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Transcript
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DESCRIPTION
Original release
DATE
04/01/23
APPROVED
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CONTROLLED DIST. LIST
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ANTARCTIC ASTRONOMY AND ASTROPHYSICS
RESEARCH INSTITUTE
THE UNIVERSITY OF WISCONSIN - MADISON, WISCONSIN
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ORIGINATOR
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ENGINEER
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CHECKER
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LEVEL 2/LEAD
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PRODUCT ASSURANCE
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PROJECT APPROVAL
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ICECUBE
PMT HIGH VOLTAGE CONTROL BOARD
SPECIFICATION CONTROL DRAWING
FILENAME
PROJECT NO.
9400-0027-SCD.yymmdd.doc
DRAWING NO.
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9400-0027-SCD
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Page 1 of 36
PMT High Voltage Control Board
Page 2 of 36
Document # 9400-0027-SCD
Revision: -
Contents
1
INTRODUCTION
1.1
Purpose
1.2
Scope
1.3
Responsibility and Records
1.3.1
Document Responsibility
1.3.2
Document and Verification Records
1.4
Item’s Function in the IceCube System
2
APPLICABLE DOCUMENTS
2.1
2.2
2.3
3
Project Requirements
Reference Documents
Order of Precedence
REQUIREMENTS
3.1
Item Identification
3.1.1
Definition
3.1.2
Functional Description
3.1.3
Functional External Interfaces
3.1.4
Schematic Diagram
3.2
Performance Requirements
3.2.1
Functional Requirements
3.2.2
Electrical Requirements
3.2.3
Mechanical Requirements
3.2.4
External Interface Requirements
3.2.5
Environmental Requirements
3.2.6
Storage Requirements [TBD]
3.3
Design and Construction Requirements
3.3.1
Electrical and Electronic Parts
3.3.2
High Voltage Generator
3.3.3
Coatings, Platings, and Corrosion Prevention [TBD]
3.3.4
Adhesives and Sealants [TBD]
3.3.5
Printed Circuit Board
3.3.6
Component Placement
3.3.7
Restricted Parts, Materials, and Processes
3.3.8
Reliability
3.3.9
Quality
4
VERIFICATION
4.1
Responsibility
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PMT High Voltage Control Board
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Document # 9400-0027-SCD
Revision: -
4.2
4.3
5
PREPARATION FOR DELIVERY
5.1
5.2
5.3
6
Identification—Part Number and Serial Number
Final Visual Inspection
Packaging and Shipping
DEFINITIONS
6.1
6.2
7
Special Tests and Examinations
Requirement vs. Verification Cross Reference with Section 3
IceCube Acronyms
IceCube Glossary
APPENDIX
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36
Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Functional Block Diagram
HV Control Board Envelope
HV Control Board PCB Dimensions
High voltage output cable end preparation requirement
Interface Cable Attachment
8
13
14
22
24
Voltage and Current Specification for Digital Signals
Timing Specification
Digital Interface Signals
Digital Interface Devices
Interface Signal Multiplexing
Device Addressing Scheme
POWER_ON
HV_DISABLE
Ribbon Cable Connector Pin Assignment
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Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
PMT High Voltage Control Board
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Document # 9400-0027-SCD
Revision: -
1 INTRODUCTION
1.1 Purpose
This IceCube Specification Control Drawing (SCD) specifies the performance,
fabrication, verification, and production acceptance requirements for the PMT High
Voltage Control Board used on the IceCube PMT Modular High Voltage Power Supply.
1.2 Scope
This Specification Control Drawing shall be applicable to the design, development,
integration, verification, production, validation, logistics, field deployment and disposal
of the PMT High Voltage Control Board.
1.3 Responsibility and Records
1.3.1 Document Responsibility
The IceCube Project of the Antarctic Astronomy and Astrophysics Research Institute
(AAAIR) at the University of Wisconsin – Madison (UW) is responsible for writing and
updating these requirements to ensure they are correct, complete and current. UW
AAARI Quality Assurance is responsible for ensuring this document and changes to it
are properly reviewed, approved and maintained.
1.3.2 Document and Verification Records
Records of this document and associated verification and qualification records shall be
maintained as follows:
a. The approved and signed original of this document shall be maintained per UW AAARI
9000-0004, Document Management Process.
b. Changes to this document shall be via Engineering Change Notices (ECNs) as described
in UW AAARI 9000-0004, Document Management Process.
c. Verification records shall be maintained as described in Section 4 of this document in
compliance with UW AAARI 9000-0003, IceCube Quality Plan.
PMT High Voltage Control Board
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1.4 Item’s Function in the IceCube System
The IceCube Neutrino Observatory System at the South Pole requires high voltage for
one Photomultiplier Tube (PMT) in each of its Digital Optical Module (DOM) sensors.
The PMT High Voltage Control Board is one of two subassemblies of the PMT
Modular High Voltage (HV) Power Supply. The adjustable-output PMT HV Power
Supply creates and supplies approximately 2000 volts maximum anode bias and
multiple dynode bias voltages to the PMT inside each DOM sensor. The PMT HV
Control Board creates and controls this high voltage in accordance with digital
commands from the DOM Main Board. For instance the PMT HV Control Board may
adjust its output high voltage to obtain different PMT photon sensitivities. The PMT
HV Control Board also measures and reports the value of the output high voltage. The
output high voltage is delivered to the PMT HV Base Board where it is applied to the
anode for signal extraction and proportionately distributed to the PMT electrodes.
