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Drift Chamber Review Jefferson Lab 6-8 March 2007 CLAS12 Drift Chamber Electronics Topics: Wire Chamber Model Diagrams CLAS – A Brief Review Interface – Pre-Amplifier Wire Chamber Electrical ‘Circuit’ Signal ‘Translator’ Board (STB) Power Dissipation High Voltage Distribution Cabling and Connections Channel & Board Count Summary R. Chris Cuevas Group Leader -- Fast Electronics Jefferson Lab Physics Division 30 cm CLAS12 WC 165 cm CLAS12 Region 1 Wire Chamber 1 Sector 190 cm CLAS12 Cutaway View AutoCad Design by Steve Christo CLAS Review CLAS Drift Chamber Electronics A Brief Review • CLAS drift chamber reliability and experience is >10 years. • Method to interface wires to circuit board has been very successful. • Conductive Rubber ‘boot’ around crimp pins • No radiation damage to rubber • Reusable, low stress on crimp pin • Good contact to circuit board hole • Pre-amplifier is mounted directly to an interface board and connected to Sense wire by circuit trace. • Local voltage regulation for Pre-amplifiers on interface board • Uncoated Pre-Amplifiers were showing signs of ‘whisker’ growth • Low component count per interface board CLAS Review CLAS Region 3 Drift Chamber Note: High Voltage Boards CLAS Drift Chamber Electronics A Brief Review CLAS Region 2 Signal ‘Translator’ Board CLAS12 Drift Chamber Electronics CLAS12 Interface Circuit Board Conductive Rubber Plastic Insert Plated Hole Copper trace Wire Feedthrough Crimp Pin 3kv High Voltage Clearance Use 0.25mm/100Vdc Endplate P R E A M P Signal ‘Translator’ Board So, 1850Vdc on Sense Wire demands 4.625mm (0.182”) clearance. Reference: IPC-2221A Circuit Board Conductor Spacing CLAS12 Interface CLAS12 Drift Chamber Electronics Pre-Amplifier Technology Dimensions Gain Rise Time Input Noise Dynamic Range Power Supply Thick-film on Al2O3 substrate 8-pin, Single-In-line (SIP) 0.80” L X 0.45” H X 0.08” W 2.3 mV/A 4.3 nS < 250 nA 200 A +5V DC, 13 mA Original Version: NOT coated (1994) Epoxy Coated Version: 2003 CLAS Note 92-003 The CLAS Pre-Amplifier Fernando Barbosa CLAS12 Drift Chamber Electronics CLAS12 Interface Wire Chamber Signals Amplifier Discriminator Board X X Pre-amp 75 ft X ADB from CLAS will be used for CLAS12 S X MIP X X Threshold +HV • Gas gain == 5 x 10 4 • Use 4 electrons from Ionizing Particle – “Corner Clip” signal • Use 10nS peak current time • 3.2uA Sense wire signal to Pre-Amplifier from MIP • Preamplifier is a trans-impedance amplifier with a 2mV/uA gain. ‘Post Amplifier’ receives differential signal and compensates cable attenuation and adds additional gain stage. • Pre-Amplifier combined with Post Amp/Receiver allow discriminator setting to be above the chamber input noise( <0.4ua ) and still be sensitive to MIP signals for good timing resolution. CLAS12 Interface CLAS12 Drift Chamber Electronics CLAS12 Interface CLAS12 Drift Chamber Electronics ‘Post Amplifier’ circuit section From Amplifier-Discriminator Board From Pre-Amp +75 Ft twisted pair cable (100 Ohm termination not shown) Note: Two gains possible Small signals Av=30 Large signals Av=10 Discriminator stage not shown, but typical discriminator setting is 30mV The ADB, and Multiplexer boards will be used for the CLAS12 CLAS12 Electrical Circuit Notes: 1. Electrical Diagram for a single Wire Chamber “Cell” Notes: 1. 32 Field Wire Pins ‘Wrapped’ together on end plates 2. 6 Sense Wire layers per superlayer 3. Each Sense Wire connected to HV through 1Meg resistor Pre-amp power is regulated and isolated from ground. Pre-Amplifier Power Dissipation Pre-Amplifer Power Dissipation 16 Preamps powered by one regulator Pre-Amp Current Pre-Amp Voltage Power #Pre-Amps 0.013 A 5 0.065 96 Regulator Power Drop Out Voltage 16 PreAmps #Regulators 1.5 0.208 A 6 Total/STB 7 STB/Superlayer Total(W) 6.24 1.872 8.112 7 Watts per Superlayer 56.784 Total for 1 Region in 1 Sector 113.568 CLAS12 Super-layers Region 3 (6) (6) Region 2 (6) (6) Region 1 (6) (6) U V Wire Chamber Diagram -- 1 Sector Two (2) Super-layers per Region Six (6) Sense Wire Layers per Super-layer U V U V BEAM CLAS12 STB CLAS12 Signal Translator Boards ( STB) • Multi-Layer circuit board • Glass Epoxy FR-4 for CLAS • Investigating