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文档下载 免费文档下载 http://www.wendangwang.com/ 本文档下载自文档下载网,内容可能不完整,您可以点击以下网址继续阅读或下载: http://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366 MC33263NW-30R2 中文资料 元器件交易网 www.cecb2b.com MC33263 DEFINITIONS Load Regulation – The change in output voltage for achange in load current at constant chip temperature. Dropout Voltage – The input/output differential at whichthe regulator output no longer maintains regulation againstfurther reductions in input voltage. Measured when theoutput drops 100 mV below its nominal value (which ismeasured at 1.0 V differential), dropout voltage is affectedby junction temperature, load current and minimum inputsupply requirements. Output Noise Voltage – The RMS AC voltage at theoutput with a constant load and no input ripple, measuredover a specified frequency range. Maximum Power Dissipation – The maximum totaldissipation for which the regulator will operate withinspecifications. Quiescent Current – Current which is used to operate theregulator chip and is not delivered to the load. 文档下载 免费文档下载 http://www.wendangwang.com/ Line Regulation – The change in input voltage thehttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366 for achange in input voltage. The measurement is made underconditions of low dissipation or by using pulse techniquessuch that the average chip temperature is not significantlyaffected. Line Transient Response – Typical over– andundershoot response when input voltage is excited with agiven slope. Thermal Protection – Internal thermal shutdowncircuitry is provided to protect the integrated circuit in theevent that the maximum junction temperature is exceeded.When activated, typically 150°C, the regulator turns off. This feature is provided to prevent catastrophic failures fromaccidental overheating. Maximum Package Power Dissipation – The maximumpackage power dissipation is the power dissipation level atwhich the junction temperature reaches its maximum valuei.e. 125°C. The junction temperature is rising while thedifference between the input power (VCC X ICC) and theoutput power (Vout X Iout) is increasing.://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366 Depending on ambient temperature, it is possible tocalculate the maximum power dissipation, maximum loadcurrent or maximum input voltage (see Application Hints:Protection). The maximum power dissipation supported by the deviceis a lot increased when using appropriate application design.Mounting pad configuration on the PCB, the board materialand also the ambient temperature are affected the rate oftemperature rise. It means that when the IC has good thermalconductivity through PCB, the junction temperature will be“low” even if the power dissipation is great. 文档下载 免费文档下载 http://www.wendangwang.com/ The thermal resistance of the whole circuit can beevaluated by deliberately activating the thermal shutdownof the circuit (by increasing the output current or raising theinput voltage for example). Then you can calculate the power dissipation bysubtracting the output power from the input power. Allvariables are then well known: power dissipationhttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366, thermalshutdown temperature (150°C for MC33263) and ambienttemperature. APPLICATION HINTS Input Decoupling – As with any regulator, it is necessaryto reduce the dynamic impedance of the supply rail thatfeeds the component. A 1 mF capacitor either ceramic ortantalum is recommended and should be connected close tothe MC33263 package. Higher values will correspondinglyimprove the overall line transient response. Output Decoupling – Thanks to a novel concept, theMC33263 is a stable component and does not require anyEquivalent Series Resistance (ESR) neither a minimumoutput current. Capacitors exhibiting ESRs ranging from afew mW up to 3W can thus safely be used. The minimumdecoupling value is 1 mF and can be augmented to fulfillstringent load transient requirements. The regulator acceptsceramic chip capacitors as well as tantalum devices. Noise Performances – Unlike other LDOs, the MC33263is a truehttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366 low–noise regulator. With a 10 nF bypass capacitor,it typically reaches the incredible level of 25 mVRMS overallnoise between 100 Hz and 100 kHz. To give maximuminsight on noise specifications, ON Semiconductor includesspectral density graphics as well as noise dependency versusbypass capacitor. 文档下载 免费文档下载 http://www.wendangwang.com/ The bypass capacitor impacts the start–up phase of theMC33263 as depicted by the data–sheet curves. A typical1 ms settling time is achieved with a 10 nF bypass capacitor.However, thanks to its low–noise architecture, theMC33263 can operate without bypass and thus offers atypical 20 ms start–up phase. In that case, the typical outputnoise stays lower than 65 mVRMS between 100 Hz –100 kHz. Protections – The MC33263 hosts several protections,conferring natural ruggedness and reliability to the productsimplementing the component. The output current isinternally limited to a minimum of 175 mA whiletemperature shutdown occurs ihttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366f the die heats up beyond150°C. These value lets you assess the maximumdifferential voltage the device can sustain at a given outputcurrent before its protections come into play. The maximum dissipation the package can handle is givenby: T–T APmax Jmax qJA 元器件交易网 www.cecb2b.com MC33263 PACKAGE DIMENSIONS SOT–23LNW SUFFIXCASE 318J–01ISSUE B NOTES: 文档下载 免费文档下载 http://www.wendangwang.com/ 1.DIMENSIONS ARE IN MILLIMETERS. 2.INTERPRET DIMENSIONS AND TOLERANCESPER ASME Y14.5M, 1994. 3.DIMENSION E1 DOES NOT INCLUDE INTERLEADFLASH OR PROTRUSION. INTERLEAD FLASH ORPROTRUSION SHALL NOT EXCEED 0.23 PERSIDE. 4.DIMENSIONS b AND b2 DO NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.08 TOTAL IN EXCESSOF THE b AND b2 DIMENSIONS AT MAXIMUMMATERIAL CONDITION. 5.TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY. 6.DIMENSIONS D AND Ehttp://www.wendangwang.com/doc/fcd2729bbb843fedd45f23661 ARE TO BE DETERMINEDAT DATUM PLANE H. MILLIMETERS1.251.400.000.100.350.500.350.450.100.253.203.603.003.602.002.40 AA1bb1cDEE1ee1SECTION A–A ON Semiconductor and Industries, LLC (SCILLC). are trademarks of Semiconductor Components SCILLC reserves the right to make changeswithout further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particularpurpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/orspecifications can and do vary in different 文档下载 免费文档下载 http://www.wendangwang.com/ applications and actual performance may vary over time. including “Typicals” All operating parameters, must http://www.wendangwang.com/doc/fcd2729bbb843fedd45f2366for application by customer’s technical experts. bevalidated each customer SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury ordeath may occur. 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