There are 5120 Digital Optical Modules in the IceCube system, each containing a PMT
HV Control Board in a PMT Modular HV Power Supply. The IceCube system has
4800 DOMs deployed over a kilometer deep in the Antarctic ice with 320 additional
DOMs installed on the ice surface, all used for scientific research.
PMT High Voltage Control Board
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Revision: -
2 APPLICABLE DOCUMENTS
The following documents of the exact issue shown are applicable requirements for this
Configuration Item only to the extent they are invoked by specific requirements herein.
2.1 Project Requirements
a. PMT Modular HV Power Supply Engineering Requirements Document, 9400-0016ERD
b. PMT HV Generator Source Control Drawing, 9400-0068-SCD (Rev -)
c. PMT HV Base Board Specification Control Drawing, 9400-0028-SCD
d. PMT HV Power Supply Interface Control Document, 9400-0016-ICD
e. PMT HV Control Board Schematic, 9400-0027-SCH (Rev A)
f. PMT HV Control Board Ribbon Cable Assembly Drawing, 9400-0022-DWG (Rev -)
g. PMT HV Control Board Component Envelope Drawing, 5549C104 Rev B, Physical
Sciences Lab, University of Wisconsin–Madison (Needs revision. Refer to information
in the present document.)
2.2 Reference Documents
a. JESD8-B, “Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated
Circuits”, JEDEC Solid State Technology Association, September 1999.
b. IPC-2221, §6.3 Electrical Clearance, “B-4 External Conductors with Permanent
Polymer Coating” [TBR]
c. “Book of iButton Standards”, Dallas Semiconductor Corporation, Application Notes
Number 937, January, 2002.
d. MIL-HDBK-217F (N1/2)—Parts Stress and Analysis method [TBR]
2.3 Order of Precedence
a. Conflicts within this document shall be resolved as directed by the IceCube System
Engineer in collaboration with the Project Lead responsible for this Design Item.
b. Conflicts between other documents as they relate to or impact this document shall be
resolved as directed by the IceCube Project Manager in collaboration with the IceCube
System Engineer.
PMT High Voltage Control Board
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3 REQUIREMENTS
3.1 Item Identification
3.1.1 Definition
The PMT High Voltage Control Board (HV Control Board) is a printed circuit board
(PCB) assembly, containing the High Voltage Generator module, power inputs, control
logic, output voltage control, and digital interface circuitry, and, together with the PMT
HV Base Board, constitutes the PMT Modular High Voltage Power Supply. The HV
Control Board is mechanically mounted as a daughter board to the DOM Flasher Board
and is electrically connected to the PMT HV Base Board via a high-voltage cable and to
the DOM Main Board via a digital interface cable. No electrical connection, including
grounds, is present between the HV Control Board and the DOM Flasher Board.
3.1.2 Functional Description
The HV Control Board derives all the power from the DOM Main Board and generates
a high voltage in the range of approximately 1000 to 2100 VDC and supplies it to the
PMT HV Base Board, where the high voltage potential is divided and distributed to the
individual electrodes of the PMT (Figure 1). The digital interface circuitry supports the
following commands issued by the DOM Main Board:
a. Adjust the HV Generator output voltage
b. Report the measured value of the HV Generator voltage output
c. Report the digital serial number uniquely identifying each individual HV
Control Board
d. Respond to power supply power ON/OFF commands
e. Respond to high voltage output ENABLE/DISABLE commands
f. The digital interface circuitry providing the above functions may be either
internal or external to the HV Generator either in part or as a whole.
All the power for the HV Generator and the digital interface circuitry is provided by the
DOM Main Board.
3.1.3 Functional External Interfaces
The HV Control Board has four external functional interfaces:
a. Power input from the DOM Main Board
b. Bidirectional digital control and data from/to the DOM Main Board
c. High voltage output to the PMT HV Base Board
PMT High Voltage Control Board
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d. Structural mount to the Flasher Board
These interfaces are illustrated in Figure 1.
3.1.4 Schematic Diagram
Refer to the IceCube document # 9400-0027-SCH.
PMT Modular High Voltage Power Supply
HV Control
Board
HV Generator
Digital Interface
Structual Mount
PMT HV Base Board
Power
Digital Control
& Response
Flasher Board
DOM Main Board
Figure 1
High Voltage
Functional Block Diagram
Dynode Voltages
PMT Anode Signal
.....
PMT
Structual
Mount
3.2 Performance Requirements
3.2.1 Functional Requirements
3.2.1.1 High Voltage Generation
The HV Control Board shall generate an adjustable high voltage output for the PMT HV
Base Board, using the power provided by the DOM Main Board.
3.2.1.2 Digital Command Response
The HV Control Board shall respond to the following digital control commands issued
by the DOM Main Board:
a. ON/OFF command for switching the primary power of the entire HV
Control Board
b. ENABLE/DISABLE command for enabling or disabling the high voltage
output
c. Serial DAC code for setting the High Voltage output value
3.2.1.3 Digital Output
The HV Control Board shall provide the following digital output to the DOM Main
Board:
a. Serial ADC code for the High Voltage Monitor Output value
b. Serial digital code uniquely identifying the individual HV Control Board
3.2.2 Electrical Requirements
3.2.2.1 Input Voltage
3.2.2.1.1
+5 Volts DC
The HV Control Board shall receive a power input voltage of +5 VDC ±5%.
3.2.2.1.2
–5 Volts DC
The HV Control Board shall receive a power input voltage of -5 VDC ±5%.
