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Passive Electronic Components Lecture 4 Page 1 of 11 22-Mar-2017 Heat transfer in passive electronic components Lecture Plan 1. Harmonic functions and related physical phenomena 2. Modes of heat transfer 1. Harmonic functions and related physical phenomena. Consider some examples of stationary (not depending on the time) vector field A and conjugated scalar field related as A , (1) where - vector operator that is called nabla operator. In Cartesian coordinates x, y, z ix jy kz . x y z In cylindrical coordinates r , , z where x r cos , y r sin , z z iz i ir 1 ir i i z . r r z In spherical coordinates r , , where x r cos sin , y r sin sin , z r cos 1 1 ir i i . r r sin r Passive Electronic Components Lecture 4 Page 2 of 11 ir i i The examples of conjugated physical fields that are describable by (1) are: (A) Electrostatic field E [V/m] (the force per unitary positive test charge) and electrostatic potential [V] in dielectric medium: E , (B) Electric current density j [A/m2] and electrical field potential [V] in conductive medium (in the case of the positive charge carriers): j , where - electrical conductivity of the medium [-1m-1]. (Pay attention: the same letter is used below for designation of Stefan – Boltzmann constant). (C) Heat flux q [W/m2] and temperature field T [K] in solid body (Fourier’s law): q KT , where K - thermal conductivity of the body material [W/(mK)], It is important that in all these examples respective vector field A has zero total flux through any closed surface S: A ds 0. (2) S Indeed: Electrostatic field E in dielectric medium has zero total flux through any closed surface S supposing that there is no unbalanced charge inside S; Passive Electronic Components Lecture 4 Page 3 of 11 Electric current density i in conductive medium has zero total flux through any closed surface S supposing that there is no current source inside S; Heat flux q has zero total flux through any closed surface S supposing that there is no heat source inside S. Let us apply the divergence theorem to the surface integral in the left side of equation (2): A d s Adv. S V (3) The product A is called the divergence of vector A . Transform equation (2) using (1) and (3): dv 0; V 0; 2 0; 0, (4) where or 2 is a scalar operator - Laplacian. We shall use 2 designation in order not to mix up Laplacian designation with designation of increment (difference) of a variable. In Cartesian coordinates x, y, z 2 2 2 2 2 2 2 . x y z In cylindrical coordinates r , , z 2 1 1 2 2 . r r r r r 2 2 z 2 In spherical coordinates r , , 2 1 2 1 2 1 sin . 2 2 r 2 2 2 r r r r sin r sin Any function that satisfies differential equation (4) is called harmonic function. Therefore, a potential of stationary electric field in dielectric medium, an electrical potential in conductive medium, and a stationary temperature field in a solid body are examples of harmonic functions of spatial coordinates. Harmonic function defined inside a closed surface attains its maximum (minimum) on the surface (on the boundary) if it has no “sources” inside this surface. Passive Electronic Components Lecture 4 Page 4 of 11 2. Modes of heat transfer 2.1. Heat conduction is a mode of transfer of energy within and between bodies of matter, due to a temperature gradient and with no visible motion. Fundamental hypothesis of the Mathematical Theory of Heat Conduction (Fourier’s law) is that heat flux q through elementary surface per unit time per unit area [W/m2] resulting from thermal conduction is proportional to the magnitude of the temperature gradient and opposed to its sign: q KT , (5) where K - thermal conductivity of a body material [W/(mK)], T - temperature [K] as function of the spatial coordinates. We shall consider heat flux and temperature field in a solid body. Suppose that some volume bounded by the surface S does not comprise heat sources and is kept in stationary condition (the temperature field does not change in time). According to the law of energy conservation q ds 0. (6) S Let us substitute q by T in (6) using (5) and apply the divergence theorem. The result will be 2T 0 . That means that stationary distribution of temperature in homogeneous isotropic solid whose thermal conductivity is independent of the temperature is a harmonic function. Conception of thermal resistance. Consider some cylindrical solid body (Fig.1) that conducts a heat power Q from one flat base having uniform temperature T 0 T1 to another flat