MAX1668/MAX1805/MAX1989 Multichannel Remote/Local Temperature Sensors ________________General Description
... Temperature accuracy depends on having a good-quality, diode-connected small-signal transistor. Accuracy has been experimentally verified for all of the devices listed in Table 1. The MAX1668/MAX1805/MAX1989 can also directly measure the die temperature of CPUs and other ICs having on-board temperat ...
... Temperature accuracy depends on having a good-quality, diode-connected small-signal transistor. Accuracy has been experimentally verified for all of the devices listed in Table 1. The MAX1668/MAX1805/MAX1989 can also directly measure the die temperature of CPUs and other ICs having on-board temperat ...
TPS65262-1 - Texas Instruments
... range encompasses the most intermediate bus voltage operating off 5-V, 9-V, 12-V, or 15-V power bus. The converter, with constant frequency peak current mode, is designed to simplify its application while giving designers options to optimize the system according to targeted applications. The device ...
... range encompasses the most intermediate bus voltage operating off 5-V, 9-V, 12-V, or 15-V power bus. The converter, with constant frequency peak current mode, is designed to simplify its application while giving designers options to optimize the system according to targeted applications. The device ...
LM4559F
... Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circu ...
... Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable temperature that the IC can accept is limited. This depends on the circu ...
PDF: 1.54MB
... (2) Temperature protection function of both DIP Ver.5 and DIP Ver.6 is selectable from two functions. (They have different model numbers.) One is conventional over temperature protection (OT), and the other is LVIC temperature output function (VOT). OT function shutdowns all N-side IGBTs automatical ...
... (2) Temperature protection function of both DIP Ver.5 and DIP Ver.6 is selectable from two functions. (They have different model numbers.) One is conventional over temperature protection (OT), and the other is LVIC temperature output function (VOT). OT function shutdowns all N-side IGBTs automatical ...
LT1970A - 500mA Power Op Amp with Adjustable Precision Current Limit
... –IN (Pin 8): Inverting Input of Amplifier. –IN may be any voltage from VEE – 0.3V to VEE + 36V. –IN and +IN remain high impedance at all times to prevent current flow into the inputs when current limit mode is active. Care must be taken to ensure that –IN or +IN can never go to a voltage below VEE – ...
... –IN (Pin 8): Inverting Input of Amplifier. –IN may be any voltage from VEE – 0.3V to VEE + 36V. –IN and +IN remain high impedance at all times to prevent current flow into the inputs when current limit mode is active. Care must be taken to ensure that –IN or +IN can never go to a voltage below VEE – ...
REF3112 数据资料 dataSheet 下载
... REF31xx to momentarily draw currents greater than the typical quiescent current. This can be prevented by using a power supply with a fast rising edge and low output impedance. ...
... REF31xx to momentarily draw currents greater than the typical quiescent current. This can be prevented by using a power supply with a fast rising edge and low output impedance. ...
PS9306L,PS9306L2 Data Sheet Preliminary
... (1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too ...
... (1) By-pass capacitor of more than 0.1 μF is used between VCC and GND near device. Also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) When designing the printed wiring board, ensure that the pattern of the IGBT collectors/emitters is not too ...
BC847BLP Features Mechanical Data
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
Novel Low-Temperature Polycrystalline
... Figure 1. LTPS LDMOS structure fabricated by excimer laser crystallization under room temperature or 400°C irradiation. The broken circles represented the RESURF design and the solid circles indicated the drift with/ without doping for reducing the resistance of drift region in LTPS LDMOS and OD TFT ...
... Figure 1. LTPS LDMOS structure fabricated by excimer laser crystallization under room temperature or 400°C irradiation. The broken circles represented the RESURF design and the solid circles indicated the drift with/ without doping for reducing the resistance of drift region in LTPS LDMOS and OD TFT ...
BC857BLP Features Mechanical Data
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
... written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instruct ...
Thermal runaway
Thermal runaway refers to a situation where an increase in temperature changes the conditions in a way that causes a further increase in temperature, often leading to a destructive result. It is a kind of uncontrolled positive feedback.In other words, ""thermal runaway"" describes a process which is accelerated by increased temperature, in turn releasing energy that further increases temperature. In chemistry (and chemical engineering), this risk is associated with strongly exothermic reactions that are accelerated by temperature rise. In electrical engineering, thermal runaway is typically associated with increased current flow and power dissipation, although exothermic chemical reactions can be of concern here too. Thermal runaway can occur in civil engineering, notably when the heat released by large amounts of curing concrete is not controlled. In astrophysics, runaway nuclear fusion reactions in stars can lead to nova and several types of supernova explosions, and also occur as a less dramatic event in the normal evolution of solar mass stars, the ""helium flash"".There are also concerns regarding global warming that a global average increase of 3-4 degrees Celsius above the preindustrial baseline could lead to a further unchecked increase in surface temperatures. For example, releases of methane, a greenhouse gas more potent than CO2, from wetlands, melting permafrost and continental margin seabed clathrate deposits could be subject to positive feedback.