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Transcript
US5U30
Transistor
2.5V Drive Pch+SBD MOSFET
US5U30
zStructure
Silicon P-channel MOSFET
Schottky Barrier DIODE
zDimensions (Unit : mm)
TUMT5
2.0
zFeatures
1) The US5U30 combines Pch MOSFET with a
Schottky barrier diode in a TUMT5 package.
2) Low on-state resistance with fast switching.
3) Low voltage drive(2.5V)
4) Built-in schottky barrier diode has low forward voltage.
0.2Max.
1.3
Abbreviated symbol : U30
zApplications
Load switch, DC/DC conversion
zPackaging specifications
Package
Type
Code
Basic ordering unit (pieces)
zEquivalent circuit
Taping
(5)
(4)
TR
3000
∗2
US5U30
∗1
(1)
(2)
∗1 ESD protection diode
∗2 Body diode
(3)
(1)Gate
(2)Source
(3)Anode
(4)Cathode
(5)Drain
Rev.B
1/4
US5U30
Transistor
zAbsolute maximum ratings (Ta=25°C)
<MOSFET>
Symbol
VDSS
VGSS
ID
IDP ∗1
IS
ISP ∗1
Tch
PD ∗3
Limits
−20
±12
±1
±4
−0.4
−4
150
0.7
Unit
V
V
A
A
A
A
°C
W / ELEMENT
<Di>
Repetitive peak reverse voltage
Reverse voltage
Forward current
Forward current surge peak
Junction temperature
Power dissipation
VRM
VR
IF
IFSM
Tj
PD
30
20
0.5
2
150
0.5
V
V
A
A
°C
W / ELEMENT
<MOSFET AND Di>
Total power dissipation
Range of Storage temperature
PD ∗3
Tstg
1.0
−55 to +150
W / TOTAL
°C
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body diode)
Continuous
Pulsed
Continuous
Pulsed
Channel temperature
Power dissipation
∗2
∗3
∗1 Pw≤10µs, Duty cycle≤1% ∗2 60Hz•1cyc. ∗3 Mounted on a ceramic board
zElectrical characteristics (Ta=25°C)
<MOSFET>
Parameter
Symbol Min.
−
IGSS
Gate-source leakage
Drain-source breakdown voltage V(BR) DSS −20
IDSS
−
Zero gate voltage drain current
VGS (th) −0.7
Gate threshold voltage
−
∗
Static drain-source on-state
RDS (on)
−
resistance
−
∗
Yfs
0.7
Forward transfer admittance
Ciss
−
Input capacitance
Coss
−
Output capacitance
Crss
−
Reverse transfer capacitance
∗
td (on)
−
Turn-on delay time
∗
tr
−
Rise time
∗
td (off)
−
Turn-off delay time
∗
tf
−
Fall time
Qg
−
Total gate charge
Qgs
−
Gate-source charge
Qgd
−
Gate-drain charge
Typ.
−
−
−
−
280
310
570
−
150
20
20
9
8
25
10
2.1
0.5
0.5
Max.
±10
−
−1
−2.0
390
430
800
−
−
−
−
−
−
−
−
−
−
−
Unit
µA
V
µA
V
mΩ
mΩ
mΩ
S
pF
pF
pF
ns
ns
ns
ns
nC
nC
nC
Conditions
VGS=±12V, VDS=0V
ID=−1mA, VGS=0V
VDS=−20V, VGS=0V
VDS=−10V, ID=−1mA
ID=−1A, VGS=−4.5V
ID=−1A, VGS=−4V
ID=−0.5A, VGS=−2.5V
VDS=−10V, ID=−0.5A
VDS=−10V
VGS=0V
f=1MHz
ID=−0.5A
VDD −15V
VGS=−4.5V
RL=30Ω
RG=10Ω
VDD −15V VGS=−4.5V
ID=−1A
RL=15Ω
RG=10Ω
∗ Pulsed
<Body diode (source−drain)>
Parameter
Forward voltage
Symbol
Min.
Typ.
Max.
Unit
VSD
−
−
−1.2
V
Symbol
Min.
−
Typ.
−
Max.