base having uniform temperature T l T2 . It is important that there are two areas with constant temperature on the body’s surface. They serve as the “thermal terminals” in the heat conduction process (similar to ohmic resistor’s terminals in an electrical conduction process). Let us show that the values T2 T1 and Q are proportional. Proportionality coefficient Rt depends on the form and material of the body and is called "thermal resistance" of this body. Q T1 T2 x 0 l Fig.1 It may be easily shown that linear temperature distribution (7) T T T ( x) T1 2 1 x . l (7) Passive Electronic Components Lecture 4 Page 5 of 11 2 Satisfies Laplace equation T 0 and given boundary conditions: T 0 T1 ; T l T2 . Heat flow through cylindrical surface (in directions 0y, 0z perpendicular to axis x) is zero. Heat flux in direction of axis 0x is T T1 q KT K 2 ix 0 j y 0 k z l T T1 . qx K 2 l Absolute value of entire power Q (heat rate) transferred through area S of each base will be Q q x S KS T2 T1 l Rt 1 T2 T1 . Rt T2 T1 . Q (8) (9) Parameter Rt is called "thermal resistance". It follows from (8) that for considered cylindrical solid body l (9a) Rt . KS Compare (9) with expressions for electrical resistance of the prismatic body that has the same shape as shown in Fig.1 and is made of material with electrical conductivity [-1m-1]: R U 2 U1 I ;R l . S (10) Identity of the expressions (9) and (10) stems from the fact that both temperature field and electrical potentials are harmonic functions and satisfy the identical differential equations and boundary conditions. Calculation of thermal resistance. Suppose that arbitrary solid body conducts a heat power Q from part a of its surface to part b of its surface. Suppose that both a and b are characterized by uniformly distributed temperatures T1 and T2 respectively. The remaining part c of the body's surface is supposed to be thermally isolated. A. The temperature field inside the body is represented by harmonic function T that can be found as solution of Laplace equation with the given boundary conditions: 2T 0; T a T n T1 ; T b T2 0. C Passive Electronic Components Lecture 4 Page 6 of 11 B. T determination. C. Determination of thermal resistance between two surfaces having constant temperature distributions: Rt T2 T1 Q T2 T1 q ds S T2 T1 . KT ds (11) S Equation (11) means that thermal resistance may be expressed in terms of scalar temperature field T . Alternatively thermal resistance may be expressed in terms of vector field of heat flux q by substitution of (5) in (9): a Rt T2 T1 Q q dl T2 T1 b . q d s K q ds S (12) S Example 1. Thermal resistance of a prism. z l S x y T1 T2 (A) Suppose that temperature distribution is given. It is T ax , (13) where a is some constant. Check that T is harmonic function and complies to all boundary conditions. (B) Determination of T : T aix . (C) Determination of thermal resistance: Passive Electronic Components Lecture 4 Page 7 of 11 Rt ax 2 x1 aK ds S al aK ds l KS S Example 2. Thermal resistance of ring sector with thickness h. T1 a T2 1 T 1 2T 2T 0; r r r r r 2 2 z 2 T 1 T T T ir i iz . r r z b (A) Suppose that temperature distribution is given as linear function of : T c d . It is obvious that if const then T const . It may be found from the given boundary conditions T r,1 T1 ; T r, 2 T2 and temperature distribution T c d that c T2 T1 T T21 ;d 1 2 . 2 1 2 1 Let us check that T is harmonic function and complies to boundary conditions. Indeed, 2T 0 because T is linear function. T r,1 T1 ;T r, 2 T2 ; qr a, qr b, 0; q z r, 0 . c (B) Determination of T : T i . r (C) Determination of thermal resistance: 1 c( 2 1 ) 2 Rt . b chdr b b hK ln 2hK ln K r a a a 2.2. Heat convection is the transmission of heat through a currents of a fluid (liquid or gas). Newton’s law of cooling: q h(T TS ) , (11) where q - heat transferred from the unit surface of a solid body in the unit of time [W/m2], T - temperature of a solid body surface [K], TS - temperature of oncoming fluid (gas) [K], h - heat transfer coefficient [W/(m2K)]. Passive Electronic Components Lecture 4 Page 8 of 11 Examples of heat transfer coefficient values [2, p.21] Object Air speed, h, T TS , m/s W/(m2K) K Vertical 0.3 m wall 0 30 4.3 1 m flat plate 30 70 80 The convection coefficient for natural convection in gas is generally in the range 1…20 W/(m2K). Typical range for a liquid ambient is 100…1000 W/(m2K). Let us extend the conception of thermal resistance to the case of convection. Multiplying (11) by S gives: Q hS (T TS ) . Following the logic of equation (9) we come to the following definition: T TS T Q Q 1 Rt . hS Rt (12) ( means difference, not Laplacian!) 