3.2.2.2 Input Current
3.2.2.2.1
+5 Volts Input Current
The HV Control Board input current for +5 Volt power shall not exceed 70 mA [TBR].
3.2.2.2.2
–5 Volts Input Current
The HV Control Board input current for -5 Volt power shall not exceed 30 mA [TBR].
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3.2.2.3 Input Power
The total input power to the PMT HV Control Board shall not exceed 350 mW [TBR].
3.2.2.4 Internal Grounds
3.2.2.4.1
Analog Ground
a. The analog signal ground on the HV Control Board shall be referenced by the
HV Generator and by the appropriate analog ground pin(s) of the DAC, the
ADC, and, if present, the voltage reference device.
b. The shielding case of the HV Generator shall be connected to the analog
ground.
c. The analog ground shall be connected to the DOM Main Board interface
connector pin(s) designated as DGND at a single point.
3.2.2.4.2
Digital Ground
Digital Ground and Power Ground shall be one on the PCB and shall refer to the net
designated as DGND on the DOM Main Board interface connector.
3.2.2.4.3
RF Ground
The HV Control Board shall use the Power Ground as the RF ground.
3.2.2.4.4
Power Ground
Power Ground and Digital Ground shall be one on the PCB and shall refer to the net
designated as DGND on the DOM Main Board interface connector.
3.2.2.5 High Voltage Generation
3.2.2.5.1
Power ON/OFF Transients
The HV output upon power up of the HV Control Board shall be within ±1V [TBR].
3.2.2.5.2
High Voltage Enable/Disable [TBR]
a. The HV output shall reach within ± 5% of the target value in less than 30
seconds after receiving a HV enable command under a resistive load of 130 M
± 5%.
b. The HV output shall reach below 100V in less than 30 seconds after receiving a
HV disable command under a resistive load of 130 M ± 5%.
Note
“Disable” means disabling the high voltage generation circuitry, such as the oscillator, while
the rest of the HV Control Board is powered.
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3.2.2.5.3
HV Adjustment
3.2.2.5.3.1
Voltage Adjustment Range
The HV Control Board high voltage output shall be adjustable over a minimum range of
1000 to 2047 VDC when measured using a resistive load of 130 M ± 5%.
3.2.2.5.3.2
Minimum Adjustable Voltage
The low-end of the adjustable high voltage range of the HV Control Board shall be
greater than –5 VDC when measured using a resistive load of 130 M ± 5%.
3.2.2.5.3.3
Maximum Adjustable Voltage
The high-end of the adjustable high voltage range of the HV Control Board shall be less
than 2100 VDC when measured using a resistive load of 130 M ± 5%.
3.2.2.5.3.4
Voltage Adjustment Resolution
The HV Control Board shall use a 12-bit resolution DAC for digitally setting the value
of the high voltage output.
3.2.2.5.3.5
Voltage Adjustment Linearity
The HV Control Board high voltage output and the corresponding digital command
code shall have a linear relationship over the specified adjustment voltage range with a
slope of 0.5 Volts ± [TBD] Volts per bit when measured using a resistive load of 130
M ± 5%.
3.2.2.5.4
High Voltage Quality
3.2.2.5.4.1
Voltage Stability (Absolute bound around set point)
a. The high voltage output of the HV Control Board shall not deviate from the set
point by more than 0.2% over any eight-hour period, once the output value has
reached within this range of the set point, under a stable operating temperature.
b. The high voltage output of the HV Control Board shall not change from the set
point at a rate any faster than 0.2% per hour.
3.2.2.5.4.2
Voltage Ripple (Noise)
The HV Control Board high voltage output ripple voltage, originating from the HV
Generator, shall be less than 5 mVpp when measured with a resistive load of 130 M ±
5%.
Note
Laboratory measurements show that far greater ripple amplitudes are acceptable in order to
meet the requirement for the PMT Modular HV Power Supply, which specifies the ripples
to be less than 0.5mVpp when measured at the end of the resistively-terminated pulseoutput cable.
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3.2.2.6 High Voltage Monitoring
3.2.2.6.1
Voltage Monitoring Output
The HV Control Board shall allow monitoring of the high voltage output using an ADC
and transmit its value to the DOM Main Board as a digital code upon command.
3.2.2.6.2
Voltage Monitoring ADC Resolution
The HV Control Board shall use a 12-bit resolution ADC for monitoring the value of the
high voltage output.
3.2.2.6.3
Voltage Monitoring Linearity
The HV Control Board high voltage output being monitored and the corresponding
digital value shall have a linear relationship in the specified adjustment voltage range
with a slope of 0.5 V ± [TBD] Volts per bit when measured using a resistive load of 130
M ± 5%.
3.2.2.6.4
Voltage Monitoring Accuracy
The HV Control Board high voltage output value that is digitally reported shall be
within ±2% [TBR] of the true value.
Note
The value is based on a prototype evaluation.
3.2.2.7 Current Sourcing Capability
3.2.2.7.1
Current Sourcing at Minimum Operating Temperature
The HV Control Board shall provide a DC current sourcing capability of a minimum of
12 nA at the minimum operating temperature specified herein, as determined by the
output voltage changing less than 10V when the current is varied from zero to the
specified minimum current.
3.2.2.7.2
Current Sourcing at Maximum Operating Temperature
The HV Control Board shall provide a DC current sourcing capability of a minimum of
240 nA at the maximum operating temperature specified herein, as determined by the
output voltage changing less than 10V when the current is varied from zero to the
specified minimum current.