0.36
Unit
V
IF=0.1A
−
−
−
−
0.47
100
V
µA
IF=0.5A
VR=20V
Conditions
IS=−0.4A, VGS=0V
<Di >
Parameter
Forward voltage
VF
Reverse current
IR
Conditions
Rev.B
2/4
US5U30
Transistor
1000
Static Drain−Source On−State Resistance
RDS(on)[mΩ]
10
VDS=−10V
Pulsed
Ta=125°C
75°C
25°C
−20°C
0.01
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
100
100
Ta=125°C
75°C
25°C
−25°C
10
0.1
4.0
1
Static Drain−Source On−State Resistance
RDS(on)[mΩ]
Static Drain−Source On−State Resistance
RDS(on)[mΩ]
Ta=125°C
75°C
25°C
−25°C
1
Fig.4 Static Drain−Source On−State
Resistance vs.Drain−Current
1
ID=−0.75A
−1.5A
250
100
200
150
100
50
0
2
4
6
8
10
Ta=125°C
75°C
25°C
−25°C
0.1
Ta=25 C
Pulsed
VGS=−2.5V
−4.0V
−4.5V
10
0.1
12
1
Fig.6 Static Drain−Source On−State
Resistance vs.Drain Current
Fig.5 Static Drain−Source On−State
Resistance vs.Gate−Source Voltage
Ta=25 C
f=1MHZ
VGS=0V
1000
1000
Ciss
100
Ta=25 C
VDD=−15V
VGS=−4.5V
RG=10Ω
Pulsed
100
td(off)
10
0.5
1.0
1.5
2.0
10
0.01
0.1
1
10
tf
td(on)
tr
Coss
Crss
0.01
0
10
Drain Current : −ID[A]
Gate−Source Voltage : −VGS[V]
10000
VGS=0V
Pulsed
Capacitance : C [pF]
Reverse Drain Current : −IDR[A]
10
1000
300
0
10
10
Fig.3 Static Drain−Source On−State
Resistance vs.Drain Current
Ta=25 C
Pulsed
350
Drain Current : −ID[A]
1
Drain Current : −ID[A]
400
VGS=−2.5V
Pulsed
10
0.1
10
0.1
10
Fig.2 Static Drain−Source On−State
Resistance vs.Drain Current
Fig.1 Typical Transfer Characteristics
100
Ta=125°C
75°C
25°C
−25°C
Drain Current : −ID[A]
Gate−Source Voltage : VGS[V]
1000
VGS=−4V
Pulsed
Static Drain-Source On−State Resistance
RDS(on)[mΩ]
0.1
1000
VGS=−4.5V
Pulsed
Switching Time : t [ns]
Drain Current : −ID (A)
1
0.001
Static Drain−Source On−State Resistance
RDS(on)[mΩ]
zElectrical characteristic curves
100
1
0.01
0.1
1
Source−Drain Voltage : −VSD[V]
Drain−Source Voltage : −VDS[V]
Drain Current : −ID[A]
Fig.7 Reverse Drain Current
vs. Source-Drain Current
Fig.8 Typical Capactitance
vs.Drain−Source Voltage
Fig.9 Switching Characteristics
Rev.B
10
3/4
US5U30
Transistor
6
Forward Current : IF [mA]
Gate-Source Voltage: -VGS [V]
1000
Ta=25 C
VDD=−15V
ID=−2.5A
RG=10Ω
Pulsed
7
5
4
3
2
100
Ta=125°C
75°C
25°C
−25°C
100
125°C
Reverse Current : IR[A]
8
10
10
75°C
1
0.1
25°C
0.01
1
−25°C
0.001
1
0
0.1
0
1
2
3
4
5
0.0001
0
6
0.1
0.2
0.3
0.4
0.5
0.6
0
10
Forward Voltage :VF [V]
20
30
40
Reverse Voltage : VR[V]
Total Gate Charge : Qg[nC]
Fig.10 Dynamic Input Characteristics
Fig.11 Forward Temperature Characteristics
Fig.12 Reverse Temperature Characteristics
zMeasurement circuits
Pulse Width
VGS
10%
50%
50%
90%
10%
10%
VGS
ID
D.U.T.
RG
VDS
90%
90%
VDS
RL
VDD
td(on)
tr
tf
td(off)
ton
toff
Fig.14 Switching Waveforms
Fig.13 Switching Time Measurement Circuit
VG
Qg
VGS
VGS
ID
VDS
Qgs
IG(Const)
RG
D.U.T.
Qgd
RL
VDD
Charge
Fig.15 Gate Charge Measurement Circuit
Fig.16 Gate Charge Waveforms
Rev.B
4/4
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1