Download 4.1.4 Summary to: 4.1 Input to Si Processing in an...

Survey
yes no Was this document useful for you?
   Thank you for your participation!

* Your assessment is very important for improving the workof artificial intelligence, which forms the content of this project

Document related concepts

X-ray crystallography wikipedia , lookup

Rheology wikipedia , lookup

Microelectromechanical systems wikipedia , lookup

History of metamaterials wikipedia , lookup

Materials Research Science and Engineering Centers wikipedia , lookup

Nanochemistry wikipedia , lookup

Crystal structure wikipedia , lookup

Colloidal crystal wikipedia , lookup

Transcript
4.1.4 Summary to: 4.1 Input to Si Processing in an Industrial Environment
Semiconductor technology happens in factories. They
need special materials, "reticles" (= structures),
"know-how" and huge amoundt of money (= capital)
as major inputs
It's always about money! Only mass production
will recover large investments.
The materials side always contains
semiconductor substrates ("wafers") and often
very dangerous special "raw" materials.
A number tells it all: 500 - 1.000 wafers /day are
processed in a large Si "wafer fab"
Three big steps to Si wafers
Si single crystal growth is done by "Czochralski
process" (CZ).
Sand (SiO2)
Metallurgical Si
Poly-Si
Dislocation-free crystals are possible but "bulk
microdefects" and impurities cannot be totally
avoided.
Nearly perfect 300 mm wafers are standard.
Exercise 4.1-1
All Questions to 4.1
Semiconductor Technology - Script - Page 1
⇒
⇒
⇒
Metallurgical Si
clean (doped) poly-Si.
Single crystal / wafer