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Hyung Woo LEE
#218 L-Star Ju 19-24 Minamisawa 5-Chome
Higashikurume-Si, Tokyo 203-0023 Japan
Email) [email protected]
Phone) +81-80-1316-5693
SUMMARY
The past 28 years, had gained extensive experience with Coby Japan for General
Management to develop Japan Electronic Market, and gained it with Samsung Japan
for Marketing and Sales Management for Semiconductor Memory products, and gained
it with Tessera Technology San Jose CA USA for Chip Size Package Intellectual
Property Licensing Business, and also gained it with Amkor Electronics Japan
and Korea for Semiconductor Subcontracting business with highly motivated &
creative managerial performance, profit Realization and strong skills in
interpersonal relationships.
COMPANY AFFILIATION
Coby Japan in Tokyo
2011 – 2012
(Established Branch Company in Japan starting Jan.01, 2011
Sales & Marketing for DTV, DVD & MID Tablet PC distribution BIZ in Japan.)
- President of Coby Japan for General Management and Coby products sales
to Japanese major distributers.
SAMSUNG Electronics Japan in Tokyo
2002 – 2010
(A legal entity of Samsung Electronics Memory Semiconductor DIV in Japan.
Sales & Marketing in Global Account like Sony, IBM & HPQ with local Market.)
- Senior Manager for Memory products sales like DRAM, Flash and SSD.
Hyung Woo
TESSERA Asia Pacific in Tokyo Japan
LEE
2000 – 2002
(Tessera Asia Regional Sales for Intellectual Property Business Development and
Marketing of Chip Size Packaging Technology Licensing to operate Japan, Korea,
Taiwan, China, Singapore and South East Asia.)
- Asia Pacific Country Manager in Tessera Sales & Marketing Operation.
AMKOR Technologies JAPAN in Tokyo
1995 – 1999
(A legal entity of Amkor Sales office in Tokyo for Semiconductor Package
Sales and Marketing in Japan Sales Region.)
- Technical Program Manager for Technical Sales and Marketing
AMKOR Korea in Seoul
1987 - 1994
(Semiconductor Packaging and Assembly Subcontractor in Korea
All kinds of Packaging based on Lead Frame like TSOP, QFP and
BT Substrate/PI TAB tape like BGA, CSP, FBGA and several MCP.)
- Packaging Development Engineer and Product Design Manager in R&D
MAJOR EXPERIENCE AND ACHIEVEMENTS
SALES ACCOUNT MANAGEMENT AS COUNTRY MANAGER
-
To drive sales revenue with finding and developing new customers.
To coordinate the sales process and build key relationships.
To manage customer programs and assure customer satisfaction.
To process new opportunities review and active program review.
To manage 3 months rolling forecast for sales revenue.
Accounting Ownership in all meetings, correspondence, etc.
Hyung Woo
LEE
MARKETING
- To develop and execute product/business strategies in communication
with key related customers and suppliers.
- To grow and meet the new needs/demands of customers and market.
- To survey new application and new technologies in the market.
- To analyze customer requirements and coordinate communications with
customers for technical items and business issues.
TECHNICAL PROGRAM SALES MANAGEMENT
- Technical sales interface between customers and factories' internal
organization responsible for the design, development, manufacturing
and quality of products.
- To provide technical support to the sales organization.
- Developing and maintaining relationships with technical personnel
of Key customers.
- Facilitating customer qualifications of Factories.
- Managing the implementation of accepted customer specific technical
programs or requirements.
- Coordinating the resolution of customer specific manufacturing process,
material, quality or reliability issues.
- Collecting and communicating customers for long range of technology
and product roadmaps.
- Providing new product development roadmap to customers in order to remind
them of future package capability.
- Coordinating customer audits/visits with the factories, product groups
and quality control groups.
- To respond customers complicated engineering issues in order to facilitate
the quick solution to the problem.
Hyung Woo
LEE
MAIN TRAININGS
Hunker Laboratories - Cincinnati Ohio, USA for mold process controller (1988)
Fujiwa Seiki - Nagoya, Japan for Molding Presses (1989)
MARKEM - Keene New Hampshire, USA for Auto Pad Marking system (1991)
ASA - Singapore for Auto Molding System (1991)
K&S - Philadelphia, USA for Auto wire bonding systems (1992)
Tessera – San Jose CA. for Negotiation Skills (2000)
EDUCATION
-
B.A. in Mechanical Engineering INHA University Korea
Feb. 1986
LANGUAGE ABILITY
Native
Second
Third
Language
Language
Language
: Korean
: English (BIZ Level for Negotiation)
: Japanese (Native Level as VIP club main speaker)
PERSONAL
Family
Health
Interests
:
:
:
Date of birth :
Married, Two sons
Excellent
Swimming and Music (Playing Guitar and Singing)
Nov. 23rd, 1962
PERSONAL REFERENCES
- Available on request.