3.2.2.7.3
Pulsed Current Sourcing [TBR]
The HV Control Board shall provide a current sourcing capability of a minimum of 60
mA for an isolated single 1 sec square-pulse, at the minimum operating temperature
specified herein, as determined by the output voltage changing less than 10V when the
current is changed from zero to the specified pulse current during the pulse time. [TBR]
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3.2.3 Mechanical Requirements
3.2.3.1 Overall Size and Volume Constraints
a. The maximum height of the components on the bottom side of the HV Control
Board shall be no greater than 16 mm.
b. The maximum height of the components on the top side of the HV Control
Board shall be 22 mm minus the printed circuit board thickness (1.6mm
typical).
c. All the components on the HV Control Board shall be wholly contained within
the component envelope, defined in Figure 2, except for:

Interface ribbon cable

HV output cable

Stand-offs for mounting the HV Control Board to the next higher
assembly.
d. The lateral extent of the HV Control Board, defined by the “Component Side
View” in Figure 2, shall be as specified in the next section.
Units: mm
(Component Side View)
40°
4.3
22
1.6
REF
16
Figure 2
HV Control Board Envelope
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3.2.3.2 PCB Dimensions
The overall shape of the printed circuit board of the PMT HV Control Board shall be as
shown in Figure 3, where the dimensions are for the maximum extent of the board
outline, corresponding to the “Component Side View” in Figure 2.
a. The maximum board outline dimensions shall be observed to within ±0.5 mm.
b. The relative locations of the three mounting holes shall be observed to within
±0.5 mm. [TBR]
c. The ribbon connector mounting location, relative to the mounting holes, shall
be observed to within ±1 mm.
APPROX. AREA
FOR HV OUTPUT
CABLE ATTACH
95.81
87.70
85.56
59.35
50.09
45.70
42.96
39.24
18.21
25.22
PIN #1
LOCATION
R56.08
R10
5
7.5 REF
RIBBON
CONNECTOR ON
TOP SIDE
3 X 3 BOARD
MOUNTING HOLES
99 REF
UNITS: MM
COMPONENT SIDE VIEW
Figure 3
HV Control Board PCB Dimensions
3.2.3.3 Weight
The fully assembled HV Control Board shall weigh no greater than 100 grams [TBR].
Note
The actual unit in use (PY3) weighs approximately 85 grams.
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3.2.4 External Interface Requirements
3.2.4.1 Electric Power
The HV Control Board shall receive all of its electric power from the DOM Main Board
through the conductors in the DOM Main Board-to-HV Control Board interface cable.
3.2.4.2 Grounding
3.2.4.2.1
Digital Signal Grounding
External Digital Signal Grounding shall be via multiple common/shared return
conductors in the ribbon cable between the HV Control Board and the DOM Main
Board.
3.2.4.2.2
RF Signal Grounding
External RFI and EMIC Grounding shall be via multiple common/shared return
conductors in the ribbon cable between the HV Control Board and the DOM Main
Board.
3.2.4.2.3
Power Grounding
Power Grounding shall be via multiple common/shared return conductors in the ribbon
cable between the HV Control Board and the DOM Main Board.
3.2.4.2.4
High Energy Grounding
External High Energy Grounding shall be via multiple common/shared return
conductors in the ribbon cable between the HV Control Board and the DOM Main
Board.
3.2.4.2.5
Safety Grounding
External Safety Grounding shall be via multiple common/shared return conductors in
the ribbon cable between the HV Control Board and the DOM Main Board.
3.2.4.3 Analog Signals
The HV Control Board shall have a single analog high-voltage output, defined in
Section 3.2.1.
3.2.4.4 Special Discrete Signal
The HV Control Board’s serial number shall be read out by the DOM Main Board using
the Dallas 1-Wire protocol from the on-board device, referred to as the IDENT device.
The IDENT device signal specification is distinct from that of the digital signals;
however, it shall share the digital line MISO with the ADC, as shown in Table 5. See
Section 3.2.4.5.7.2 for the IDENT signal specification.
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3.2.4.5 Digital Signals
3.2.4.5.1
3.2.4.5.1.1
Voltage, Current, and Timing
Applicable Standard(s)
The logic levels and corresponding voltages between the HV Control Board and the
DOM Main Board communications shall comply with the specifications in JESD8-B,
“Interface Standard for Nominal 3 V/3.3 V Supply Digital Integrated Circuits”, JEDEC
Solid State Technology Association, September 1999.
3.2.4.5.1.2
Voltage and Current Specification [TBR]
The voltage and current specifications for the digital communication between the HV
Control Board and the DOM Main Board shall be as shown in Table 1.
Table 1
Voltage and Current Specification for Digital Signals
Parameter
Min.
Max.
Units
Logic “High”
2
3.3
V
Logic “Low”
-0.3
0.8
V
Logic “High”
2.4
3.6
V
Logic “Low”
0
0.4
V
Current out of HV Control Board
-
10
A
Current into HV Control Board
-
2
mA
Voltage output from HV Control
Board
Voltage input to HV Control Board
Note 1
Note 2
Note 3
3.2.4.5.1.3
The device on the DOM Main Board with which the HV Control Board
communicates is a Xilinx CoolRunner II operating with a 3.3V I/O voltage. The
device is capable of driving a 3.3V LVTTL input as well (i.e., it can source more
than 2 mA into an LVTTL input.)
The table summarizes the specifications of JESD8-B, assuming the I/O supply for the
CoolRunner II varies over 3.0V to 3.6V and the HV Control Board input sinks a
maximum of 2 mA.
