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Review: Energy & Power Equations E = CL VDD2 P01 + tsc VDD Ipeak P01 + VDD Ileakage f01 = P01 * fclock P = CL VDD2 f01 + tscVDD Ipeak f01 + VDD Ileakage Dynamic power (~90% today and decreasing relatively) Short-circuit power (~8% today and decreasing absolutely) Leakage power (~2% today and increasing) Review: Power and Energy Design Space Constant Throughput/Latency Energy Design Time Variable Throughput/Latency Non-active Modules Logic Design DFS, DVS Sizing Active Run Time Clock Gating Reduced Vdd Multi-Vdd (Dynamic Freq, Voltage Scaling) Sleep Transistors Leakage + Multi-VT Variable VT Multi-Vdd + Variable VT Dynamic CMOS In static circuits at every point in time (except when switching) the output is connected to either GND or VDD via a low resistance path. fan-in of N requires 2N devices Dynamic circuits rely on the temporary storage of signal values on the capacitance of high impedance nodes. requires only N + 2 transistors takes a sequence of precharge and conditional evaluation phases to realize logic functions Dynamic Gate CLK CLK Mp off Mp on Out In1 In2 In3 CLK CL PDN 1 Out !((A&B)|C) A C B Me CLK Two phase operation Precharge (CLK = 0) Evaluate (CLK = 1) off Me on Conditions on Output Once the output of a dynamic gate is discharged, it cannot be charged again until the next precharge operation. Inputs to the gate can make at most one transition during evaluation. Output can be in the high impedance state during and after evaluation (PDN off), state is stored on CL Properties of Dynamic Gates Logic function is implemented by the PDN only number of transistors is N + 2 (versus 2N for static complementary CMOS) should be smaller in area than static complementary CMOS Full swing outputs (VOL = GND and VOH = VDD) Nonratioed - sizing of the devices is not important for proper functioning (only for performance) Faster switching speeds reduced load capacitance due to lower number of transistors per gate (Cint) so a reduced logical effort reduced load capacitance due to smaller fan-out (Cext) no Isc, so all the current provided by PDN goes into discharging CL Ignoring the influence of precharge time on the switching speed of the gate, tpLH = 0 but the presence of the evaluation transistor slows down the tpHL Properties of Dynamic Gates, con’t Power dissipation should be better But power dissipation can be significantly higher due to higher transition probabilities extra load on CLK PDN starts to work as soon as the input signals exceed VTn, so set VM, VIH and VIL all equal to VTn consumes only dynamic power – no short circuit power consumption since the pull-up path is not on when evaluating lower CL- both Cint (since there are fewer transistors connected to the drain output) and Cext (since there the output load is one per connected gate, not two) by construction can have at most one transition per cycle – no glitching low noise margin (NML) Needs a precharge clock Dynamic Behavior CLK 2.5 Out Evaluate In1 1.5 In2 In3 In & CLK 0.5 In4 CLK Out Precharge -0.5 0 0.5 #Trns VOH VOL VM NMH 6 2.5V 0V VTn 2.5-VTn Time, ns NML VTn tpHL 1 tpLH tp 110ps 0ns 83ps Gate Parameters are Time Independent The amount by which the output voltage drops is a strong function of the input voltage and the available evaluation time. Noise needed to corrupt the signal has to be larger if the evaluation time is short – i.e., the switching threshold is truly time independent. CLK 2.5 Voltage (V) Vout (VG=0.45) 1.5 Vout (VG=0.55) 0.5 Vout (VG=0.5) VG -0.5 0 20 40 60 Time (ns) 80 100 Power Consumption of Dynamic Gate CLK Mp Out In1 In2 In3 CLK CL PDN Me Power only dissipated when previous Out = 0 Dynamic Power Consumption is Data Dependent Dynamic 2-input NOR Gate A B Out 0 0 1 0 1 0 1 0 0 1 1 0 Assume signal probabilities PA=1 = 1/2 PB=1 = 1/2 Then transition probability P01 = Pout=0 x Pout=1 = 3/4 x 1 = 3/4 Switching activity can be higher in dynamic gates! P01 = Pout=0 Issues in Dynamic Design 1: Charge Leakage CLK 4 CLK 3 Mp Out 1 CL A=0 2 CLK Evaluate VOut Me Precharge Leakage sources Minimum clock rate of a few kHz Impact of Charge Leakage Output settles to an intermediate voltage determined by a resistive divider of the pull-up and pull-down networks Once the output drops below the switching threshold of the fan-out