Download AG606-G Qualification Report

AG606-G QUALIFICATION REPORT
I. SUMMARY
The AG606-G has been qualified, by similarity, as an MSL 3 part meeting lead-free/RoHS requirements.
The AG606-G is dual amplifier consisting of two InGap HBT Darlington-pair amplifier die epoxied to paddle, wire
bonded & molded in SOIC 8 exposed pad package. (Note: The same die are used in AG602-89 products, which
have been qualified as members of the AGxxx Series gain block product family). This product is fabricated in an
SOIC-8 package with an exposed center pad using RoHS compliant materials. The lead finish is NiPdAu.
II. SCOPE
This report describes the rational for qualification of the AG606-G by similarity to the AG606 and AG604-89G products.
A summary of the qualification test results from the AG606 and AG604-89G is shown in Section V and VI.
III. APPLICABLE DOCUMENTS
All the test procedures and test methods are consistent with industry standards. The standards referenced in this
document are JEDEC standard 22.
IV. QUALIFICATION BY SIMILARITY
The two semiconductor dice used in the AG606-G are InGaP HBT Darlington-pair amplifiers (die reference
designator AG22). The AG606 product also uses a pair of the AG22 die in exactly the same assembly
configuration. The differences between the AG606-G and the AG606 are in the plastic molding compounds, the
lead finish, and the fabrication vendor/site. The AG606 product successfully completed a full Product Qualification
(test results are shown in Section V). Although the package-to-die material interfaces are different between the
AG606 and the AG606-G, the electrically biased tests performed (HTOL and 85/85) as part of the AG606 Product
Qualification confirm the reliability of the InGaP HBT die.
The AG602-89G product also uses the AG22 die (a single die) but is fabricated in a SOT-89 package configuration. All
of the AG60x-89G products use the same plastic molding compound, same leadframe material & finish, same epoxy
material (for die attach), same bonding wire, and are fabricated at the same site as the AG606-G product. The AG60489G was used as the representative product for qualification of the AG60x-89G product line (test results are shown in
Section VI). The die used in the AG604-89G product is the same as the die in the AG602-89G except for differences in
the values of resistive elements used to tune the circuit response. The non-biased stress tests (autoclave, temp cycle, preconditioning, high temperature bake) performed as part of the AG604-89G Product Qualification confirm the reliability
of the die-to-package interfaces. The solderability test results reported in the AG604-89G Product Qualification Report
confirms the integrity of the NiPdAu lead finish. The HTOL & HAST tests performed as part of the AG604-89G
Product Qualification provide additional confirmation of the reliability of the InGaP HBT die.
SIZE
CAGE CODE
DWG. NO.
A 14482
401 River Oaks Parkway
San Jose, CA 95134
SCALE
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
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V. AG606 QUALIFICATION SUMMARY
For the qualification of the AG606, the two amplifiers in each package, Channel 1 and Channel 2, are tested
independently. The parameters monitored for the qualification tests were Supply Current, Gain, and OIP3. Failures
are defined as any variation of 10% or greater in Supply Current, + 1 dB in Gain, and + 5dB & -2dB in OIP3. The
results of the individual qualification tests are located in section V.
Stress or Test
Procedures/Conditions
Device
Hours/
Cycles
Sample
Size
Failed
Units
Date
Reference
Document
Part
Tested
Preconditioning
Level 3
External visual 40x
High Temp. Storage Life 24 hrs
@+125°C
Temp. & Humidity Test 193 hrs.
@ +30°C/ 60% RH
Convection Solder Reflow test
3 cycles w/flux immersion, peak
temperature 235°C
Test Condition C
Temp. -65°C (+0°/-10°C) to
+150°C (+10°/-0°C)
Dwell time = 10 to 15 min.
