Download R es is tors - M ed iu m - to F as tR eac tin g F use

V is h ay I n t e rt e c h n o l o g y, I n c .
I
INNOVAT
AND TEC
O L OGY
M25SI
N
HN
THIN FILM FUSE RESISTOR
O
19
62-2012
Resistors - Medium- to Fast-Reacting Fuse
Fusible Thin Film Chip Resistor
Key Benefits
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•
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•
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Designed for overload protection at constant voltage
Medium- to fast-reacting fuse
Special protective top coat
Flame-retardant
Suitable for automatic high-speed insertion
More cost-effective than a combination of glass fuse and resistor
APPLICATIONS
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•
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Battery chargers
Cordless phones
DVD players
Power supplies
Circuit function testing
Resources
• Datasheet: M25SI - http://www.vishay.com/doc?20031
• For technical questions contact [email protected]
One of the World’s Largest Manufacturers of
Discrete Semiconductors and Passive Components
PRODUCT SHEET
1/2
VMN-PT9022-1203
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
V is h ay I n t e rt e c h n o l o g y, I n c .
I
INNOVAT
AND TEC
M25SI
O L OGY
M25SI
N
HN
THIN FILM FUSE RESISTOR
O
19
Vishay Draloric
62-2012
Fusible
Thin
Film
Chip
Fusible
Thin
Film
ChipResistor
Resistor
• Metal film on high quality ceramic
• Special protective top coat
• Flame retardant
• Sn solder contacts on Ni barrier layer
• Fusible resistor for constant voltage
• Automatic placement compatibility
M25SI fusible thin film chip resistors are designed for
overload protection in modern professional electronics.
Typical applications include automotive, telecommunication
and industrial equipment.
• Compliant to RoHS directive 2011/65/EU
METRIC SIZE
INCH:
1206
METRIC:
RR 3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION
M25SI
Metric size
RR 3216M
5 Ω to 3.9 kΩ
Resistance range
Resistance tolerance
±5%
Temperature coefficient
± 100 ppm/K
Climatic category (LCT/UCT/days)
55/125/56
Rated dissipation, P70 (1)
0.25 W
Limiting element voltage, Umax. DC/ACRMS
P x R
Maximum permissible film temperature
125 °C
Insulation voltage (1 min), Uins DC/ACpeak
> 300 V
≤ 220 K/W
Thermal resistance (2)
> 109 Ω
Insulation resistance
≤ 1 x 10-9 h-1
Failure rate
E-Series
24
Notes
(1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a
high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or board
materials may be required to maintain the reliability of the assembly.
(2) Measuring conditions in accordance with EN 140401-801
• Marking: 3 digits
• Tolerance 1 % on request
• Beige top coat
PULSE TEST DATA
Pulse power (square pulse)
Revision 17-Sep-09
Resistors - Medium- to Fast-Reacting Fuse
FEATURES
0.9 W
0.3 W
Pulse duration ti
100 µs
100 ms
Pulse pause tp
100 ms
1s
105
105
< 0.1 %
< 0.1 %
Number of pulses
Drift after pulse test
Document Number: 20031
Revision: 17-Sep-09
PRODUCT SHEET
For technical questions, contact: [email protected]
2/2
www.vishay.com
235
VMN-PT9022-1203
This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000