2.3. Radiation is heat transfer by infrared rays. Stefan – Boltzmann law: The power per unit area q radiated by a body is proportional to the fourth power of its absolute temperature T and is given by equation: q T 4 , (13) where = 5.67010-8 W/(m2K4) is Stefan – Boltzmann constant, - dimensionless emissivity coefficient (the fraction of the ideal blackbody spectrum energy which a real body actually emits), T - absolute temperature of the body, K. Surface material Ideal blackbody Black paint Concrete Polished aluminum foil 1.0 0.9 0.88 0.05 Each body radiates and absorbs a radiant energy simultaneously. In special case of a small object with uniform surface temperature T placed in a relatively large enclosure having uniform temperature T0 , the total heat transfer qnet from the object surface outwards is given by the following equation: q net (T 4 T04 ) , Passive Electronic Components Lecture 4 Page 9 of 11 Let us introduce new designation: T T T0 . ( means difference, not Laplacian!) T 4 T04 4T (T0 T ) T03 1 4 T04 T04 1 4 2 3 4 T T T T T 4 4 1 T0 1 4 4 1 6 T0 T0 T0 T0 T0 2 3 3 T T 1 T 4T T03 . 2 T0 T0 4 T0 qnet (T 4 T04 ) 4T T03 hrad T ; (14) hrad 4T03 . The smaller is T T0 ratio the more precise is equation (14). T, K Error, % (T0=293K) 5 11 16 22 29 64 10 20 30 40 50 100 We can conclude that conception of thermal resistance that was introduced for heat conduction and convection may be expanded to radiation of a body situated inside some enclosure: Rt T T ; Q q net S q net hrad T ; Rt 1 hrad S (15) . Important conclusion results from universality of thermal resistance conception: in any conditions of heat transfer a temperature rise (a temperature difference between heat generating body and ambience) T is proportional to the power Q of heat generation. The proportionality coefficient will be thermal resistance Rt . When thermal resistance of complex system is evaluated the whole system be be split into the parts. Then its heat analysis may be performed in the terms of thermal resistances of its parts. The elementary thermal “resistors” may be combined in a network the same as electrical resistors in the complex circuit. Passive Electronic Components Lecture 4 Page 10 of 11 Appendix 1 Example of Thermal Analysis of Axial Resistor Consider axial resistor of CCF-2 style manufactured by Vishay. Resistor is mounted on PCB. The contribution of each way of heat transfer outside from resistor body has to be evaluated. Data for calculation: Input Data Dissipated power Q 0.5 W Ambient air and PCB temperature T 1 20 C 293 K Resistor temperature T2 74 C 347 K Body length l body 8.7 mm 8.70E-03 m Body diameter d body 3.7 mm 3.70E-03 m Lead length l lead 12 mm 1.20E-02 m Lead diameter d lead 0.81 mm 8.10E-04 m Heat transfer coefficient Emissivity coefficient Stefan – Boltzmann constant Copper heat conductivity Thermal resistance of PCB for heat flow from each lead h conv 10 W/(m^2*K) 0.9 5.67E-08 W/(m^2*K^4) 400 W/(m*K) K R PCB 220 K/W Body Lead PCB Solution. Rrad Rconv Heat dissipated in ambient space RPCB Rlead RPCB Rlead Heat released in resistor body Passive Electronic Components Lecture 4 Page 11 of 11 Calculation results: R lead S body d body l body d body 2 2 S lead d lead 4 R conv 1 hconv S body R r ad 1 4 T 2 T1 2 3 S b od y Rlead l lead KS lead 5.82E+01 K/W R total Rtotal 1 / 1 / R rad 1 / R conv 2 /( R lead R PCB ) 1.08E+02 K/W Body surface Lead cross section R conv R rad 1.23E-04 5.15E-07 8.16E+02 m^2 1.22E+03 K/W m^2 K/W Verification of solution Resistor temperature T T1 R total Q 74.2 C Contribution of each way of heat transfer is the following: Convection Radiation Conduction Total 13 % 9% 78 % 100 % Example. Maximum thermal resistance between thick-film chip resistor surface at 125C and ambient space (EN140401-802 European Standard) Metric style (Inch style) RR 1005M (0402) RR 1608M (0603) RR 2012M (0805) RR 3216M (1206) Chip dimensions, mm 1.00.50.35 1.60.80.50 2.01.20.50 3.21.60.56 Rt, K/W 880 550 440 220 The actual thermal resistance of chip components is mainly influences by PCB design: soldering pad dimensions, copper thickness, insulation material type (glass-polymer, ceramics). 1. Carslaw H.S., Jaeger J. C., Conduction of heat in solids. Oxford at the Clarendon Press, 1959. 2. J.H. Lienhard, A heat transfer textbook. Englewood Cliffs, N. J.: Prentice-Hall, 1981.