Download me 259 midterm exam #1 review

ME 259 MIDTERM EXAM #1 REVIEW
Open book, notes, homework
Text Coverage:
Chapter 1 – all sections
Chapter 2 – all sections
Chapter 3 – all sections
Chapter 4 – sections 4.1, 4.3 only
Understand:
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the mechanisms involved in the three modes of heat transfer and situations where each mode
is important
steady-state, 1-D conduction, constant properties assumptions
the relationship between heat flux, thermal conductivity, and temperature in Fourier’s law
the use of the heat conduction (diffusion) equation (HCE), boundary conditions, and an
initial condition
the limitations of the thermal circuit approach
thermal contact resistance and for what situations it is important
the critical radius concept
fin effectiveness, fin efficiency, and the trade-offs involved in optimum design of fins
the use and limitations of the conduction shape factor approach
Know How To:
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apply control volume and surface energy balances to physical systems
apply the three basic transport laws: Fourier’s law of heat conduction, Newton’s law of
convection, and the Stefan-Boltzmann law of radiation between surfaces when Asur  As
apply the general heat conduction equation (HCE) to a particular problem, reduce to
governing form, and specify appropriate initial and boundary conditions
directly integrate the governing HCE and obtain a particular solution for a simple geometry
with simple boundary conditions
use the thermal circuit approach for solving 1-D, steady-state conduction problems with
convection, radiation, and/or contact resistance in planar, cylindrical, and spherical
geometries
use the thermal circuit approach for solving 2-D, steady-state conduction problems with a
shape factor
recognize when internal heat generation is important, determine q , and solve simple 1-D
problems by integrating the HCE and applying boundary conditions
determine the heat rate from a single fin by using the basic fin equations for constant crosssectional area (Table 3.4) or by using fin efficiency from Figures 3.18-3.19 and Table 3.5
determine the heat rate from fin arrays by using the thermal resistance approach