Test Condition C
Temp. 121°C (+/-1°C)
Pressure = 15 +/-1psig
Relative Humidity = 100%
N/A
3 lots, a
total of
795 parts
0
Q1
2004
JESD22-A113C
JESD22-A101-B
JESD22-B101
JESD22-A103-B
JESD22-A112.4
AG606
500 cycles
3 lots, a
total of
180 parts
0
Q1
2004
JESD22-A104-B
AG606
96 (-1, +5)
hours
3 lots, a
total of
180 parts
0
Q1
2004
JESD22-A102-C
AG606
Unbiased High
Temperature Storage
(HTB)
Temp. 150°C (+ 5°C, -0°C)
1000 hours
1 lot, a
total of
60 parts
0
Q1
2004
JESD22-A103-B
AG606
ESD
Charged Device Model (CDM)
N/A
JESD22-C101-A
AG606
Human Body Model (HBM)
N/A
Q2
2004
JESD22-A114-B
AG606
Steady State
Temperature
Humidity Bias Life
Test 85/85 (THB)
High Temp Op Life
(HTOL)
Test Condition
Temp. 85°C (+/- 2°C)
Pressure = 7.12 +/-1psig
Relative Humidity = 85%
Test Condition B
Temp. 125°C (+5, -0°C)
1000 hours
0 failures
thru 2000
volts
0 failures
thru 1250
volts
0
Q2
2004
ESD
1 lot, a
total of
24 parts
1 lot, a
total of
15 parts
3 lots, a
total of
150 parts
Q2
2004
JESD22-A101-B
AG606
3 lots, a
total of
150 parts
0
Q1
2004
JESD22-A108-B
AG606
Temperature Cycle
Unbiased Autoclave
1,000 (-0,
+10) hours
1.
Testing procedures
All of the qualification tests were performed with the AG606 using loose parts except HTOL and THB which were
mounted to a PCB. The PCB layout used the recommended via pattern published in the AG606 Data Sheet. The test
circuit was comparable to the recommend configuration on the AG602-89 datasheet and consisted of two singleended, 50 ohm amplifiers per package. The application circuit was duplicated fifteen times on one large PCB for the
qualification testing. A control board consisting of fifteen AG606 was tested before and after each set of the
stressed devices to ensure measurement accuracy and repeatability.
2.
Pre-Conditioning
Three lots of 265, a total of 795 AG606 devices, completed pre-conditioning with no electrical failures. The 795
devices underwent pre and post stress Scanning Acoustic Microscope inspection with no failures.
SIZE
CAGE CODE
DWG. NO.
A 14482
401 River Oaks Parkway
San Jose, CA 95134
SCALE
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
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454673 December2005
3.
Temperature Cycle
60 Devices from three lots each (180 total AG606 devices) completed 500 temperature cycles with 0 failures.
4.
Unbiased Autoclave
60 Devices from three lots each (180 total AG606 devices) completed 96 hours of Autoclave with 0 failures.
5.
Unbiased High Temperature Storage (HTB)
A total of 60 AG606 devices from one lot completed 1000 hours of Unbiased High Temperature Storage with 0
failures.
6.
ESD
A total of 39 units were subjected to CDM and HBM ESD testing. The CDM test voltages were 250, 500, 750,
1,000, 1,250, 1,500, 1,750 and 2,000 volts. The HBM test voltages were 250, 500, 750, 1,000 and 1,250 volts. No
failures occurred at these voltages both for CDM and HBM ESD tests. If any one of the three devices failed at a
given voltage level, the device was said to fail at that level. The classification level was assigned according to the
last voltage level at which all three parts passed post-ESD RF testing according to the test specifications set by WJ
Communications.
A total of 39 AG606 devices completed CDM and HDM ESD testing at a variety of different voltage levels with no
failures. The AG606 device has been classified as a Class 1C device (Highest Voltage Level Passed between 1000V
and 2000V) for Human Body Model (HBM) testing according to JEDEC Standard JESD22-A114 and as a Class IV
device (Highest Voltage Level Passed > 1000V) for Charged Device Model (CDM) testing according to JEDEC
Standard JESD22-C101.
7.