The voltage and current specifications do not apply to the IDENT signal. For the
IDENT signal, the requirements specific to the Dallas 1-Wire protocol shall apply.
Timing Specification [TBR]
The digital interface devices on the HV Control Board shall meet the timing
specification in Table 2 in sending and receiving digital signals.
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Table 2
Note 1
Note 2
Note 3
3.2.4.5.2
Timing Specification
Clock frequency
0.1 - 1 MHz
Clock duty ratio
20 – 80 %
Rise Time for all logic and clock
0.3 - 9.0 ns
Fall Time for all logic and clock
0.8 – 10.5 ns
The timing specification here does not apply to the IDENT signal. The IDENT
device operation relies on its unique timing requirements.
The rise time / fall time values are from “Cool Runner-II I/O Characteristics”, Xilinx
Document No. XAPP382 (v 1.0), November 11, 2002. The value ranges correspond
to the load capacitance range of 0 to 100 pF.
JESD8-B does not specify timing. A possibly applicable standard for the timing is
JEDEC Document No. 13-B, “Standard Specification for Description of ‘B’ Series
CMOS Devices”, May 1980; however, the Xilinx datasheet (Note 2) is probably
more up-to-date and suites better for the present purpose.
Digital Interface Signals
The HV Control Board shall communicate with the DOM Main Board using the digital
interface signals identified in Table 3. (“IN” = Input to the HV Control Board.)
Table 3
3.2.4.5.3
3.2.4.5.3.1
Digital Interface Signals
Signal Name
Direction
Description
POWER_ON
IN
Board power ON (active high)
HV_DISABLE
IN
HV output disable (active high)
CS0
IN
Chip-select bit 0
CS1
IN
Chip-select bit 1
SCLK
IN
Serial clock
MISO
OUT
Master-In-Slave-Out serial data
MOSI
IN
Master-Out-Slave-In serial data
Digital Interface Devices
On-Board Interface Devices
The serial digital interface devices listed in Table 4 shall be present on the HV Control
Board.
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Table 4
Device
Digital Interface Devices
Function
Part number
IDENT
Provide board serial
number
Dallas Semiconductor (Maxim)
DS2401 or equivalent
DAC
Digital-to-analog
conversion for HV
output adjustment
Linear Technology LTC1257IS8 or
equivalent
ADC
Analog-to-digital
conversion for HV
output monitor
Linear Technology LTC1286IS8 or
equivalent
3.2.4.5.3.2
Signal Multiplexing
The interface devices shall share the MISO, MOSI, and SCLK signals, as shown in
Table 5.
Note
The operation of the IDENT device requires the signal on the MISO line to have a rate of
logic transitions in the range specified in the Dallas 1-Wire signaling protocol. The device
for multiplexing MISO for IDENT and ADC data must, therefore, support both the
normal (fast) CMOS transitions and the slow 1-Wire signaling transitions. The use of
an analog switch, rather than a logic multiplexer, will accomplish such a requirement.
Table 5
Interface Signal Multiplexing
Device
MISO
IDENT
data
DAC
ADC
3.2.4.5.4
data
MOSI
SCLK
data
clock
clock
Device Addressing Scheme
The two “chip-select” signals, CS0 and CS1, are used to select a digital function, as
shown in Table 6.
Table 6
Device Addressing Scheme
CS0
CS1
Explanation
1
1
Read from IDENT or write a word to DAC (default )
0
1
Update DAC output on falling edge of CS0
1
0
Operate ADC while CS1 remains low.
0
0
(not allowed)
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3.2.4.5.5
POWER_ON
The HV Control Board’s power shall be controlled by the logic state of
POWER_ON as shown in Table 7.
Table 7
3.2.4.5.6
POWER_ON
Logic Level
Function
0
Board power off
1
Board power on
HV_DISABLE
a. The HV Control Board’s HV output shall be disabled or enabled, according to
the logic state of HV_DISABLE, as shown in Table 8.
b. The HV_DISABLE shall be remain in logic “0” while POWER_ON is “0” or
within 0.5 sec. after POWER_ON becomes “1”.
c. The logic level of HV_DISABLE shall not change more than once per second.
Note
The requirements (a) and (b) are due to the specification of the HV Generator.
Table 8
HV_DISABLE
Logic Level
3.2.4.5.7
3.2.4.5.7.1
Function
0
Enable HV output
1
Disable HV output
Board Serial Number—IDENT
Required Pull-Up Resistor
The HV Control board shall provide a 5k pull-up resistor (closest value in 5% or
better) to +3.3VDC (relative to DGND) for the IDENT device serial signal line.
3.2.4.5.7.2
Device Operation
The IDENT device shall communicate with the DOM Main Board, serving as the bus
master, according to the Dallas 1-Wire signaling protocol (See “Book of iButton
Standards”, Dallas Semiconductor Corporation, Application Notes Number 937,
January, 2002.).
3.2.4.5.8
3.2.4.5.8.1
HV Output Adjustment—DAC
Number Format
The DAC shall use a 12-bit unsigned straight binary encoding with the digital value 000
(hex) representing the DAC output of 0 VDC.
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3.2.4.5.8.2
DAC Device Operation
a. The analog output of the DAC shall be updated by the DOM Main Board in the
following sequence:
(1) While CS0 = “1” and CS1 = “1”, the 12 data bits are written to the DAC on
the rising clock edge starting from MSB, using MOSI and SCLK lines.