logic gate, the output is interpreted as a low voltage. CLK 2.5 Voltage (V) Out 1.5 0.5 -0.5 0 20 Time (ms) 40 A Solution to Charge Leakage Keeper compensates for the charge lost due to the pulldown leakage paths. Keeper CLK Mp Mkp !Out A CL B CLK Me Same approach as level restorer for pass transistor logic Issues in Dynamic Design 2: Charge Sharing CLK Mp Out A CL B=0 CLK Ca Me Charge stored originally on CL is redistributed (shared) over CL and CA leading to static power consumption by downstream gates and possible circuit malfunction. Cb When Vout = - VDD (Ca / (Ca + CL )) the drop in Vout is large enough to be below the switching threshold of the gate it drives causing a malfunction. Charge Sharing Example What is the worst case voltage drop on y? (Assume all inputs are low during precharge and that all internal nodes are initially at 0V.) CLK a Ca=15fF B c Cc=15fF A y=ABC !A Load inverter Cy=50fF b !B B !C C !B d Cb=15fF Cd=10fF CLK Vout = - VDD ((Ca + Cc)/((Ca + Cc) + Cy)) = - 2.5V*(30/(30+50)) = -0.94V Solution to Charge Redistribution CLK Mp Mkp CLK Out A B CLK Me Precharge internal nodes using a clockdriven transistor (at the cost of increased area and power) Issues in Dynamic Design 3: Backgate Coupling Susceptible to crosstalk due to 1) high impedance of the output node and 2) capacitive coupling Out2 capacitively couples with Out1 through the gate-source and gate-drain capacitances of M4 CLK Mp A=0 M1 B=0 M2 CLK Out1 =1 CL1 M6 M5 Out2 =0 M4 CL2 M3 Me Dynamic NAND Static NAND In Backgate Coupling Effect Capacitive coupling means Out1 drops significantly so Out2 doesn’t go all the way to ground 3 2 Out1 1 CLK 0 Out2 In -1 0 2 Time, ns 4 6 Issues in Dynamic Design 4: Clock Feedthrough A special case of capacitive coupling between the clock input of the precharge transistor and the dynamic output node CLK Mp A CL B CLK Out Me Coupling between Out and CLK input of the precharge device due to the gatedrain capacitance. So voltage of Out can rise above VDD. The fast rising (and falling edges) of the clock couple to Out. Clock Feedthrough CLK Clock feedthrough Out In1 2.5 In2 1.5 In3 In4 In & CLK 0.5 Out CLK -0.5 0 0.5 Time, ns 1 Clock feedthrough Cascading Dynamic Gates V CLK Mp CLK CLK Mp Out1 Out2 In In CLK Me CLK Out1 VTn Me V Out2 t Only a single 0 1 transition allowed at the inputs during the evaluation period! Domino Logic CLK In1 In2 In3 CLK Mp 11 10 PDN Me Out1 CLK Mp Mkp 00 01 In4 In5 CLK PDN Me Out2 Why Domino? CLK In1 Ini PDN Inj CLK Ini Inj PDN Ini Inj PDN Like falling dominos! Ini Inj PDN Domino Manchester Carry Chain CLK 3 P0 3 4 Ci,0 CLK P1 3 3 P2 3 2 P3 3 1 Ci,4 5 G0 4 G1 3 G2 2 G3 1 6 5 4 3 2 !(G0 + P0 Ci,0) !(G1 + P1G0 + P1P0 Ci,0) Domino Comparator CLK A3 A2 A1 A0 Out B3 B2 B1 B0 Properties of Domino Logic Only non-inverting logic can be implemented, fixes include can reorganize the logic using Boolean transformations use differential logic (dual rail) use np-CMOS (zipper) Very high speed tpHL =0 static inverter can be optimized to match fan-out (separation of fan-in and fan-out capacitances) Differential (Dual Rail) Domino off CLK Out = AB 1 on Mp Mkp Mkp 0 CLK Mp 0 !Out = !(AB) 1 A !A !B B CLK Me Due to its high-performance, differential domino is very popular and is used in several commercial microprocessors! np-CMOS (Zipper) CLK In1 In2 In3 CLK Mp 11 10 Out1 !CLK In4 In5 PDN Me PUN 00 01 !CLK Me to other PDN’s Mp Out2 (to PDN) to other PUN’s Only 0 1 transitions allowed at inputs of PDN Only 1 0 transitions allowed at inputs of PUN np-CMOS Adder Circuit !CLK !A1 !B1 1x 0x !B1 !A1 !A1 0 xC !CLK !B1 1x CLK !C1 2 Sum1 !C1 !A1 !B1 CLK !CLK CLK 1 x!C1 0x A0 C0 A0 B0 CLK B0 A0 B0 C0 1x !CLK B0 A0 C0 !Sum0 0x DCVS Logic 10 Out In1 !In1 In2 !In2 on off PDN1 off on off on 01 !Out PDN2 on off PDN1 and PDN2 are mutually exclusive DCVSL Example !Out Out B !B A !B B !A How to Choose a Logic Style Must consider ease of design, robustness (noise immunity), area, speed, power, system clocking requirements, fan-out, functionality, ease of testing 4-input NAND Style # Trans Comp Static 8 CPL* 12 + 2 domino 6+2 DCVSL* 10 Ease 1 2 4 3 Ratioed? Delay Power no 3 1 no 4 3 no 2 2 + clk yes 1 4 * Dual Rail Current trend is towards an increased use of complementary static CMOS: design support through DA tools, robust, more amenable to voltage scaling.