vs. Output Current (Sink) TA = +25ⴗC VS = ⴞ15V 100 80 60 +1V +10V 0V 0V –1V –10V 40 20 0 1 10 100 1k FREQUENCY (Hz) 10k TPC 16. Voltage Noise Density vs. Frequency NOTE: EXTERNAL AMPLIFIER GAIN = 1000; THEREFORE, VERTICAL SCALE = 10V/DIV. 0.1 TO 10Hz PEAK-TO-PEAK NOISE TPC 18. Voltage Noise from 0 kHz to 1 kHz TPC 17. Low Frequency Voltage Noise +10V 0V –10V NOTE: EXTERNAL AMPLIFIER GAIN = 1000; THEREFORE, VERTICAL SCALE = 10V/DIV. TPC 19. Voltage Noise from 0 kHz to 10 kHz REV. F –5– AMP03 +V APPLICATIONS INFORMATION 0.1F The AMP03 represents a versatile analog building block. In order to capitalize on the fast settling time, high slew rate, and high CMR, proper decoupling and grounding techniques must be employed. Figure 1 illustrates the use of 0.1 µF decoupling capacitors and proper ground connections. (GROUND REFERENCE 2) AMP03 VOUT = –VSIGNAL VSIGNAL –V ECM MAINTAINING COMMON-MODE REJECTION 0.1F GROUND REFERENCE 1 In order to achieve the full common-mode rejection capability of the AMP03, the source impedance must be carefully controlled. Slight imbalances of the source resistance will result in a degradation of dc CMR—even a 5 Ω imbalance will degrade CMR by 20 dB. Also, the matching of the reactive source impedance must be matched in order to preserve the CMRR over frequency. GROUND REFERENCE 2 Figure 1. AMP03 Serves to Reject Common-Mode Voltages in Instrumentation Systems. Common-Mode Voltages Occur Due to Ground Current Returns. VSIGNAL and ECM Must Be within the Common-Mode Range of AMP03. APPLICATION CIRCUITS +15V 0.1F AMP03 R1 25k⍀ R2 25k⍀ REF10 +5V OUT –IN E1 E0 = E2 – E1 AMP03 –5V OUT +IN E2 R3 25k⍀ R4 25k⍀ www.BDTIC.com/ADI Figure 2. Precision Difference Amplifier. Rejects Common-Mode Signal = (E1 + E2)/2 by 100 dB Figure 5. ⴞ5 V Precision Voltage Reference AMP03 E1 E0 = –E1 AMP03 E0 = E1 + E2 E1 E2 Figure 3. Precision Unity-Gain Inverting Amplifier Figure 6. Precision Summing Amplifier +15V 0.1F R1 R2 +10V OUT REF10 AMP03 –10V OUT AMP03 E1 E = E2 E0 = (R2/R1+1) 1 2 E2 Figure 4. ⴞ10 V Precision Voltage Reference Figure 7. Precision Summing Amplifier with Gain –6– REV. F AMP03 AMP03 E2 R System Design Requirement Suggested Op Amp For A1 and A2 Source Impedance Low, Need Low Voltage Noise Performance OP27, OP37 OP227 (Dual Matched) OP270 (Dual) OP271 OP470 OP471 Source Impedance High (RS ≥ 15 kΩ). Need Low Current Noise OP80 OP41 OP43 OP249 OP97 Require Ultrahigh Input Impedance OP80 OP97 OP41 OP43 Need Wider Bandwidth and High Speed OP42 OP43 OP249 E1 OP80EJ I 0 = (E1 – E2 )/R I0 LOAD Figure 8. Differential Input Voltage-to-Current Converter for Low IOUT. OP80EJ maintains 250 fA max input current, allowing IO to be less than 1 pA. AMP03 –IN E1 A1 R2 R1 E0 OUTPUT R2 A2 +IN E2 E0 = (1 + 2R2/R1) (E2 – E1) Figure 9. Suitable Instrumentation Amplifier Requirements Can Be Addressed by Using an Input Stage Consisting of A1, A2, R1, and R2. The following matrix suggests a suitable amplifier. www.BDTIC.com/ADI REV. F –7– AMP03 OUTLINE DIMENSIONS 8-Lead Small Outline Package [SOIC] [S Suffix] (R-8) 8-Lead Plastic Dual In-Line Package [PDIP] [P Suffix] (N-8) 5.00 (0.1968) 4.80 (0.1890) 0.375 (9.53) 0.365 (9.27) 0.355 (9.02) 8 5 1 4 0.150 (3.81) 0.130 (3.30) 0.110 (2.79) 0.022 (0.56) 0.018 (0.46) 0.014 (0.36) 4.00 (0.1574) 3.80 (0.1497) 0.295 (7.49) 0.285 (7.24) 0.275 (6.98) 0.325 (8.26) 0.310 (7.87) 0.300 (7.62) 0.100 (2.54) BSC 0.180 (4.57) MAX C00249–0–12/03(F) Dimensions shown in millimeters and (inches) Dimensions shown in inches and (millimeters) 0.015 (0.38) MIN 5 1 4 6.20 (0.2440) 5.80 (0.2284) 1.27 (0.0500) BSC 0.150 (3.81) 0.135 (3.43) 0.120 (3.05) 0.25 (0.0098) 0.10 (0.0040) COPLANARITY SEATING 0.10 PLANE 0.015 (0.38) 0.010 (0.25) 0.008 (0.20) SEATING PLANE 0.060 (1.52) 0.050 (1.27) 0.045 (1.14) 8 1.75 (0.0688) 1.35 (0.0532) 0.51 (0.0201) 0.31 (0.0122) 0.50 (0.0196) ⴛ 45ⴗ 0.25 (0.0099) 8ⴗ 0.25 (0.0098) 0ⴗ 1.27 (0.0500) 0.40 (0.0157) 0.17 (0.0067) COMPLIANT TO JEDEC STANDARDS MS-012AA CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN COMPLIANT TO JEDEC STANDARDS MO-095AA CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN www.BDTIC.com/ADI 8-Lead Metal Can [TO-99] [J Suffix] (H-08B) Dimensions shown in inches and (millimeters) REFERENCE PLANE 0.1850 (4.70) 0.1650 (4.19) 0.5000 (12.70) MIN 0.2500 (6.35) MIN 0.1000 (2.54) BSC 0.1600 (4.06) 0.1400 (3.56) 0.0500 (1.27) MAX 0.3700 (9.40) 0.3350 (8.51) 0.3350 (8.51) 0.3050 (7.75) 5 0.0400 (1.02) MAX 6 4 0.2000 (5.08) BSC 3 7 2 0.1000 (2.54) BSC 0.0190 (0.48) 0.0160 (0.41) 0.0400 (1.02) 0.0100 (0.25) 0.0210 (0.53) 0.0160 (0.41) 0.0450 (1.14) 0.0270 (0.69) 8 1 0.0340 (0.86) 0.0280 (0.71) 45 BSC BASE & SEATING PLANE COMPLIANT TO JEDEC STANDARDS MO-002AK CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN Revision History Location Page 12/03—Data Sheet changed from REV. E to REV. F. Changes to ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 –8– REV. F