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MC33263NW-30R2 中文资料
元器件交易网 www.cecb2b.com
MC33263
DEFINITIONS
Load Regulation – The change in output voltage for achange in load current at constant
chip temperature.
Dropout Voltage – The input/output differential at whichthe regulator output no
longer maintains regulation againstfurther reductions in input voltage. Measured
when theoutput drops 100 mV below its nominal value (which ismeasured at 1.0 V
differential), dropout voltage is affectedby junction temperature, load current and
minimum inputsupply requirements.
Output Noise Voltage – The RMS AC voltage at theoutput with a constant load and no
input ripple, measuredover a specified frequency range.
Maximum Power Dissipation – The maximum totaldissipation for which the regulator
will operate withinspecifications.
Quiescent Current – Current which is used to operate theregulator chip and is not
delivered to the load.
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Line
Regulation
–
The
change
in
input
voltage
thehttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366
for
achange
in
input
voltage.
The
measurement is made underconditions of low dissipation or by using pulse
techniquessuch that the average chip temperature is not significantlyaffected.
Line Transient Response – Typical over– andundershoot response when input voltage
is excited with agiven slope.
Thermal Protection – Internal thermal shutdowncircuitry is provided to protect the
integrated circuit in theevent that the maximum junction temperature is exceeded.When
activated, typically 150°C, the regulator turns off.
This
feature
is
provided
to
prevent
catastrophic
failures
fromaccidental
overheating.
Maximum Package Power Dissipation – The maximumpackage power dissipation is the
power dissipation level atwhich the junction temperature reaches its maximum valuei.e.
125°C. The junction temperature is rising while thedifference between the input
power
(VCC
X
ICC)
and
theoutput
power
(Vout
X
Iout)
is
increasing.://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366
Depending on ambient temperature, it is possible tocalculate the maximum power
dissipation, maximum loadcurrent or maximum input voltage (see Application
Hints:Protection).
The maximum power dissipation supported by the deviceis a lot increased when using
appropriate application design.Mounting pad configuration on the PCB, the board
materialand also the ambient temperature are affected the rate oftemperature rise.
It means that when the IC has good thermalconductivity through PCB, the junction
temperature will be“low” even if the power dissipation is great.
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The thermal resistance of the whole circuit can beevaluated by deliberately
activating the thermal shutdownof the circuit (by increasing the output current or
raising theinput voltage for example).
Then you can calculate the power dissipation bysubtracting the output power from the
input
power.
Allvariables
are
then
well
known:
power
dissipationhttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366,
thermalshutdown temperature (150°C for MC33263) and ambienttemperature.
APPLICATION HINTS
Input Decoupling – As with any regulator, it is necessaryto reduce the dynamic
impedance of the supply rail thatfeeds the component. A 1 mF capacitor either ceramic
ortantalum is recommended and should be connected close tothe MC33263 package. Higher
values will correspondinglyimprove the overall line transient response.
Output Decoupling – Thanks to a novel concept, theMC33263 is a stable component and
does not require anyEquivalent Series Resistance (ESR) neither a minimumoutput
current. Capacitors exhibiting ESRs ranging from afew mW up to 3W can thus safely
be used. The minimumdecoupling value is 1 mF and can be augmented to fulfillstringent
load transient requirements. The regulator acceptsceramic chip capacitors as well
as tantalum devices.
Noise
Performances
–
Unlike
other
LDOs,
the
MC33263is
a
truehttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366 low–noise regulator.
With a 10 nF bypass capacitor,it typically reaches the incredible level of 25 mVRMS
overallnoise between 100 Hz and 100 kHz. To give maximuminsight on noise
specifications, ON Semiconductor includesspectral density graphics as well as noise
dependency versusbypass capacitor.
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The bypass capacitor impacts the start–up phase of theMC33263 as depicted by the
data–sheet curves. A typical1 ms settling time is achieved with a 10 nF bypass
capacitor.However, thanks to its low–noise architecture, theMC33263 can operate
without bypass and thus offers atypical 20 ms start–up phase. In that case, the
typical outputnoise stays lower than 65 mVRMS between 100 Hz –100 kHz.
Protections – The MC33263 hosts several protections,conferring natural ruggedness
and reliability to the productsimplementing the component. The output current
isinternally limited to a minimum of 175 mA whiletemperature shutdown occurs
ihttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366f
the
die
heats
up
beyond150°C. These value lets you assess the maximumdifferential voltage the device
can sustain at a given outputcurrent before its protections come into play.
The maximum dissipation the package can handle is givenby:
T–T
APmax Jmax
qJA
元器件交易网 www.cecb2b.com
MC33263
PACKAGE DIMENSIONS
SOT–23LNW SUFFIXCASE 318J–01ISSUE B
NOTES:
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1.DIMENSIONS ARE IN MILLIMETERS.
2.INTERPRET DIMENSIONS
AND TOLERANCESPER ASME Y14.5M, 1994.
3.DIMENSION E1 DOES NOT INCLUDE INTERLEADFLASH OR PROTRUSION. INTERLEAD FLASH
ORPROTRUSION SHALL NOT EXCEED 0.23 PERSIDE.
4.DIMENSIONS b AND b2 DO NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 TOTAL IN EXCESSOF THE
b AND b2 DIMENSIONS AT MAXIMUMMATERIAL CONDITION.
5.TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.
6.DIMENSIONS D AND Ehttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f23661 ARE
TO BE DETERMINEDAT DATUM PLANE H.
MILLIMETERS1.251.400.000.100.350.500.350.450.100.253.203.603.003.602.002.40
AA1bb1cDEE1ee1SECTION A–A
ON Semiconductor and
Industries, LLC (SCILLC).
are trademarks of Semiconductor Components
SCILLC reserves the right to make changeswithout further
notice to any products herein.
SCILLC makes no warranty, representation or guarantee
regarding the suitability of its products for any particularpurpose, nor does SCILLC
assume any liability arising out of the application or use of any product or circuit,
and specifically disclaims any and all liability,including without limitation
special, consequential or incidental damages.
“Typical” parameters which may be
provided in SCILLC data sheets and/orspecifications can and do vary in different
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applications and actual performance may vary over time.
including
“Typicals”
All operating parameters,
must
http://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366for
application by customer’s technical experts.
bevalidated
each
customer
SCILLC does not convey any license
under its patent rights nor the rights of others.SCILLC products are not designed,
intended, or authorized for use as components in systems intended for surgical implant
into the body, or other applicationsintended to support or sustain life, or for any
other application in which the failure of the SCILLC product could create a situation
where personal injury ordeath may occur.
Should Buyer purchase or use SCILLC
products for any such unintended or unauthorized application, Buyer shall indemnify
and holdSCILLC and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and
reasonableattorney fees arising out of, directly or indirectly, any claim of personal
injury or death associated with such unintended or unauthorized use, even if such
claimalleges
that
whttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366as
SCILLC
negligent
regarding
the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative
Action Employer.
PUBLICATION ORDERING INFORMATION
CENTRAL/SOUTH AMERICA:
Spanish Phone:303–308–7143 (Mon–Fri 8:00am to 5:00pm MST)
Email:ONlit–[email protected]/PACIFIC: LDC for ON Semiconductor – Asia
Support
Phone:303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)
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Toll Free from Hong Kong & Singapore:001–800–4422–3781
Email: ONlit–[email protected]
JAPAN: ON Semiconductor, Japan Customer Focus Center
4–32–1
Nishi–Gotanda,
Shinagawa–ku,
Tokyo,
Japan
141–8549Phone:
81–3–5740–2745Email: [email protected]
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