Steady State Temperature Humidity Bias Life Test (85°/85% RH THB)
50 Devices from three lots each (150 total AG606 devices) completed 1000 hours of 85/85 with 0 failures.
8.
High Temp Op Life (HTOL)
50 Devices from three lots each (150 total AG606 devices) completed 1,000 hours of HTOL with 0 failures.
9.
Conclusion
The results of the qualification tests in this report demonstrate that the AG606 has passed the requirements set forth
by JEDEC for accelerated reliability testing, and will operate with high reliability and quality levels.
SIZE
CAGE CODE
DWG. NO.
A 14482
401 River Oaks Parkway
San Jose, CA 95134
SCALE
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
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454673 December2005
VI. AG604-89G QUALIFICATION SUMMARY
The SOT-89 package using AG Series InGaP HBT devices has been lead-free/RoHS qualified to a maximum reflow
profile of 260°C, and the MSL rating at this reflow profile is level 3. The lead finish is NiPdAu. The AG604-89G
gain block was selected to qualify the AG Series amplifier family of devices. It has the highest DC power
consumption, the highest RF output power and the highest current density of the amplifier family in the SOT-89
package. The parameters monitored for the qualification tests were Supply Current and Gain. Failures are defined
as any variation of 10% or greater for Supply Current and a variation of 1 dB or greater for Gain as compared to the
initial pre-stressed testing.
Stress or Test
Procedures/Conditions
Preconditioning Level
3 Lead Free
External visual 40x
High Temp. Storage Life 24 hrs
@+125°C
Temp. & Humidity Test 192 hrs. @
+30°C/ 60% RH
Convection Solder Reflow test
3 cycles w/flux immersion, peak
temperature 260°C
Test Condition C
Temp. -65°C (+0°/-10°C) to +150°C
(+10°/-0°C)
Dwell time = 10 to 15 min.
Test Condition C
Temp. 121°C (+/-1°C)
Pressure = 15 +/-1psig
Relative Humidity = 100%
Test Condition A
Temp. 130°C (+/- 2°C)
Pressure = 33.3 +/-1psia
Relative Humidity = 85%
Lead-Free Solder: Sn96Ag4
Flux Type: R145
Solder Bath Requirements: 260°C
Lead-Tin Solder: Sn63Pb37
Flux Type: R145
Solder Bath Requirements: 245°C
Electrical test
External Visual
C-SAM Die, Paddle and leads
Dry Bake 125°C, 24 hours
30°C/60 RH, 192 hours
Convection reflow 260°C, 3X
External Visual
Electrical test
C-SAM Die, Paddle and leads
Temp. 150°C (+ 5°C, -0°C)
Temperature Cycle
Unbiased Autoclave
Highly-Accelerated
Temperature and
Humidity Stress Test
(HAST)
Solderability
Lead-Free solder
Solderability
Lead solder
Moisture/Reflow
Sensitivity (MSL)
MSL level 3 lead free
Unbiased High
Temperature Storage
(HTB)
High Temp Op Life
(HTOL)
Unbiased Autoclave
Test Condition B
Temp. 125°C (+5, -0°C)
Test Condition C
Temp. 121°C (+/-1°C)
Pressure = 15 +/-1psig
Relative Humidity = 100%
Device
Hours/ Cycles
N/A
Sample
Size
3 lots, a total of
645 parts
Failed
Units
0
Reference
Document
JESD22-A113D
JESD22-A101-B
JESD22-B101A
JESD22-A103C
J-STD-020C
Part
Tested
AG604-89G
500 cycles
3 lots, a total of
135 parts
0
JESD22-A104-B
AG604-89G
96 (-1, +5) hours 3 lots, a total of
135 parts
0
JESD22-A102-C
AG604-89G
96 (-0, +2) hours 3 lots, a total of
135 parts
0
JESD22-A110-B
AG604-89G
N/A
3 lots, a total of
10 parts, 30 pins
0
AH102A-G
N/A
3 lots, a total of
10 parts, 30 pins
0
N/A
1 lot, a total of 77 0
parts
IPC/EIA/JEDEC
J-STD-002B
Method 2003)
IPC/EIA/JEDEC
J-STD-002B
Method 2003)
J-STD-20C
AH102A-G
1000 hours
1 lot, a total of
45 parts
0
JESD22-A103-C
AH102A-G
0
JESD22-A108-B
AG604-89G
0
JESD22-A102-C
AG604-89G
1,000 (-0, +10)
3 lots, a total of
hours
135 parts
96 (-1, +5) hours 3 lots, a total of
135 parts
SIZE
CAGE CODE
DWG. NO.
