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Transcript
ELEC 7950-001: VLSI Design & Test Seminar
Broun 113, Thursday December 1, 2011, 4PM*
RADPro: Automatic Test Program Generation Tool for MixedSignal and RF IC Load Board
Bruce Kim
School of Electrical and Computer Engineering, University of Alabama, Tuscaloosa, AL
All analog/mixed-signal (AMS) and RF integrated circuit chips must be verified to ensure
proper functionality and performance of manufactured IC chips. All manufactured VLSI chips are
tested by Automatic Test Equipment (ATE) during the manufacturing process. The load boards
provide interface between the chip-under-test and ATE. These load boards contain muti-site
sockets, discrete components, transistors, relays, op-amps, embedded RF circuits and jumper
wires. All of the components on the load board must be verified for proper component assembly
and defects in printed circuit boards before the first taped out chip can be verified. Manual
diagnosis of load board is highly labor intensive and ATE mapping requires hand coding. This talk
will discuss development of software tool to validate AMS and RF IC load boards. The diagnostic
tool utilizes novel techniques to differentiate faulty RF circuits embedded in printed circuit boards
and faulty assembly of components. The developed tool generates test programs automatically
from a netlist, bill of materials and component models. The tool provides user transparent
pseudocodes with high fault coverage and significantly decreased time-to-market.
Dr. Bruce Kim received the B.S.E.E. degree from the University of California, Irvine, the
M.S. degree in electrical engineering from the University of Arizona, and the Ph.D. degree in
electrical engineering from Georgia Institute of Technology. He is a faculty member at the
Department of Electrical and Computer Engineering of the University of Alabama in Tuscaloosa.
Dr. Kim is a 1997 recipient of the National Science Foundation's prestigious CAREER Award and
received three Meritorious Awards from the IEEE Computer Society. He is the area editor of the
IEEE Design and Test of Computers, associate editor of the IMAPS Microelectronics Journal,
associate editor of the IEEE Transactions of Advanced Packaging, and Associate editor of Journal
of Electronics Testing by Springer. He has served as a member of Board of Governors of the IEEE
CPMT Society for the last ten years. Dr. Kim is a follow of IMAPS (International Microelectronics
and Packaging Society) and senior member of IEEE.
Contact for seminar and course: Vishwani Agrawal, [email protected]
Website: http://www.eng.auburn.edu/~vagrawal/COURSE/E6200_Fall11/course.html
*Please note the changed location and date