better material for CLAS12 boards (HVPF) • Non hydroscopic, superior dielectric strength • 7 identical boards per Super-Layer • Wire Voltages: Region 1(s, f, g) = 1400, -700, 500 Region 2(s, f, g) = 1550, -775, 550 Region 3(s, f, g) = 1650, -825, 590 *Voltage supplied from HV boards *Must design STB board traces with adequate clearance for HV holes CLAS12 Signal Translator Boards ( STB) CLAS12 STB 233mm Low Voltage Input Local Voltage Regulator 16 channel Pre-Amplifier ‘groups’ 17th pair used as test pulse input 6 ‘groups’ of 16 == 96 channels 220mm PCB Connector Side View Sketch SIPS End Plate Support CLAS12 HV CLAS12 High Voltage Distribution Boards • Simple double layer circuit board • Glass Epoxy FR-4 for CLAS • Investigating better material for CLAS12 boards (HVPF) • Non hydroscopic, superior dielectric strength • 7 identical boards per Super-Layer • HV supply cables soldered to the board Cabling & Connections High Voltage Boards CLAS12 WC Cabling • Multi-conductor cable sources HV to each board for each Super-Layer • Seven(7) cables per Super-Layer • High Voltage conductors for Sense, Field and Guard Wires • 1 end of HV Cable are solder terminated on the boards • 1 end of HV Cable connects to ‘Distribution Box” Cabling & Connections Signal Translator Boards ( STB ) CLAS12 WC Cabling • Multi-conductor cable sources Low Voltage (LV) to STB for each Super-Layer Seven(7) LV cables per Super-Layer • Low Voltage Segmentation: 32 Pre-Amplifiers per LV supply + V and return • LV Cable is terminated with polarized latching connector on the STB • LV Cable is terminated with polarized latching connector on ‘Distribution Box” • Pre-Amplifier Output Cables • Six(6) cables per STB per each Super-Layer – 84 Output Cables Total Smaller pitch twisted (0.025”) pair cable under consideration -- Saves space Normal pitch (0.050”) twisted pair will be used from ‘Interface Box’ To Readout Modules CLAS12 WC Cabling Cabling & Connections Signal Translator Boards ( STB ) 6 96 Channels C A B L E STB7V 6 96 Channels STB6V I N T E R F A C E 6 96 Channels STB5V 6 96 Channels STB4V 6 96 Channels STB3V 6 96 Channels STB2V Use existing cables To Readout Electronics 17 Pair ‘0.025” Pitch’ Smaller O.D. Use existing LV Supplies And Fuse Protection hardware 17 Pair ‘Standard Pitch’ STB1V - FUSE Chassis 6 96 Channels + 7 LOW VOLTAGE DISTRIBUTION 7 CLAS12 WC Cabling CLAS12 Drift Chamber Electronics Low Profile Box Header PCB Connector $3.10 for qty >1000 17 pair; 0.025” pitch; 0.3” Nominal O.D. $4 per foot from preliminary budget estimate; Need ~15K feet CLAS12 Drift Chambers Channel & Board Count CLAS12 #Sense Wires Sense #Layers Wires 96 Channel per Sector STB LV Cables STB Output Cables 96 Channel HV Board STB HV Cables HV Board R1_U 112 6 672 7 7 42 7 7 R1_V 112 6 672 7 7 42 7 7 R2_U 112 6 672 7 7 42 7 7 R2_V 112 6 672 7 7 42 7 7 R3_U 112 6 672 7 7 42 7 7 R3_V 112 6 672 7 7 42 7 7 4032 42 42 252 42 42 6 6 6 6 6 6 24192 252 252 1512 252 252 6 Sector Multiplier Totals Safety Notes • Reference JLAB ESH&Q manual: • Chapter 6230 Electronic Equipment Safety • Class 1 Hazard – ( Low ) • Low Voltage System < 50V < 50A • High Voltage System >50V < 5mA • All work performed in: Mode 1 De-energized Or Mode 2 Non-manipulative measurements • Low Voltage power cables are fused and supply is programmed for over-current trip • High Voltage supply is current limited ( 40uA ) per supply cable • Soldering is performed with safety glasses • Cutting component leads is performed with safety glasses • Required Personal Protective Equipment [PPE] • When using circuit board cleaning solvents • Material Safety Data Sheets – Included with board cleaning procedure Summary • CLAS experience will be very valuable • Wire interface to High Voltage boards and Pre-Amplifier boards is a proven method using conductive rubber connection • Epoxy encapsulated Pre-Amps will eliminate corrosion problem • Investigating the use of new circuit board materials for prototype testing. • ‘Service’ connection area is planned for outer support plate of Wire Chamber section. Cable distribution for LV and Readout will use this area for interface hardware. • New “Custom” Drift Chamber interface boards are based on successful designs.