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Hyung Woo LEE #218 L-Star Ju 19-24 Minamisawa 5-Chome Higashikurume-Si, Tokyo 203-0023 Japan Email) [email protected] Phone) +81-80-1316-5693 SUMMARY The past 28 years, had gained extensive experience with Coby Japan for General Management to develop Japan Electronic Market, and gained it with Samsung Japan for Marketing and Sales Management for Semiconductor Memory products, and gained it with Tessera Technology San Jose CA USA for Chip Size Package Intellectual Property Licensing Business, and also gained it with Amkor Electronics Japan and Korea for Semiconductor Subcontracting business with highly motivated & creative managerial performance, profit Realization and strong skills in interpersonal relationships. COMPANY AFFILIATION Coby Japan in Tokyo 2011 – 2012 (Established Branch Company in Japan starting Jan.01, 2011 Sales & Marketing for DTV, DVD & MID Tablet PC distribution BIZ in Japan.) - President of Coby Japan for General Management and Coby products sales to Japanese major distributers. SAMSUNG Electronics Japan in Tokyo 2002 – 2010 (A legal entity of Samsung Electronics Memory Semiconductor DIV in Japan. Sales & Marketing in Global Account like Sony, IBM & HPQ with local Market.) - Senior Manager for Memory products sales like DRAM, Flash and SSD. Hyung Woo TESSERA Asia Pacific in Tokyo Japan LEE 2000 – 2002 (Tessera Asia Regional Sales for Intellectual Property Business Development and Marketing of Chip Size Packaging Technology Licensing to operate Japan, Korea, Taiwan, China, Singapore and South East Asia.) - Asia Pacific Country Manager in Tessera Sales & Marketing Operation. AMKOR Technologies JAPAN in Tokyo 1995 – 1999 (A legal entity of Amkor Sales office in Tokyo for Semiconductor Package Sales and Marketing in Japan Sales Region.) - Technical Program Manager for Technical Sales and Marketing AMKOR Korea in Seoul 1987 - 1994 (Semiconductor Packaging and Assembly Subcontractor in Korea All kinds of Packaging based on Lead Frame like TSOP, QFP and BT Substrate/PI TAB tape like BGA, CSP, FBGA and several MCP.) - Packaging Development Engineer and Product Design Manager in R&D MAJOR EXPERIENCE AND ACHIEVEMENTS SALES ACCOUNT MANAGEMENT AS COUNTRY MANAGER - To drive sales revenue with finding and developing new customers. To coordinate the sales process and build key relationships. To manage customer programs and assure customer satisfaction. To process new opportunities review and active program review. To manage 3 months rolling forecast for sales revenue. Accounting Ownership in all meetings, correspondence, etc. Hyung Woo LEE MARKETING - To develop and execute product/business strategies in communication with key related customers and suppliers. - To grow and meet the new needs/demands of customers and market. - To survey new application and new technologies in the market. - To analyze customer requirements and coordinate communications with customers for technical items and business issues. TECHNICAL PROGRAM SALES MANAGEMENT - Technical sales interface between customers and factories' internal organization responsible for the design, development, manufacturing and quality of products. - To provide technical support to the sales organization. - Developing and maintaining relationships with technical personnel of Key customers. - Facilitating customer qualifications of Factories. - Managing the implementation of accepted customer specific technical programs or requirements. - Coordinating the resolution of customer specific manufacturing process, material, quality or reliability issues. - Collecting and communicating customers for long range of technology and product roadmaps. - Providing new product development roadmap to customers in order to remind them of future package capability. - Coordinating customer audits/visits with the factories, product groups and quality control groups. - To respond customers complicated engineering issues in order to facilitate the quick solution to the problem. Hyung Woo LEE MAIN TRAININGS Hunker Laboratories - Cincinnati Ohio, USA for mold process controller (1988) Fujiwa Seiki - Nagoya, Japan for Molding Presses (1989) MARKEM - Keene New Hampshire, USA for Auto Pad Marking system (1991) ASA - Singapore for Auto Molding System (1991) K&S - Philadelphia, USA for Auto wire bonding systems (1992) Tessera – San Jose CA. for Negotiation Skills (2000) EDUCATION - B.A. in Mechanical Engineering INHA University Korea Feb. 1986 LANGUAGE ABILITY Native Second Third Language Language Language : Korean : English (BIZ Level for Negotiation) : Japanese (Native Level as VIP club main speaker) PERSONAL Family Health Interests : : : Date of birth : Married, Two sons Excellent Swimming and Music (Playing Guitar and Singing) Nov. 23rd, 1962 PERSONAL REFERENCES - Available on request.