(2) CS0 is pulled low momentarily. (The DAC output is updated on the falling
edge of CS0.)
b. The HV Control Board shall support the following maximum operating speed
parameters of the DAC:
(1) Maximum serial clock frequency = 1.4 MHz
(2) Minimum clock high time = 350 nsec.
(3) Minimum set-up time after the data bit is set to the next rising clock edge =
250 nsec.
(4) Minimum hold time of the data bit after the rising clock edge = 25 nsec.
(5) Minimum wait before CS0 goes low after the last data bit is set = 250 nsec.
(6) Minimum duration in which CS0 remains low = 150 nsec.
Note
Source: Linear Technology LTC1257 datasheet.
3.2.4.5.9
HV Output Monitor—ADC
3.2.4.5.9.1
Number Format
The digital output code transmitted by the HV Control Board ADC shall be in 12-bit
unsigned straight binary with the digital value 000 (hex) representing 0 VDC.
3.2.4.5.9.2
ADC Device Operation
a. The operating sequence and timing of the ADC shall be according to 94000016-ICD.
b. The analog input to the ADC is read out as a 12-bit digital word by the DOM
Main Board in the following sequence:
(1) CS1 is pulled low.
(2) The SCLK line is made to go from low to high three times.
(3) The 12 data bits are read out on the rising edge of the clock, starting from
MSB, using SCLK and MISO.
(4) CS1 is set high.
c. The HV Control Board shall support the following maximum operating speed
parameters of the ADC:
(1) Maximum serial clock frequency = 200 kHz
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(2) Minimum clock high time = 2 sec.
(3) Minimum set-up time for the first rising clock edge after CS1 going low = 2
sec.
(4) Minimum wait after the falling clock edge to the data bit read-out = 250
nsec.
Note
Source: Linear Technology LTC1286 datasheet
3.2.4.6 Interconnections
3.2.4.6.1
High Voltage Output Cable
3.2.4.6.1.1
Cable Type
The high voltage output cable or wires shall consist of two parallel, twisted, or coaxial
conductors, one having the high voltage potential with respect to the HV Control Board
Power Ground, and the other being the high voltage return that is referenced to the same
ground.
Note
The current design (PY3) employs a custom coaxial medium, specified in detail in the
IceCube document #9400-0068-SCD (HV Generator source control drawing).
3.2.4.6.1.2
Voltage Rating
The high voltage cable or wires shall be rated at 5000 VDC minimum breakdown over
all the operational environments and operational life specified herein.
3.2.4.6.1.3
Minimum Bending Radius
The high voltage cable or wire shall have a minimum bending radius of less than 25 mm
over all the operational environments and operational life specified herein.
Note
The custom coaxial cable in use as of PY3 has a minimum bending radius of 24 mm.
3.2.4.6.1.4
Cable Termination
The high voltage cable or wires shall be electrically and mechanically terminated inside
the High Voltage Generator module.
3.2.4.6.1.5
Mechanical Integrity
The high voltage cable or wires shall not degrade when the cable or wires are pulled
with a maximum of 5 kg of force in any direction from the surface of the HV Control
Board.
3.2.4.6.1.6
Cable Length
The high voltage output cable or wires shall be 250 ± 15 mm long measured from the
top surface of the HV Control Board PCB to the end of the insulation.
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3.2.4.6.1.7
Cable Exit Location
The high voltage output cable or wires shall exit at the approximate location specified in
Figure 3.
3.2.4.6.1.8
Cable End Preparation
The end of the high voltage cable shall be stripped and tinned as shown in Figure 4.
Note
The figure applies only to the custom coaxial cable in use as of PY3.
0.375 ± 0.125
0.55 ± 0.05
0.05 min
0.20 max
Jacket
0.90 ± 0.20
Insulation
Shield
Center
conductor
Center conductor tinned
portion = 0.20 max. from end.
Units: Inches
0.20 max
Solder tinned portion
0.050 max
Figure 4
3.2.4.6.2
3.2.4.6.2.1
High voltage output cable end preparation requirement
Digital Interface Cable
Cable Specification
The digital interface cable shall be according to the specification in IceCube document
#9400-0022-DWG (Rev -):
a. The digital interface cable shall be a 24-conductor, 1-mm-pitch flat IDC ribbon
cable with 28 AWG (7/36) wires [7 strands of 0.127-mm-diameter wire].
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b. The HV Control Board side of the cable shall have a solderable male connector,
and the DOM Main Board side shall have a female connector.
c. Correct length of the cable, connector part numbers, and connector orientations
shall be observed according to the specification.
3.2.4.6.2.2
Attachment to the HV Control Board
The male-connector-side of the interface cable shall be soldered directly to the HV
Control Board at the location specified in Figure 3 and in the orientation shown in
Figure 5.
3.2.4.6.3
Signal Assignment
The signal assignment to the interface cable conductors is as shown in Table 9.
Note
The following requirements are being observed:
 The interface cable carries digital signals, ground connections, and power connections.
 Each signal, including power and ground, has at least two conductors allocated for
redundancy.
3.2.4.7 Mounting Points
3.2.4.7.1
Mounting Provisions for Next Higher Assembly
The HV Control Board shall provide holes and clearances for mounting it to the DOM
Flasher Board using stainless-steel hexagonal stand-offs. The clearance zones shall be
concentric with the mounting holes and have a minimum diameter of 9.5 mm. There
shall be no copper foil within this diameter.
3.2.4.7.2
Mounting Locations
The HV Control Board mounting locations for installation into the next higher assembly
shall be as shown in Figure 3.
