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Heterojunction Bipolar Transistors for High-Frequency Operation D.L. Pulfrey Department of Electrical and Computer Engineering University of British Columbia Vancouver, B.C. V6T1Z4, Canada [email protected] http://nano.ece.ubc.ca 1 Day 3A, May 29, 2008, Pisa 2 Outline • What are the important features of HBTs? • What are the useful attributes of HBTs? • What are the determining factors for IC and IB? • Why are HBTs suited to high-frequency operation? • How are the capacitances reduced? Schematic of InGaP/GaAs HBT • Epitaxial structure • Dissimilar emitter and base materials • Highly doped base • Dual B and C contacts • Identify WB and RB 3 4 HETEROJUNCTION BIPOLAR TRANSISTORS • The major development in bipolar transistors (since 1990) • HBTs break the link between NB and • Do this by making different barrier heights for electrons and holes • NB can reach 1E20cm-3 - this allows reduction of both WB and RB - this improves fT and fmax • Key feature is the wide-bandgap emitter An example of Bandgap Engineering SHBT e- h+ Selecting an emitter for a GaAs base 2.5 AlP AlAs GaP Bandgap, eV 2 1.5 GaAs Si AlGaAs / GaAs InP 90 80 1 70 60 50 Ge 40 30 0.5 ° a = 5.6533 A matched to GaAs 0 5.4 5.5 5.6 5.7 20 10 ° a = 5.8688 A matched to InP 5.8 ° 5.9 6 InAs 6.1 Lattice Constant, A InGaP / GaAs 5 6 InGaP/GaAs and AlGaAs/GaAs Draw band diagrams for different emitter Preparing to compute IC • Why do we show asymmetrical hemi-Maxwellians? 7 8 Current in a hemi-Maxwellian Full Maxwellian distribution Counter-propagating hemi-M's for n0=1E19/cm3 /1E20 What is the current? 9 Density of states Recall: In 1-D, a state occupies how much k-space? What is the volume in 3-D? If kx and ky (and kz in 3-D) are large enough, k-space is approximately spherical Divide by V (volume) to get states/m3 Use parabolic E-k (involves m*) to get dE/dk Divide by dE to get states/m3/eV 10 Velocities Turn n(E) from previous slide into n(v) dv using * vR = 1E7 cm/s for GaAs Currents associated with hemi-M's and M's = 1E7 A/cm2 for n0=6E18 /cm3 What is Je,total ? Collector current: boundary conditions 11 12 Reduce our equation-set for the electron current in the base What about the recombination term? 13 Diffusion and Recombination in the base Here, we need: 10 Diffusion length (cm) 10 10 10 10 -1 Le Lh -2 n( x ) n ( 0) n( x ) n0 B n ( 0) n 0 B n( x ) n -3 0B WB n ( 0) n 0 B Le -4 WB x L e -5 x WB WB -6 10 16 10 10 17 In modern HBTs WB/Le << 1 18 10 Doping (cm-3) 10 19 10 and 20 WB Le x WB is constant 14 Collector current: controlling velocities * Diffusion (and no recombination) in the base: -1 10 x 10 4 9 8 JC (Acm-2) 7 Note: vR=infinity vR =1e7 cm/s 6 - the reciprocal velocities 5 - inclusion of vR necessary in modern HBTs 4 3 2 1 0 1 10 2 10 W B (nm) 10 3 * Gives limit to validity of SLJ Comparing results • What are the reasons for the difference? 15 Base current: components (iv) • Which IB components do we need to consider? 16 IC (A/cm2) Base current components and Gummel plot IC IB (recombination) IB (injection) VBE (V) • What is the DC gain? 17 18 Preparing for the high-frequency analysis • Make all these functions of time and solve! • Or, use the quasi-static approximation 19 The Quasi-Static Approximation q(x, y, z, t' ) = f( VTerminals, t') q(x, y, z, t' ) f( VTerminals, t < t') 20 Small-signal circuit components gm = transconductance go = output conductance ib g vbe g12 vce g = input conductance g12 = reverse feedback conductance 21 Recall g12=dIb/dVce next Small-signal hybrid- equivalent circuit What are the parasitics? 22 HBT Parasitics • CEB and RB2 need explanation 23 Base-spreading resistance y 24 25 Capacitance Generally: Q C V V + + 1 - - 2 Specifically: Emitter-base junction-storage capacitance E WB2 B 26 C QNB QNE QNC WB1 VBE C EB, j QE , j VBE C EB, j A WB + • QE,j is the change in charge entering the device through the emitter and creating the new width of the depletion layer (narrowing it in this example), • in response to a change in VBE (with E & C at AC ground). • It can be regarded as a parallel-plate cap. What is the voltage dependence of this cap? Emitter-base base-storage capacitance: concept E B C QNB QNE QNC VBE C EB,b QE ,b VBE + • QE,b is the change in charge entering the device through the emitter and resting in the base (the black electrons), • in response to a change in VBE (with E & C at AC ground). • It’s not a parallel-plate cap, and we only count one carrier. 27 Emitter-base base-storage capacitance: evaluation 28 B QNB For the case of no recombination in the base: n(x) V 1 QE ,b (VBE ) q WB An0 p exp( BE ) n(WB ) qWB An(WB ) 2 Vth n(WB) x WB Take Q E,b VBE dQE ,b dVBE Hence C EB,b n(0,VBE1 ) n0 p exp(VBE1 / Vth ) n(0,VBE , 2 ) n0 p exp(VBE 2 / Vth ) What is the voltage dependence of CEB,b ? Base-emitter transit capacitance: evaluation Q = 3q qe = -2q • What are q0 and qd ? • Where do they come from ? 29 fT from hybrid-pi equivalent circuit • g0 and g set to 0 • fT is measured under AC short-circuit conditions. • We seek a solution for |ic/ib|2 that has a single-pole roll-off with frequency. • Why? • Because we wish to extrapolate at -20 dB/decade to unity gain. 30 Extrapolated fT • Assumption: • Conditions: • Current gain: • Extrapolated fT: 31 Improving fT • III-V for high gm • Implant isolation to reduce C • Highly doped sub-collector and supra-emitter to reduce Rec • Dual contacts to reduce Rc • Lateral shrinking to reduce C's 32 33 Designing for high fT values Why do collector delays dominate ? How does Si get-in on the act? 2.5 AlP AlAs GaP Bandgap, eV 2 1.5 GaAs Si InP 90 80 1 70 60 50 Ge 40 30 0.5 ° a = 5.6533 A matched to GaAs 0 5.4 5.5 5.6 5.7 20 10 ° a = 5.8688 A matched to InP 5.8 ° Lattice Constant, A 5.9 6 InAs 6.1 34 35 Developing an expression for fmax Assumption and conditions: 36 Improving fmax • Pay even more attention to Rb and C Final HF question: How far behind are Si MOSFETs? 37 HF MOS What is this?