A 14482
401 River Oaks Parkway
San Jose, CA 95134
SCALE
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
AH102A-G
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454673 December2005
1.
Testing procedures
All of the qualification tests were performed using loose parts except HAST and the HTOL which were mounted to
a PCB. The PCB layout is the same as the application circuit published in the WJ Communications Data Sheet,
including the recommended via pattern. The application circuit was duplicated 21 times on one large PCB for the
qualification testing. A control board consisting of 21 devices was tested before and after each set of the stressed
devices to ensure measurement accuracy and repeatability.
Components are considered to have failed if any of the following occurs after being tested post-stress and compared to
respective pre-stressed testing parameters for the AG604-89-G: variation of 10% or greater for Supply Current and a
variation of 1 dB or greater for Gain. Acceptance criterion consists of having zero failures out of 45 parts to meet
WJ’s requirement of LTPD=5 for each test.
2.
Pre-Conditioning
Three lots of 215, a total of 645 AG604-89 devices, completed pre-conditioning with no electrical failures. 45 of
the 645 devices underwent pre and post stress Scanning Acoustic Microscope inspection with no failures.
3.
Temperature Cycle
A total of 135 AG604-89G devices from three lots completed 500 temperature cycles with no failures.
4.
Unbiased Autoclave
A total of 135 AG604-89G devices from three lots completed Autoclave with no failures.
5.
Highly Accelerated Temperature and Humidity (HAST)
A total of 135 AG604-89G devices from three lots completed HAST with no failures.
6.
Solderability
The Solderability test is qualified by similarity to the AH102A-G. The AH102A-G is in same package and it is
packaged at the same packaging house. See Solderability Test Report for WJ Products With Lead-Free Packaging
Finish on the WJ web site.
7.
Moisture/Reflow Sensitivity Classification (MSL)
The MSL test is qualified by similarity to the AH102A-G. The AH102A-G is in same package and it is packaged at
the same packaging house. A total of 77 AH102A-G devices from one lot completed MSL level 3 lead free testing
with no failures. The MSL results are confirmed by the pre and post preconditioning Scanning Acoustic
Microscope testing of 24 pre-conditioned AH102A-G devices underwent (MSL level 3 lead free profile, 260 °C
peak Temperature).
8.
Unbiased High Temperature Storage (HTB)
The HTB test is qualified by similarity to the AH102A-G. The AH102A-G is in same package and it is packaged at
the same packaging house. A total of 45 AH102A-G devices from one lot completed 1000 hours of Unbiased High
Temperature Storage with no failures.
9.
High Temp Op Life (HTOL)
A total of 135 AG604-89G devices from three lots completed 1,000 hours of HTOL with no failures.
10.
Conclusions
The Reliability Qualification Data demonstrates that the AG604-89G device assembled in a lead-free/RoHScompliant/green SOT-89 surface-mount package demonstrates high reliability and quality levels.
SIZE
CAGE CODE
DWG. NO.
A 14482
401 River Oaks Parkway
San Jose, CA 95134
SCALE
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
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454673 December2005
VII. CONCLUSIONS
Based on the qualification tests performed on the AG606 & AG604-89G products and their stated similarities to the
AG606-G, the AG606-G is considered a fully qualified product.
SIZE
CAGE CODE
DWG. NO.
A 14482
401 River Oaks Parkway
San Jose, CA 95134
SCALE
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com
454673
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Specifications and information are subject to change without notice.
454673 December2005