PRC CATALOG ISSUE NO 42 (PPre-Flight)
... variation in resistance above or below room ambient (23°C or 25°C) or a span that includes both, it is essential with close resistance tolerances and low TCR requirements, to specify the temperature span of operation and treat all the surrounding conditions affecting the resistor as “one-spec.” ...
... variation in resistance above or below room ambient (23°C or 25°C) or a span that includes both, it is essential with close resistance tolerances and low TCR requirements, to specify the temperature span of operation and treat all the surrounding conditions affecting the resistor as “one-spec.” ...
An Aging Model of Ni-MH Batteries for Hybrid Electric Vehicles
... engineered to keep the DOD of the battery above 50% [4]. ...
... engineered to keep the DOD of the battery above 50% [4]. ...
LT3021/LT3021-1.2/ LT3021-1.5/LT3021-1.8
... Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LT3021 regulators are tested and specified under pulse load cond ...
... Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LT3021 regulators are tested and specified under pulse load cond ...
FEATURES GENERAL DESCRIPTION
... Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to ...
... Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to ...
RT5007 - Richtek
... (3) IRQ, SDA and SCL are connected to VDD via a pull high resistor (typ. 4.7kΩ). (4) EXTM, SDA, SCL and IRQ are connected to microcontroller directly. (5) Use a low ESR capacitor for C4 (typ. 100μF) to reduce the voltage ripple. (6) The capacitor C6 of TCAP should not be less than 39nF to avoid inru ...
... (3) IRQ, SDA and SCL are connected to VDD via a pull high resistor (typ. 4.7kΩ). (4) EXTM, SDA, SCL and IRQ are connected to microcontroller directly. (5) Use a low ESR capacitor for C4 (typ. 100μF) to reduce the voltage ripple. (6) The capacitor C6 of TCAP should not be less than 39nF to avoid inru ...
PAM2805 Description Pin Assignments
... The PAM2805 has a build-in low voltage startup circuit for the best battery life solution. It can start up at 0.9V VIN typically when the preset LED current is 200mA. The soft-start function is made by clamping the output voltage of error amplifier with another voltage source which increases slowly ...
... The PAM2805 has a build-in low voltage startup circuit for the best battery life solution. It can start up at 0.9V VIN typically when the preset LED current is 200mA. The soft-start function is made by clamping the output voltage of error amplifier with another voltage source which increases slowly ...
VSMY98145DS
... typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in ...
... typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in ...
PS9505,PS9505L1,PS9505L2,PS9505L3 Data Sheet Preliminary
... (If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the range of the recommended operating conditions, and be sure to thoroughly e ...
... (If the pattern needs to be close to the input block, to prevent the LED from lighting during the off state due to the abovementioned coupling, design the input-side circuit so that the bias of the LED is reversed, within the range of the recommended operating conditions, and be sure to thoroughly e ...
BD35390FJ
... IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of ...
... IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of ...
FJD5553 NPN Silicon Transistor — NPN Silicon T ransistor
... life, and (c) whose failure to perform when properly used in safety or effectiveness. accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counter ...
... life, and (c) whose failure to perform when properly used in safety or effectiveness. accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counter ...
PS9905 Data Sheet R08DS0058EJ0100
... (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT output side might ...
... (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too close to the input block pattern of the photocoupler. If the pattern is too close to the input block and coupling occurs, a sudden fluctuation in the voltage on the IGBT output side might ...
Differential Amplifiers (Chapter 8 in Horenstein)
... • Non-zero slope in normal active region is caused by base width narrowing due to increase in V CB reverse bias and corresponding increase in C-B depletion region (Early Effect named after Jim Early) ...
... • Non-zero slope in normal active region is caused by base width narrowing due to increase in V CB reverse bias and corresponding increase in C-B depletion region (Early Effect named after Jim Early) ...
data sheet
... The temperature coefficient of resistance is a ratio which indicates the rate of increase (decrease) of resistance per degree (°C) increase (decrease) of temperature within a specified range, and is expressed in parts per million per °C (ppm/°C). ...
... The temperature coefficient of resistance is a ratio which indicates the rate of increase (decrease) of resistance per degree (°C) increase (decrease) of temperature within a specified range, and is expressed in parts per million per °C (ppm/°C). ...
Thermal runaway
Thermal runaway refers to a situation where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback.In other words, ""thermal runaway"" describes a process which is accelerated by increased temperature, in turn releasing energy that further increases temperature. In chemistry (and chemical engineering), this risk is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation, although exothermic chemical reactions can be of concern here too. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar mass stars, the ""helium flash"".There are also concerns regarding global warming that a global average increase of 3-4 degrees Celsius above the preindustrial baseline could lead to a further unchecked increase in surface temperatures. For example, releases of methane, a greenhouse gas more potent than CO2, from wetlands, melting permafrost and continental margin seabed clathrate deposits could be subject to positive feedback.