Download VSMY98145DS

VSMY98145DS
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Vishay Semiconductors
High Power Infrared Emitting Diode, 810 nm,
Surface Emitter Technology
FEATURES
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DESCRIPTION
As part of the SurfLightTM portfolio, the VSMY98145DS is
an infrared, 810 nm emitting diode based on surface
emitter technology with high radiant power and high speed,
molded in low thermal resistance SMD package with lens. A
42 mil chip provides outstanding radiant intensity and
allows DC operation of the device up to 1 A. Superior
ESD characteristics are ensured by an integrated Zener
diode.
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Package type: surface mount
Double stack technology
Package form: high power QFN with lens
Dimensions (L x W x H in mm): 3.85 x 3.85 x 2.24
Peak wavelength: λp = 810 nm
Zener diode for ESD protection up to 2 kV
High radiant power
High radiant intensity
Angle of half intensity: ϕ = ± 45°
Designed for high drive currents: up to 1 A (DC) and up to
5 A pulses
Low thermal resistance: RthJA = 10 K/W
Floor life: 168 h, MSL 3, according to J-STD-020
Lead (Pb)-free reflow soldering
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Infrared illumination for CMOS cameras (CCTV)
• Iris scan
• Machine vision
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
ϕ (deg)
λp (nm)
tr (ns)
VSMY98145DS
500
± 45
810
30
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMY98145DS
Tape and reel
MOQ: 600 pcs, 600 pcs/reel
High power with lens
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
SYMBOL
VALUE
Reverse voltage
VR
5
V
Forward current
IF
1
A
Surge forward current
TEST CONDITION
tp = 10 μs
Power dissipation
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction / pin
Rev. 1.0, 17-May-16
UNIT
IFSM
5
A
PV
3.8
W
Tj
115
°C
Tamb
-40 to +85
°C
°C
Tstg
-55 to +100
According to fig. 7, J-STD-20
Tsd
260
°C
JESD51
RthJP
10
K/W
Document Number: 84368
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY98145DS
www.vishay.com
Vishay Semiconductors
4.0
1.0
IF - Forward Current (A)
PV - Power Dissipation (W)
3.5
3.0
RthJA = 10 K/W
2.5
2.0
1.5
1.0
0.8
RthJA = 10 K/W
0.6
0.4
0.2
0.5
0
0
0
20
40
60
80
100
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
IF = 1 A, tp = 100 μs
VF
-
3.3
3.8
V
IF = 2 A, tp = 100 μs
VF
-
3.5
-
V
VR = 5 V
IR
-
-
10
μA
IF = 1 A, tp = 100 μs
Ie
350
500
-
mW/sr
IF = 2 A, tp = 100 μs
Ie
-
950
-
mW/sr
IF = 1 A, tp = 20 ms
φe
-
1000
-
mW
ϕ
-
± 45
-
deg
Peak wavelength
IF = 1 A
λp
-
810
-
nm
Spectral bandwidth
IF = 1 A
Δλ
-
50
-
nm
Rise time
IF = 1 A
tr
-
30
-
ns
Fall time
IF = 1 A
tf
-
30
-
ns
Forward voltage
Reverse current
Radiant intensity
Radiant power
Angle of half intensity
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
Ie - Radiant Intensity (mW/sr)
IF - Forward Current (A)
10
tp = 100 μs
1
0.1
tp = 100 μs
100
10
2.0
3.0
4.0
VF - Forward Voltage (V)
Fig. 3 - Forward Current vs. Forward Voltage
Rev. 1.0, 17-May-16
100
1000
IF - Forward Current (mA)
Fig. 4 - Radiant Intensity vs. Forward Current
Document Number: 84368
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY98145DS
www.vishay.com
Vishay Semiconductors
10°
20°
IF = 1.0 A
90
80
70
60
50
40
30
20
10
0
700
750
800
850
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
900
80°
0.6
0.4
0.2
ϕ - Angular Displacement
Ie, rel - Relative Radiant Intensity
Ie, rel - Relative Radiant Intensity (%)
0°
100
0
λ - Wavelength (nm)
Fig. 5 - Relative Radiant Intensity vs. Wavelength
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
TAPING DIMENSIONS in millimeters
Ø 60.0 ± 1.0
(2.36 ± 0.039)
Ø 178 ± 2.0
(7.0 ± 0.08)
Ø 13.0
(0.512)
typ.
14.40 (0.57) typ.
Notes
• Empty component pockets sealed with top cover tape.
• 7 inch reel - 600 pieces per reel.
• The maximum number of consecutive missing lamps is two.
• In accordance with ANSI / EIA 481-1-A-1994 specifications.
8.00 ± 0.10
4.00 ± 0.10
2.00 ± 0.05
Cathode
Ø 1.50 + 0.10
1.75 ± 0.10
12.00 +- 0.30
0.10
5.50 ± 0.05
Ø 1.50 + 0.25
Rev. 1.0, 17-May-16
Document Number: 84368
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY98145DS
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
1.90
Cathode
3.85 ± 0.1
.76
2.70
Ø2
Anode
1.00
3.85 ± 0.1
2.80
8
.3
R0
2.24 ± 0.1
0.15 ± 0.05
0.40 ± 0.05
R1
.1
5
Notes
• Tolerance is ± 0.10 mm (0.004") unless otherwise noted.
• Specifications are subject to change without notice.
1.0
2.8
0.5
2.8
Rev. 1.0, 17-May-16
Document Number: 84368
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY98145DS
www.vishay.com
Vishay Semiconductors
SOLDER PROFILE
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Temperature
10 s max.
217 °C
200 °C
FLOOR LIFE
255 °C to 260 °C
3 °C/s max.
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
6 °C/s max.
150 °C
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
3 °C/s max.
Moisture sensitivity level 3, according to J-STD-020B
60 s to 120 s
60 s max.
Time
Fig. 7 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
Rev. 1.0, 17-May-16
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Document Number: 84368
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Vishay
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Revision: 08-Feb-17
1
Document Number: 91000