3.2.4.8 Test Points
Voltage measurement test points shall be provided on the component side of the HV
Control Board for measuring all inputs and outputs of the High Voltage Generator
(except for the high voltage output, which is to be measured at the end of the output
cable).
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1
2
3
4
5
6
7
8
PIN #1
9 10
11 12
13 14
PIN #1
15 16
17 18
19 20
21 22
23 24
ORIENTATION KEY
PIN LAYOUT
VIEWED FROM TOP
COMPONENT (TOP) SIDE
ORIENTATION KEY
Figure 5
Interface Cable Attachment
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Table 9
Ribbon Cable Connector Pin Assignment
Pin #
Signal Name
Description
1
DGND
Digital and power ground
2
SCLK
Serial clock
3
SCLK
Serial clock
4
MOSI
Master-out-slave-in
5
MOSI
Master-out-slave-in
6
MISO
Master-in-slave-out
7
MISO
Master-in-slave-out
8
DGND
Digital and power ground
9
CS0
Chip-select bit 0
10
CS0
Chip-select bit 0
11
CS1
Chip-select bit1
12
CS1
Chip-select bit1
13
POWER_ON
Board enable/disable
14
POWER_ON
Board enable/disable
15
+5V
Main power (+)
16
+5V
Main power (+)
17
DGND
Digital and power ground
18
DGND
Digital and power ground
19
-5V
Main power (-)
20
-5V
Main power (-)
21
DGND
Digital and power ground
22
DGND
Digital and power ground
23
HV_DISABLE
HV disable
24
HV_DISABLE
HV disable
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3.2.5 Environmental Requirements
3.2.5.1 Temperature
3.2.5.1.1
Operating Temperature
The HV Control Board shall meet all performance requirements when operating over an
ambient temperature range of –40 °C to +27 °C.
3.2.5.1.2
Non-Operating Temperature
(Shall be consistent with the DOM-level requirements.)
3.2.5.1.3
Storage/Transport Temperature
The HV Control Board shall withstand a storage and transport temperature range of –55
°C to +45 °C for a period of [TBD] months without any degradation in performance.
3.2.5.2 Thermal Shock
(Shall be consistent with the DOM-level requirements.)
3.2.5.3 Pressure
3.2.5.3.1
Operating Pressure
The HV Control Board shall meet all performance requirements while operating at 1
atmosphere in air or while operating inside a pressure vessel with a sustained internal
Nitrogen gas atmospheric pressure of 40,000 Pa to 100,000 Pa.
3.2.5.3.2
Non-Operating and Storage/Transport Pressure
(Shall be consistent with the DOM-level requirements.)
3.2.5.4 Mechanical Shock and Vibration
(Shall be consistent with the DOM-level requirements.)
3.2.5.5 Electromagnetic Interference/Compatibility
(Shall be consistent with the DOM-level requirements.)
3.2.5.6 Humidity
(Shall be consistent with the DOM-level requirements.)
3.2.5.7 Radioactivity
(Shall be consistent with the DOM-level requirements.)
3.2.6 Storage Requirements [TBD]
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3.3 Design and Construction Requirements
3.3.1 Electrical and Electronic Parts
a. To the extent practical, all electrical and electronic components used for the HV
Control Board shall meet the lowest operating temperature of –55C, as specified by
the component manufacturer, where “practical” means that such components are
readily available for the operating temperature of –55C or lower.
b. The vendor of the PMT High Voltage Control Board shall supply IceCube with a
list of electrical and electronic components used that do not meet the –55C or lower
operating temperature.
3.3.2 High Voltage Generator
The High Voltage Generator, specified in IceCube document # 9400-0068-SCD, shall
be a self-contained, metal-shielded, potted module requiring only input power and
control signals to deliver high voltage via a pigtail output cable. It shall be designed
with wire leads for direct solder to the HV Control Board with its insulated high voltage
output lead(s) long enough to reach the HV Base Board when mounted in a DOM.
3.3.3 Coatings, Platings, and Corrosion Prevention [TBD]
3.3.4 Adhesives and Sealants [TBD]
3.3.5 Printed Circuit Board
3.3.5.1 Printed Circuit Board Material
The PMT HV Control Board PCB dielectric board material shall be FR-4 with a
nominal thickness of 1.6mm (1/16 inches).
3.3.5.2 Copper Foil Thickness
The PMT HV Control Board PCB shall use the copper foil thickness of 1 oz / ft2 [TBR]
for electrical traces and solder pads.
3.3.5.3 Solder Mask
A solder mask shall be applied to both the top and bottom sides of the Printed Circuit
Board (PCB) with masked clearance including, but not limited to, the following items:
a.
b.
c.
d.
All solder pads
Through holes for component pins and leads
Test points
Designated clear solder pad areas for jumpers, grounding wire, etc.
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3.3.5.4 Silk Screen Marking
Silk screen markings shall include, but not be limited to, the following items:
a.
b.
c.
d.
e.
f.
g.
Supplier identifier
IceCube Project identifier (“IceCube”)
Part number and revision number (“HV Control Board”)
Component reference designators
Connector reference designators with pin #1 marked clearly
Test points
HV Generator pins
3.3.6 Component Placement
There are no restrictions in component placement as long as the component envelope
(Figure 2) is observed, except for the following items. (The component side (top side)
is defined to be the side facing away from the next higher assembly to which the HV
Control Board is mounted.)
a. Digital interface cable shall be mounted from the component side at the
designated location and in orientation (3.2.4.6.2.2)
b. High voltage output cable shall exit from the component side at the designated
location (3.2.4.6.1.7)
c. Mounting holes locations and clearance areas shall be observed (3.2.4.7)
d. Test points shall be accessible from the component side (3.2.4.8)
3.3.7 Restricted Parts, Materials, and Processes
(Shall be consistent with the DOM-level requirements.)
3.3.8 Reliability
The HV Control Board shall have a Mean Time To Critical Failure (MTTCF) of greater
then [TBD] hours as predicted in accordance with the Parts Stress Analysis method of
MIL-HDBK-217F (N1/2) [TBR].
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3.3.9
Quality
3.3.9.1 Acceptance Inspection and Tests
The supplier shall perform and record in-process and Final Acceptance Inspection and
Tests on each HV Control Board using pass/fail criteria to a level adequate to
demonstrate that the item was fabricated with the correct materials and processes and
the item properly functions at limit and nominal electrical inputs at standard temperature
and pressure.
3.3.9.2 Environmental Stress Screening
All units shall pass the ESS test.
a. Units exhibiting statistical anomalies in functional tests after the ESS, but otherwise
within specifications, shall fail this test.
b. Manufacturer shall document the ESS test plan.
c. Test data and pertinent record shall be captured on-line (no manual entry) and shall
be available for a minimum of 15 years henceforth.
3.3.9.3 Functional Tests
All units shall undergo and pass a functional test suite, defined by IceCube, before and
after the ESS.
3.3.9.4 Workmanship
a. The components shall be free from physical or electrical defects upon receipt at the
purchaser’s facility.
b. Labeling on the units shall be undamaged and legible upon receipt.
3.3.9.5 Certificate of Conformance
All shipments of the HV Control Boards shall be accompanied by a Certificate of
Conformance (C of C), indicating that all units meet the specifications as defined in this
document.
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4 VERIFICATION
4.1 Responsibility
4.2 Special Tests and Examinations
4.3 Requirement vs. Verification Cross Reference with Section 3
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5 PREPARATION FOR DELIVERY
5.1 Identification—Part Number and Serial Number
The HV Control Board shall be indelibly and legibly marked with part number and
serial number, traceable to revision and manufacture date code. Such traceability
information shall be made available to IceCube.
5.2 Final Visual Inspection
All units shall undergo and pass a final visual inspection prior to shipping.
5.3 Packaging and Shipping
The HV Control Board shall be packaged in ESD-protective packaging and shipped by
common carrier. The mode of shipping shall not introduce additional risk of
unanticipated accidental damage to the unit.
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6 DEFINITIONS
6.1 IceCube Acronyms
AAARI
ADC
ATWD
AWG
cm
Antarctic Astronomy and Astrophysics Research Institute
Analog-to-Digital Converter
Analog Transient Waveform Digitizer
American Wire Gauge
Centimeter
CMOS
Complementary Metal Oxide Semiconductor
C of C
Certificate of Conformance
CS0
Chip-select bit 1
CS1
Chip-select bit 0
DAC
Digital-to-Analog Converter
DAQ
Data Acquisition System
DC
Direct Current
DFL
Dark Freezer Laboratory
DGND
Digital Ground
DOM
Digital Optical Module
DOMMB
Digital Optical Module Main Board
ECN
Engineering Change Notice
EM
Electromagnetic
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
ERD
Engineering Requirements Document
ESD
Electrostatic Discharge
ESS
Environmental Stress Screening
FAT
Final Acceptance Test
HV
High Voltage
Hz
Hertz
ICD
Interface Control Document
ID
Inside Diameter
IDC
Insulation Displacement Connector
IPC
Institute for Interconnecting and Packaging Electronic Circuits
K
Kilo (103)
Kg
Kilogram
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LED
Light-Emitting Diode
LSB
Least Significant Bit
m
Meter / Milli (10-3)
M
Mega (106)
mA
Milliampere
MKS
mm
Meter-kilogram-second
Millimeter
MISO
Master-In-Slave-Out
MOSI
Master-Out-Slave-In
MSB
Most Significant Bit
MTTCF
MTTF
Mean-Time-To-Critical-Failure
Mean-Time-To-Failure
mV
Millivolt
mW
Milliwatt
n
Nano (10-9)
OD
Outside Diameter
OM
Optical Module
p
Pico (10-12)
Pa
Pascal
PCB
Printed Circuit Board
PE
Photoelectron
pF
Pico Farad
PMT
Photomultiplier Tube
P/N
Part Number
PSL
Physical Sciences Laboratory, University of Wisconsin-Madison
P/V ratio
Peak-to-valley ratio
PY
Project Year
RF
Radio Frequency
RFI
Radio Frequency Interference
s, sec
Second
SCD
Source Control Document / Specification Control Document
SCLK
SI
Serial Clock
Système International d’Unités
SMB
Sub-Miniature B
SPE
Single Photoelectron
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STF
Simple Test Framework
TBD
To Be Determined
TBR
To Be Reviewed
UL
Underwriters Laboratory
UW
University of Wisconsin
V
VDC
W
Volt
Volt DC
Watt
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6.2 IceCube Glossary
Anode
A PMT dynode, the last in the multiplier chain and typically larger than the
preceding dynodes, that collects the final charge pulse.
Cathode
The active surface of the photomultiplier from which photoelectrons are
initially liberated.
Zero
The temperature, in degrees Celsius, at which water changes state from a
liquid into a solid.
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7 APPENDIX
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